NCV330MUTBG [ONSEMI]
受控负载开关，软启动，3.0 A;
| 型号： | NCV330MUTBG |
| 厂家： | 
ONSEMI |
| 描述： | 受控负载开关，软启动，3.0 A 开关 软启动 光电二极管 |
| 文件： | 总9页 (文件大小：249K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP330
Soft-Start Controlled Load
Switch
The NCP330 is a low Ron N−channel MOSFET controlled by a
soft−start sequence of 2 ms for mobile applications.
The very low R
allows system supplying or battery charging
DS(on)
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MARKING
up to DC 3A.The device is enable automatically if a Power Supply is
connected on Vin pin (active High) and maintained off if no Vin
(internal pull down).
Due to a current consumption optimization, leakage current is
drastically decreased from the battery connected to the device,
allowing long battery life.
DIAGRAM
1
3A M
UDFN4
CASE 517CE
Features
• 1.8 V − 5.5 V Operating Range
• 30 mW N−MOSFET
3A = Specific Device Code
M
= Date Code
• DC Current Up to 3 A
• Peak Current Up to 5 A
• Built−in Soft−Start 2 ms
• Reverse Voltage Protection
• Active High with Integrated Bridge
PINOUT
IN
OUT
EN
• Compliance to IEC61000−4−2 (Level 4)
8.0 kV (Contact)
15 kV (Air)
• ESD Ratings: Machine Model = B
Human Body Model = 3
PAD1
GND
• mDFN4 1.2 x 1.6 mm
• This is a Pb−Free Device
(Top View)
Typical Applications
• Mobile Phones
• Tablets
ORDERING INFORMATION
See detailed ordering and shipping information on page 8 of
this data sheet.
• Digital Cameras
• GPS
• Computers
Vbat
OUT
NCP330
IN
1 mF
EN
4
1 mF
EN
GND
VBUS
D+
D−
CMIC
SBC Charger
IN
OUT
SYSTEM
USB
Port
Supply
Monitoring
HS
USB
GND
Signal
Routing
I@C
Accessory
Detection and ID
Figure 1. Typical Application Circuit
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
June, 2012 − Rev. 1
NCP330/D
NCP330
PIN FUNCTION DESCRIPTION
Pin
Number
Pin Name
Type
Description
IN
1
POWER
Power−switch input voltage; connect a 1 mF or greater ceramic capacitor from IN to GND as
close as possible to the IC.
GND
EN
2
3
4
POWER
INPUT
Ground connection;
Enable input, logic high turns on power switch.
OUT
OUTPUT
Power−switch output; connect a 1 mF ceramic capacitor from OUT to GND as close as pos-
sible to the IC is recommended.
PAD1
POWER
Exposed pad can be connected to GND plane for dissipation purpose or any other thermal
plane.
BLOCK DIAGRAM
IN: Pin1
1 mF
OUT: Pin 4
Gate driver and soft
start control
Battery
VREF
Charge
Pump
EN: 3
EN block
2
Figure 2. Block Diagram
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2
NCP330
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
V
IN, OUT, EN, Pins:
V
V
V
−0.3 to + 7.0
−7.0 to + 7.0
15 Air, 8 contact
EN , IN , OUT
From IN to OUT Pins: Input/Output
V
V
V
IN , OUT
ESD Withstand Voltage (IEC 61000−4−2) (Note 1)
(IN and OUT when bypassed with 1.0 mF capacitor minimum)
ESD IEC
kV
Human Body Model (HBM) ESD Rating are (Notes 2 and 3)
Machine Model (MM) ESD Rating are (Notes 2 and 3)
ESD HBM
ESD MM
4000
200
V
V
Latch−up protection (Note 4)
− Pins IN, OUT, EN
mA
LU
100
Maximum Junction Temperature Range
Storage Temperature Range
T
−40 to + 125
−40 to + 150
Level 1
°C
°C
J
T
STG
Moisture Sensitivity (Note 5)
MSL
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Guaranteed by design.
2. According to JEDEC standard JESD22−A108.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) 2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) 200 V per JEDEC standard: JESD22−A115 for all pins.
