NL17SG126DFT2G [ONSEMI]
Bus Buffer with 3-State Output;![NL17SG126DFT2G](http://pdffile.icpdf.com/pdf2/p00327/img/icpdf/NL17SG126_2013525_icpdf.jpg)
型号: | NL17SG126DFT2G |
厂家: | ![]() |
描述: | Bus Buffer with 3-State Output |
文件: | 总11页 (文件大小:127K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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NL17SG126
Bus Buffer with 3-State
Output
The NL17SG126 MiniGatet is an advanced high−speed CMOS
Bus Buffer with 3−State Output in ultra−small footprint.
The NL17SG126 input structures provides protection when
voltages up to 4.6 V are applied.
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Features
MARKING
DIAGRAMS
• Wide Operating V Range: 0.9 V to 3.6 V
CC
• High Speed: t = 2.3 ns (Typ) at V = 3.0 V, C = 15 pF
PD
CC
L
SOT−953
CASE 527AE
M
• Low Power Dissipation: I = 0.5 mA (Max) at T = 25°C
CC
A
1
• 4.6 V Overvoltage Tolerant (OVT) Input Pins
• Ultra−Small Packages
J
= Specific Device Code
(J with 90 degree clockwise rotation)
M
= Month Code
• These are Pb−Free and Halide−Free Devices
UDFN6
1.0 x 1.0
M
CASE 517BX
1
UDFN6
1.45 x 1.0
M
CASE 517AQ
1
V
IN A
1
2
5
4
V
CC
OE
IN A
1
2
3
5
4
CC
SC−88A
DF SUFFIX
CASE 419A
GND
A5 M G
G
GND
OUT Y
OUT Y
OE
3
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
Figure 1. SOT−953
(Top Thru View)
Figure 2. SC−88A
*Date Code orientation and/or position may vary
depending upon manufacturing location.
(Top View)
PIN ASSIGNMENT
V
CC
1
6
OE
SOT−953
IN A
SC−88A
OE
UDFN6
OE
1
2
3
4
5
6
5
4
A
2
3
NC
GND
IN A
IN A
OE
GND
GND
GND
OUT Y
OUT Y
OUT Y
OUT Y
NC
V
CC
V
CC
Figure 3. UDFN6
V
CC
(Top View)
FUNCTION TABLE
OE Input
A Input
Y Output
OE
IN A
EN
OUT Y
X
L
L
H
H
Z
L
Figure 4. Logic Symbol
H
H
ORDERING INFORMATION
See detailed ordering and shipping information on page 7 of
this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
July, 2014 − Rev. 5
NL17SG126/D
NL17SG126
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
CC
DC Supply Voltage
−0.5 to +5.5
−0.5 to +4.6
V
IN
DC Input Voltage
V
V
OUT
DC Output Voltage
−0.5 to V +0.5
V
CC
I
DC Input Diode Current
V
< GND
< GND
OUT
−20
mA
mA
mA
mA
mA
°C
IK
IN
I
DC Output Diode Current
DC Output Source/Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
V
−20
OK
I
20
OUT
I
20
CC
I
20
−65 to +150
260
GND
T
STG
T
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
°C
L
T
+150
°C
J
MSL
Level 1
F
R
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
>2000
>100
V
I
Latchup Performance
Above V and Below GND at 125°C (Note 4)
100
mA
LATCHUP
CC
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
0.9
0.0
Max
3.6
Unit
V
V
CC
Positive DC Supply Voltage
Digital Input Voltage
Output Voltage
V
IN
3.6
V
V
OUT
Output at High or Low State
Power−Down Mode (V = 0 V)
0.0
0.0
V
CC
V
3.6
+125
10
CC
T
A
Operating Temperature Range
Input Transition Rise or Fail Rate
−55
0
°C
Dt / DV
V
CC
= 3.3 V 0.3 V
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NL17SG126
DC ELECTRICAL CHARACTERISTICS
T
=
A
T
A
= 255C
−555C to +1255C
Min
Max
Min
Max
Unit
Symbol
Parameter
Conditions
V
CC
(V)
V
High−Level
Input
0.9
V
V
CC
V
IH
CC
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
0.7xV
0.7xV
CC
CC
