NE5534ADR2G [ONSEMI]
Single Low Noise Operational Amplifier; 单一的低噪声运算放大器
| 型号： | NE5534ADR2G |
| 厂家： | 
ONSEMI |
| 描述： | Single Low Noise Operational Amplifier |
| 文件： | 总10页 (文件大小：166K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NE5534, SA5534, SE5534,
NE5534A, SA5534A,
SE5534A
Single Low Noise
Operational Amplifier
http://onsemi.com
The NE/SA/SE5534/5534A are single high-performance low noise
operational amplifiers. Compared to other operational amplifiers,
such as TL083, they show better noise performance, improved output
drive capability, and considerably higher small-signal and power
bandwidths.
SOIC−8
D SUFFIX
CASE 751
8
1
This makes the devices especially suitable for application in high
quality and professional audio equipment, in instrumentation and
control circuits and telephone channel amplifiers. The op amps are
internally compensated for gain equal to, or higher than, three. The
frequency response can be optimized with an external compensation
capacitor for various applications (unity gain amplifier, capacitive
load, slew rate, low overshoot, etc.).
PDIP−8
N SUFFIX
CASE 626
8
1
Features
• Small-Signal Bandwidth: 10 MHz
PIN CONNECTIONS
• Output Drive Capability: 600 W, 10 V
at V = "18 V
S
RMS
D, N Packages
Ǹ
• Input Noise Voltage: 4 nVń Hz
BALANCE/
BALANCE
INVERTING INPUT
NON-INVERTING
V−
1
2
8
7
COMPENSATION
• DC Voltage Gain: 100000
• AC Voltage Gain: 6000 at 10 kHz
• Power Bandwidth: 200 kHz
• Slew Rate: 13 V/ms
V+
OUTPUT
COMPENSATION
3
4
6
5
Top View
• Large Supply Voltage Range: "3.0 to "20 V
• Pb−Free Packages are Available
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 8 of this data sheet.
Applications
• Audio Equipment
• Instrumentation and Control Circuits
• Telephone Channel Amplifiers
• Medical Equipment
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
March, 2006 − Rev. 2
NE5534/D
NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A
8
1
5
7
2
3
6
4
Figure 1. Equivalent Schematic
MAXIMUM RATINGS
Rating
Symbol
Value
"22
Unit
V
Supply Voltage
Input Voltage
V
S
V
"V Supply
"0.5
V
IN
Differential Input Voltage (Note 1)
V
DIFF
V
Operating Temperature Range
T
amb
°C
NE
SA
SE
0 to +70
−40 to +85
−55 to +125
Storage Temperature Range
Junction Temperature
T
−65 to +150
°C
°C
stg
T
150
j
Power Dissipation at 25°C
P
D
mW
N Package
D Package
1150
750
Thermal Resistance, Junction−to−Ambient
R
q
JA
°C/W
N Package
D Package
130
158
Output Short-Circuit Duration (Note 2)
−
Indefinite
230
−
Lead Soldering Temperature (10 sec max)
T
sld
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
RecommendedOperating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input
voltage exceeds 0.6 V. Maximum current should be limited to "10 mA.
2. Output may be shorted to ground at V = "15 V, T
= 25°C. Temperature and/or supply voltages must be limited to ensure dissipation rating
S
amb
is not exceeded.