4. Latch up Current Maximum Rating: 100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min
1.8
0
Typ
Max
5.5
Unit
V
IN
Operational Power Supply
Enable Voltage
V
V
EN
5.5
T
Ambient Temperature Range
Junction Temperature Range
Decoupling input capacitor
Decoupling output capacitor
Thermal Resistance Junction to Air
Maximum DC current
− 40
− 40
1
25
25
+ 85
+ 125
°C
°C
mF
mF
°C/W
A
A
T
J
C
IN
C
USB port per Hub
UDFN−4 package (Note 6)
UDFN−4 package
1
OUT
R
170
q
JA
I
3
5
OUT
I peak
Maximum Peak current
1 ms at 217 Hz (GSM calibration)
A
P
D
Power Dissipation Rating (Note 7)
T
≤ 25°C
UDFN−4 package
UDFN−4 package
0.58
W
A
T = 85°C
A
0.225
6. The R
is dependent of the PCB heat dissipation.
q
JA
7. The maximum power dissipation (P ) is given by the following formula:
D
T
JMAX * TA
PD
+
RqJA
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3
NCP330
ELECTRICAL CHARACTERISTICS Min & Max Limits apply for T between −40°C to +85°C and T up to + 125 °C for between
VIN
A
J
1.8 V to 5.5 V (Unless otherwise noted). Typical values are referenced to T = + 25 °C and
= 5 V.
A
VIN
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
POWER SWITCH
V
= 3 V,
= 5 V
T = 25°C
26
mW
IN
IN
J
Static drain−source on−state
R
V
DS(on)
resistance
−40°C < T < 125°C
50
4
J
T
R
Output rise time
Output fall time
Gate turn on
V
= 5 V
= 5 V
= 5 V
= 3 V
C
LOAD
= 1 mF,
LOAD
= 125 W (Note 8)
0.5
0.5
2
4
2
ms
ms
ms
IN
R
T
F
V
V
V
C
= 100 mF,
LOAD
IN
IN
IN
R
= 40 W (Note 8)
LOAD
T
on
From Vin applied to V
10% of fully on
=
=
4
3
OUT
From Vin applied to V
10% of fully on (Note 9)
OUT
ENABLE INPUT EN
V
High−level input voltage
Low−level input voltage
En pull−down resistor
En pull−up resistor
1.15
V
IH
V
0.85
V
IL
R
R
1
MW
MW
pd
pu
1.5
REVERSE−LEAKAGE PROTECTION
Reverse−current protection
QUIESCENT CURRENT
I
V
IN
= 0 V, V = 4.2 V (part disable), T = 25°C
0.15
100
1
mA
mA
REV
out
J
Iq
Current consumption
No load
200
8. Parameters are guaranteed for C
9. Guaranteed by characterization.
and R
connected to the OUT pin with respect to the ground.
LOAD
LOAD
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4
NCP330
TYPICAL CHARACTERISTICS
140
120
100
80
0.35
T = 85°C
A
0.30
0.25
0.20
0.15
0.10
T = 25°C
A
T = 85°C
A
T = −40°C
A
60
T = −40°C
A
40
20
0
0.05
0
T = 25°C
A
1.5 2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
1.5 2.0
2.5
3.0
3.5
4.0
4.5
5.0 5.5
V
IN
, INPUT VOLTAGE (V)
V , OUTPUT VOLTAGE (V)
OUT
Figure 3. Supply Current vs. Voltage
Figure 4. Reverse Current vs. Output Voltage
50
45
40
35
30
50
45
40
35
30
I
I
= 2 A
= 1 A
OUT
OUT
I
= 3 A
OUT
I
= 0.5 A
OUT
I
= 3 A
= 2 A
OUT
I
OUT
OUT
I
= 1 A
I
= 0.5 A
5.4
OUT
25
20
25
20
1.8
3.0
4.2
, INPUT VOLTAGE (V)
1.8
3.0
4.2
V , INPUT VOLTAGE (V)
IN
5.4
V
IN
Figure 5. RDS(on) vs. VIN Voltage at 255C
Figure 6. RDS(on) vs. VIN Voltage at 855C
50
45
40
35
30
50
45
40
35
30
V
= 1.8 V
IN
V
IN
= 3.0 V
= 5.5 V
V
IN
I
= 2 A
= 1 A
OUT
I
= 3 A
OUT
V
IN
= 5.0 V
0.5
25
20
25
20
I
= 0.5 A
OUT
I
OUT
1.8
3.0
V
4.2
, INPUT VOLTAGE (V)
5.4
0
1.0
1.5
2.0
2.5
3.0
3.5
I
, OUTPUT CURRENT (A)
OUT
IN
Figure 7. RDS(on) vs. VIN Voltage at −405C
Figure 8. RDS(on) vs. IOUT at 255C
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5
NCP330
TYPICAL CHARACTERISTICS
50
45
40
35
30
90
80
70
60
50
40
V
= 3.0 V
= 5.5 V
IN
V
IN
V
IN
= 5.0 V
30
20
25
20
10
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
0.5
1.0
1.5
2.0
2.5
3.0
I , OUTPUT CURRENT (A)
OUT
I , OUTPUT CURRENT (A)
OUT
Figure 9. RDS(on) vs. IOUT at 855C
Figure 10. Junction Temperature vs. IOUT
Figure 12. TON Time on 75 mA Load
Figure 14. TON Time on 800 mA Load
1.02
1.01
1.00
V
IH
vs. V
IN
V
IL
vs. V
IN
0.99
0.98
0.97
0.96
0.95
0.94
0
1
2
3
4
5
6
V
IN
, INPUT VOLTAGE (V)
Figure 11. Logic Threshold vs. VIN
Figure 13. TOFF Time on 75 mA Load
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6
NCP330
TYPICAL CHARACTERISTICS
Figure 15. TOFF Time on 800 mA Load
Figure 16. TON Time on 2 A Load
Figure 17. TOFF Time on 2.3 A Load
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NCP330
FUNCTIONAL DESCRIPTION
Blocking Control
Overview
The NCP330 is a high side N−channel MOSFET power
distribution switch designed to connect external voltage
directly to the system. The high side MOSFET is
automatically turned on if the Vin voltage is applied thanks
to internal pull up connected between Vin and EN pin. The
turned off is obtained by Vin removal. Due to the soft start
circuitry, NCP330 is able to limit large voltage surges.