Voltage
0.65xV
0.65xV
1.7
0.65xV
0.65xV
1.7
CC
CC
CC
CC
2.0
2.0
V
Low−Level Input
Voltage
GND
0.3xV
GND
V
IL
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
0.3xV
CC
CC
0.35xV
0.35xV
0.7
0.35xV
0.35xV
0.7
CC
CC
CC
CC
0.8
0.8
V
OH
High−Level
V
=
or
IL
0.75
0.75xV
0.75xV
0.75
0.75xV
0.75xV
V
I
= −20 mA
IN
OH
V
IH
Output Voltage
I
I
I
= −0.3 mA
= −1.7 mA
= −3.0 mA
1.1 to 1.3
1.4 to 1.6
OH
OH
OH
CC
CC
CC
CC
V
V
−0.4
CC
1.65 to 1.95
V
−0.45
CC
5
I
I
= −4.0 mA
= −8.0 mA
= 20 mA
2.3 to 2.7
3.0 to 3.6
0.9
2.07
2.75
2.07
2.75
OH
OH
V
OL
Low−Level
V
=
or
IL
0.1
0.25xV
0.25xV
0.45
0.1
0.25xV
0.25xV
0.45
V
I
OL
IN
V
IH
Output Voltage
I
OL
I
OL
I
OL
I
OL
I
OL
= 0.3 mA
= 1.7 mA
= 3.0 mA
= 4.0 mA
= 8.0 mA
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0 to 3.6
CC
CC
CC
CC
V
0.4
0.4
0.4
0.4
I
IN
Input Leakage
Current
0 ≤ V ≤ 3.6 V
$0.1
$1.0
mA
IN
I
Quiescent
Supply Current
V
= V or GND
3.6
1.0
1.0
10.0
10.0
mA
mA
CC
IN
CC
I
3−State Output
Leakage
V
V
= V or V
IL
0.9 to 3.6
OZ
IN
IH
= 0 to 3.6 V
OUT
Current
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NL17SG126
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0 ns)
r
f
T
A
=
−555C to +1255C
T
A
= 25 5C
Symbol
Parameter
Test Condition
V
(V)
Min
−
Typ
11.3
8.3
5.0
4.0
2.6
2.1
12.6
9.6
5.6
4.5
2.9
2.4
14.5
11.3
8.2
6
Max
13.6
10.4
8.5
Min
Max
15.9
12.8
10.0
6.7
Unit
CC
t
,
Propagation Delay,
A to Y
C = 10 pF,
L
0.9
−
ns
PLH
t
PHL
R = 1 MW
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
−
−
−
−
−
6.2
−
−
3.9
−
4.4
−
3.1
−
3.7
C = 15 pF,
L
−
14.7
11.5
9.3
−
17.0
15.2
11.2
7.1
ns
ns
ns
R = 1 MW
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
−
−
−
−
−
6.9
−
−
4.4
−
5.0
−
3.4
−
3.9
C = 30 pF,
L
−
16.3
13.6
13.1
9.2
−
19.6
17.5
15.9
9.6
R = 1 MW
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
−
−
−
−
−
−
−
4
5.7
−
6.1
−
3.3
4.4
−
4.8
t
,
Output Enable Time,
OE to Y
C = 10 pF;
L
PZH
t
PZL
R = 100 kW
L
0.9
−
−
−
−
−
−
11.0
8.4
5.3
3.9
2.5
2.1
13.3
10.9
7.8
−
−
−
−
−
−
15.8
13.0
8.3
5.9
3.8
3
R = 5 kW
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
R = 5 kW
L
R = 5 kW
L
5.5
R = 5 kW
L
3.5
R = 5 kW
L
2.7
C = 15 pF;
L
ns
R = 100 kW
0.9
−
−
−
−
−
−
12.0
9.0
5.9
4.4
2.9
2.3
14.8
11.7
8.9
6.3
3.9
3
−
−
−
−
−
−
17.0
13.8
11
L
R = 5 kW
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
R = 5 kW
L
R = 5 kW
L
6.5
4.2
3.3
R = 5 kW
L
R = 5 kW
L
C = 30 pF;
L
ns
R = 100 kW
0.9
−
−
−
−
−
−
13.0
10.0
8.3
15.2
13.1
12.2
8.6
5
−
−
−
−
−
−
18.3
15.2
13.7
9.7
L
R = 5 kW
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
R = 5 kW
L
R = 5 kW
L
6.1
R = 5 kW
L
3.8
5.5
R = 5 kW
L
2.9
3.8
4.2
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4
NL17SG126
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0 ns) (continued)
r
f
T
A
=
−555C to +1255C
T
A
= 25 5C
Symbol
Parameter
Test Condition
C = 10 pF;
V
(V)
Min
Typ
Max
Min
Max
Unit
CC
t
,
Output Disable Time,
OE to Y
ns
PHZ
L
t
PLZ
R = 100 kW
L
0.9
−
−
−
−
−
−
100.4
9.1
−
−
−
−
−
−
−
−
R = 5 kW
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
14.4
9.1
8.3
7.3
6.9
22.4
10.4
9
R = 5 kW
L
7.1
R = 5 kW
L
6.5
R = 5 kW
L
5.8
8.8
7.6
R = 5 kW
L
5.4
C = 15 pF;
L
ns
R = 100 kW
0.9
−
−
−
−
−
−
122.2
9.8
7.8