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2
NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A
DC ELECTRICAL CHARACTERISTICS (T
= 25°C; V = "15 V, unless otherwise noted.) (Notes 3, 4 and 5)
S
amb
NE/SA5534/5534A
SE5534/5534A
Min
Typ
0.5
−
Max
Min
−
Typ
0.5
−
Max
2.0
3.0
−
Characteristic
Symbol
Test Conditions
Unit
mV
V
OS
−
−
−
−
−
−
−
−
−
4.0
5.0
−
Offset Voltage
Overtemperature
Overtemperature
−
mV
DV /DT
5.0
20
−
−
5.0
10
−
mV/°C
nA
OS
I
300
400
−
−
200
500
−
OS
Offset Current
Input Current
−
nA
DI /DT
OS
200
500
−
−
200
400
−
pA/°C
nA
I
B
1500
2000
−
−
800
1500
−
Overtemperature
Overtemperature
−
nA
DI /DT
B
5.0
−
5.0
nA/°C
mA
Supply Current
Per Op Amp
I
−
−
4.0
−
8.0
10
−
−
4.0
−
6.5
9.0
CC
Common Mode Input Range
Common Mode Rejection Ratio
Power Supply Rejection Ratio
V
"12
70
−
"13
100
10
−
−
100
"12
80
−
"13
100
10
−
−
50
V
dB
mV/V
CM
CMRR
PSRR
Large-Signal Voltage Gain
A
R ≥ 600 W,
O
Overtemperature
25
100
−
50
100
−
V/mV
VOL
L
V
= "10 V
15
−
−
−
25
−
−
−
Output Swing
V
OUT
R w 600 W
L
"12
"13
"12
"13
V
Overtemperature
"10
"15
"12
"16
−
−
"10
"15
"12
16
−
−
R w 600 W;
L
S
V
= "18 V
R w 2.0 kW
Overtemperature
"13
"12
"13.5
"12.5
−
−
"13
"12
"13.5
"12.5
−
−
L
Input Resistance
R
30
100
38
−
−
50
100
38
−
−
kW
IN
Output Short Circuit Current
I
−
−
mA
SC
3. For NE5534/5534A, T
4. For SA5534/5534A, T
5. For SE5534/5534A, T
= 0°C, T
= 70°C.
MIN
MIN
MIN
MAX
= −40°C, T
= −55°C, T
= +85°C.
MAX
MAX
= +125°C.
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3
NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A
AC ELECTRICAL CHARACTERISTICS (T
= 25°C; V = "15 V, unless otherwise noted.)
amb
S
NE/SA5534/5534A
SE5534/5534A
Min
Typ
Max
Min
Typ
Max
Characteristic
Output Resistance
Symbol
Test Conditions
Unit
R
OUT
A = 30 dB
V
−
0.3
−
−
0.3
−
W
closed-loop
f = 10 kHz;
R = 600 W;
L
C
C
= 22 pF
Transient Response
Voltage-follower,
= 50 mV
V
IN
R = 600 W,
L
C
C
= 22 pF,
C = 100 pF
L
Rise Time
t
−
−
20
20
−
−
−
−
20
20
−
−
ns
%
R
Overshoot
−
Transient Response
V
= 50 mV,
IN
L
C
L
R = 600 W,
C
= 47 pF,
C = 500 pF
Rise Time
Overshoot
Gain
t
−
−
50
35
−
−
−
−
50
35
−
−
ns
%
R
−
A
f = 10 kHz, C = 0
−
−
6.0
2.2
−
−
−
−
6.0
2.2
−
−
V/mV
V
C
f = 10 kHz,
C
C
= 22 pF
Gain Bandwidth Product
Slew Rate
GBW
SR
−
C
L
= 22 pF,
−
10
−
−
10
−
MHz
V/ms
kHz
C
C = 100 pF
C
C
= 0
−
−
13
6.0
−
−
−
−
13
6.0
−
−
C
= 22 pF
C
Power Bandwidth
V
V
V
= "10 V,
−
−
−
200
95
−
−
−
−
−
−
200
95
−
−
−
OUT
C
= 0 pF
C
= "10 V,
= 22 pF
= "14 V,
OUT
C
C
70
70
OUT
R = 600 W,
L
C
C
= 22 pF,
= "18 V
V
CC
ELECTRICAL CHARACTERISTICS (T
= 25°C; V = 15 V, unless otherwise noted.)