The blocking control circuitry switches the bulk of the
power NMOS. When the part is off (No V or EN tied to
IN
GND externally) , the body diode limits the leakage current
I
from OUT to IN. In this mode, anode of the body diode
REV
is connected to IN pin and cathode is connected to OUT pin.
In operating condition, anode of the body diode is connected
to OUT pin and cathode is connected to IN pin preventing
the discharge of the power supply.
Enable input
Enable pin is an active high. The part is off when Vin is not
present, limiting current consumption from battery to OUT
pin.
Cin Capacitor
A IN capacitor, 1 mF, at least, capacitor must be placed as
close as possible the part to be Compliant with
IEC61000−4−2(Level 4).
In the other side, the part is automatically turned on when
V
IN
is applied.
Cout Capacitor
Depending on the sinking current during system start up
and system turn off, a capacitor must be placed on the output.
A 1 mF is strongly recommended but can be decreased down
to 100 nF if the above two sequences are well controlled and
parasitic inductance connected on the Vout line is negligible.
APPLICATION INFORMATION
Power Dissipation
PCB Recommendations
The device’s junction temperature depends on different
contributor factor such as board layout, ambient
temperature, device environment, etc... Yet, the main
contributor in term of junction temperature is the power
dissipation of the power MOSFET. Assuming this, the
power dissipation and the junction temperature in normal
mode can be calculated with the following equations:
The NCP330 integrates an up to 3 A rated NMOS FET,
and the PCB design rules must be respected to properly
evacuate the heat out of the silicon. The mDFN4 PAD1 must
be connected to ground plane to increase the heat transfer if
necessary. By increasing PCB area, the R
of the package
qJA
can be decreased, allowing higher power dissipation.
ǒ
Ǔ2
P
D + RDS(on) IOUT
P
= Power dissipation (W)
= Power MOSFET on resistance (W)
= Output current (A)
D
R
DS(on)
OUT
I
TJ + PD RqJA ) TA
T
= Junction temperature (°C
J
R
T
= Package thermal resistance (°C/W)
= Ambient temperature (°C)
qJA
A
ORDERING INFORMATION
Device
†
Marking
Package
Shipping
NCP330MUTBG
3A
mDFN4, 1.2x1.6 mm
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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8
NCP330
PACKAGE DIMENSIONS
UDFN4 1.2x1.6, 0.5P
CASE 517CE
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
L
L
A
B
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
L1
PIN ONE
REFERENCE
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
MILLIMETERS
2X
0.05
C
DIM MIN
0.45
A1 0.00
NOM MAX
A
0.50
−−−
0.55
0.05
0.05
C
2X
EXPOSED Cu
MOLD CMPD
A3
b
0.13 REF
0.30
1.20 BSC
0.86
1.60 BSC
0.50
TOP VIEW
0.25
0.35
0.96
0.60
D
(A3)
DETAIL B
D2 0.76
E
E2 0.40
A
C
0.05
0.05
C
C
DETAIL B
ALTERNATE
e
L
0.50 BSC
0.30
−−−
CONSTRUCTION
0.20
0.40
0.15
L1
−−−
SEATING
PLANE
A1
SIDE VIEW
D2
RECOMMENDED
MOUNTING FOOTPRINT*
DETAIL A
4X b
0.86
1
2
4X
M
0.05
C A B
0.25
PACKAGE
OUTLINE
NOTE 3
E2
4
3
1.90
e
4X L
e/2
0.50
BOTTOM VIEW
1
4X
0.45
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Email: orderlit@onsemi.com
For additional information, please contact your local
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NCP330/D
相关型号：
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