amb
S
NE/SA/SE5534
NE/SA/SE5534A
Min
Typ
Max
Min
Typ
Max
Characteristic
Symbol
Test Conditions
Unit
Input Noise Voltage
V
NOISE
f
O
= 30 Hz
−
−
7.0
4.0
−
−
−
−
5.5
3.5
7.0
4.5
nV/√Hz
O
f
= 1.0 kHz
Input Noise Current
I
f
O
= 30 Hz
−
−
2.5
0.6
−
−
−
−
1.5
0.4
−
−
pA/√Hz
NOISE
O
f
= 1.0 kHz
Broadband Noise Figure
−
f = 10 Hz to
20 kHz;
S
−
−
−
−
0.9
−
dB
R
= 5.0 kW
Channel Separation
−
f = 1.0 kHz;
= 5.0 kW
−
110
−
−
110
−
dB
R
S
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4
NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A
TYPICAL PERFORMANCE CHARACTERISTICS
120
80
40
0
16
12
8
60
40
20
0
TYPICAL VALUES
TYPICAL VALUES
= 0; RF = 10kW; RE = 100W
V
= +15V
C
C
S
C
C
C
= 0
5
C
8
C
= 0; RF = 9kW; RE = 1kW
= 22pF; RF = 1kW; RE = ∞
C
= 22pF
C
C
C
S
(V/ms)
TYP
C
4
0
-40
-20
10
2
3
4
5
6
7
10
3
4
5
6
7
8
10
10
10
10
10
f (Hz)
10
10
0
40
80
10
10
10
f (Hz)
10
C
(pF)
C
Figure 2. Open-Loop
Frequency Response
Figure 3. Slew Rate as a
Function of Compensation
Capacitance
Figure 4. Closed−Loop
Frequency Response
1,4
1,2
0,8
0,4
0
80
40
30
20
10
0
V
= +15V
S
V
= +15V
V
= +15V
S
S
TYPICAL VALUES
60
40
20
0
C
0pF
=
C
I
I
(V)
Vo(p-p)
O
I
22pF
47pF
TYP
(mA)
(mA)
TYP
-55 -25
0
25
75 100 +125
50
-55 -25
0
25 50
o
75 100 +125
2
3
4
5
6
7
10
10
10
10
10
f (Hz)
10
o
( C)
amb
T
( C)
T
amb
Figure 5. Large−Signal
Frequency Response
Figure 6. Output
Short−Circuit Current
Figure 7. Input Bias
Current
30
20
6
4
2
0
2
I
= 0
TYPICAL VALUES
NEG
10
O
TYP
10
1
TYP
I
I
P
N
V
(V)
10
IN
Ǹ
(nVń Hz)
POS
(mA)
−1
10
10
−2
0
2
3
4
10
10
10
10
0
10
20
0
10
Vp; -V (V)
20
f (Hz)
Vp; -V (V)
N
N
Figure 8. Input Common−Mode
Figure 9. Supply Current
Per Op Amp
Figure 10. Input Noise
Voltage Density
Voltage Range
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5
NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A
TYPICAL PERFORMANCE CHARACTERISTICS
6
5
4
3
2
2
10
10
TYPICAL VALUES
10Hz
TYPICAL VALUES
10Hz TO 20kHz
2
10
10
10
10
1
10
Vn(rms) 10
Ǹ
1kHz
Vn(rms)
(nVń Hz)
In(rms)
(pAń Hz)
10
(mV)
Ǹ
1
TYP
10
200Hz TO 4kHz
−1
−2
1
10
−1
−2
10
10
THERMAL NOISE
OF SOURCE
−1
10
10
RESISTANCE
−2
10
2
3
4
5
6
10
10
0
10
(W)
20
2
3
4
10
10
10
10
(W)
10
10
10
10
R
R
f (Hz)
S
S
Figure 11. Input Noise
Current Density
Figure 12. Total Input
Noise Density
Figure 13. Broadband Input
Noise Voltage
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6
NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A
TEST LOAD CIRCUITS
V+
C
C
22kW
100kW
8
2
+
5
C
C
5534
6
3
-
R
25W
S
1
R
8
F
2
-
5
7
6
600W
100pF
V
R
E
5534
I
+
4
3
V-
Figure 14. Frequency Compensation and
Offset Voltage Adjustment Circuit
Figure 15. Closed-Loop Frequency Response
CAL
OSC
POWER
SUPPLY
Ǹ
(nVń Hz)
CAL
METER
+V
-V
CC
CC
BANDPASS
AT 1kHz
+
DUT
1W
-
10kW
Ǹ
(nVń Hz)
+40dB
BANDPASS
AT 30Hz
100W
TEST BOARD
GND
Figure 16. Noise Test Block Diagram
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7
NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A
MARKING DIAGRAMS
8
1
8
1
8
NE5234xN
AWL
YYWWG
SA5234xN
AWL
YYWWG
SE5234xN
AWL
YYWWG
N5234
ALYWA
G
S5234
ALYWA
G
S5234
ALYW
G
1
SOIC−8
D SUFFIX
CASE 751
PDIP−8
N SUFFIX
CASE 626
x
A
= Blank or A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = Pb−Free Package
ORDERING INFORMATION
Device
†
Description
Temperature Range
Shipping
NE5534AD
8−Pin Plastic Small Outline (SO−8) Package
0 to +70°C
98 Units / Rail
98 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
50 Units / Rail
50 Units / Rail
98 Units / Rail
98 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
50 Units / Rail
50 Units / Rail
98 Units / Rail
98 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
50 Units / Rail
50 Units / Rail
50 Units / Rail
50 Units / Rail
50 Units / Rail
50 Units / Rail
50 Units / Rail
50 Units / Rail
NE5534ADG
NE5534ADR2
NE5534ADR2G
NE5534AN
NE5534ANG
NE5534D
8−Pin Plastic Small Outline (SO−8) Package (Pb−Free)
8−Pin Plastic Small Outline (SO−8) Package
0 to +70°C
0 to +70°C
8−Pin Plastic Small Outline (SO−8) Package (Pb−Free)
8−Pin Plastic Dual In−Line Package (PDIP−8)
0 to +70°C
0 to +70°C
8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free)
8−Pin Plastic Small Outline (SO−8) Package
0 to +70°C
0 to +70°C
NE5534DG
NE5534DR2
NE5534DR2G
NE5534N
8−Pin Plastic Small Outline (SO−8) Package (Pb−Free)
8−Pin Plastic Small Outline (SO−8) Package
0 to +70°C
0 to +70°C
8−Pin Plastic Small Outline (SO−8) Package (Pb−Free)
8−Pin Plastic Dual In−Line Package (PDIP−8)
0 to +70°C
0 to +70°C
NE5534NG
SA5534AD
SA5534ADG
SA5534ADR2
SA5534ADR2G
SA5534AN
SA5534ANG
SA5534N
8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free)
8−Pin Plastic Small Outline (SO−8) Package
0 to +70°C
−40 to +85°C
−40 to +85°C
−40 to +85°C
−40 to +85°C
−40 to +85°C
−40 to +85°C
−40 to +85°C
−40 to +85°C
−55 to +125°C
−55 to +125°C
−55 to +125°C
−55 to +125°C
8−Pin Plastic Small Outline (SO−8) Package (Pb−Free)
8−Pin Plastic Small Outline (SO−8) Package
8−Pin Plastic Small Outline (SO−8) Package (Pb−Free)
8−Pin Plastic Dual In−Line Package (PDIP−8)
8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free)
8−Pin Plastic Dual In−Line Package (PDIP−8)
SA5534NG
SE5534AN
SE5534ANG
SE5534N
8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free)
8−Pin Plastic Dual In−Line Package (PDIP−8)
8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free)
8−Pin Plastic Dual In−Line Package (PDIP−8)
SE5534NG
8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
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8
NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AG
NOTES:
1. DIMENSIONING AND TOLERANCING PER
−X−
ANSI Y14.5M, 1982.
A
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
K
M
N
S
4.80
3.80
1.35
0.33
5.00 0.189
4.00 0.150
1.75 0.053
0.51 0.013
C
N X 45
_
SEATING
PLANE
−Z−
1.27 BSC
0.050 BSC
0.10 (0.004)
0.10
0.19
0.40
0
0.25 0.004
0.25 0.007
1.27 0.016
0.010
0.010
0.050
8
0.020
0.244
M
J
H
D
8
0
_
_
_
_
0.25
5.80
0.50 0.010
6.20 0.228
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
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9
NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A
PACKAGE DIMENSIONS
8−Pin Plastic Dual In−Line Package (PDIP−8)
N SUFFIX
CASE 626−05
ISSUE L
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
8
5
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
−B−
MILLIMETERS
INCHES
MIN
1
4
DIM MIN
MAX
10.16
6.60
4.45
0.51
1.78
MAX
0.400
0.260
0.175
0.020
0.070
A
B
C
D
F
9.40
6.10
3.94
0.38
1.02
0.370
0.240
0.155
0.015
0.040
F
−A−
NOTE 2
L
G
H
J
2.54 BSC
0.100 BSC
0.76
0.20
2.92
1.27
0.30
3.43
0.030
0.008
0.115
0.050
0.012
0.135
K
L
C
7.62 BSC
0.300 BSC
M
N
−−−
0.76
10
_
1.01
−−−
0.030
10
0.040
_
J
−T−
SEATING
PLANE
N
M
D
K
G
H
M
M
M
B
0.13 (0.005)
T A
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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