7.2
7
−
−
−
−
−
−
−
−
L
R = 5 kW
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
15.3
9.8
9.2
8.2
7.7
25.1
11.3
10.6
10.3
9.5
R = 5 kW
L
R = 5 kW
L
R = 5 kW
L
R = 5 kW
L
6.6
C = 30 pF;
L
ns
R = 100 kW
0.9
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0 to 3.6
0
−
−
−
−
−
−
217.1
13.2
12.2
11.4
11.3
10.2
3
−
−
−
−
−
−
−
−
−
−
L
R = 5 kW
L
19.6
13.5
12.7
12.2
11.5
−
31.9
14.9
13.9
13.5
12.9
−
R = 5 kW
L
R = 5 kW
L
R = 5 kW
L
R = 5 kW
L
C
Input Capacitance
Output Capacitance
pF
pF
IN
C
V
O
= GND
3
−
−
O
C
Power Dissipation
Capacitance (Note 5)
PD
f = 10 MHz
0.9 to 3.6
−
4
−
−
−
pF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
power consumption; P = C ꢀ V
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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5
NL17SG126
Figure 5. Test Circuit
Figure 6. tPLH, tPHL Waveforms
Figure 7. tPLZ, tPHZ, tPZH, tPZL Waveforms
V
CC
3.3 + 0.3 V
2.5 + 0.2 V
1.8 + 0.15 V
1.5 + 0.1 V
1.2 + 0.1 V
0.9 V
/ 2
Unit
V
M
V
/ 2
V
/ 2
V
/ 2
V
/ 2
V
/ 2
V
CC
CC
CC
CC
CC
CC
V
V
V
+ 0.3 V
− 0.3 V
V
+ 0.15 V
− 0.15 V
V
+ 0.1 V
V
+ 0.1 V
− 0.1 V
V
+ 0.1 V
− 0.1 V
V
+ 0.1 V
X
OL
OL
OL
OL
OL
OL
V
OH
V
OH
V
OH
− 0.15 V
V
OH
V
OH
V
OH
− 0.1 V
Y
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6
NL17SG126
ORDERING INFORMATION
Device
†
Package
Shipping
NL17SG126P5T5G
SOT−953
(Pb−Free)
8000 / Tape & Reel
8000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
NL17SG126P5T6G
NL17SG126DFT2G
NL17SG126AMUTCG*
NL17SG126CMUTCG*
SOT−953
(Pb−Free)
SC−88A
(Pb−Free)
UDFN6 1.45x1 mm
(Pb−Free)
UDFN6 1x1 mm
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*In Development
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7
NL17SG126
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
NOTES:
X
Y
D
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
A
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
5
4
3
PIN ONE
INDICATOR
H
E
E
1
2
MILLIMETERS
DIM MIN
NOM
0.37
0.15
0.12
1.00
MAX
0.40
0.20
0.17
1.05
0.85
A
b
0.34
0.10
0.07
0.95
0.75
C
TOP VIEW
e
C
D
SIDE VIEW
E
0.80
e
0.35 BSC
HE
0.95
1.00
1.05
0.175 REF
0.10
−−−
L
L2
L3
5X
L
0.05
−−−
0.15
0.15
5X
5X
L3
L2
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
b
PACKAGE
OUTLINE
0.08 X
Y
BOTTOM VIEW
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
NL17SG126
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
NOTES:
A B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
PIN ONE
REFERENCE
E
2X
0.10
C
MILLIMETERS
DIM MIN
MAX
0.55
0.05
A
A1
A3
b
0.45
0.00
0.13 REF
2X
0.10
C
TOP VIEW
0.12
0.22
A3
D
E
e
L
1.00 BSC
1.00 BSC
0.35 BSC
0.05
C
C
A
0.25
0.30
0.35
0.40
L1
0.05
A1
SEATING
PLANE
RECOMMENDED
C
SIDE VIEW
e
SOLDERING FOOTPRINT*
5X
6X
0.48
0.22
5X L
3
1
L1
1.18
6
4
6X b
1
0.35
0.53
M
M
0.10
0.05
C A B
PITCH
PKG
OUTLINE
NOTE 3
C
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
NL17SG126
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
DETAIL A
PIN ONE
REFERENCE
OPTIONAL
E
MILLIMETERS
CONSTRUCTIONS
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
A
0.10
C
EXPOSED Cu
MOLD CMPD
A2
b
0.07 REF
0.20
TOP VIEW
0.30
0.10
C
D
1.45 BSC
E
e
1.00 BSC
0.50 BSC
DETAIL B
L
L1
0.30
−−−
0.40
0.15
DETAIL B
OPTIONAL
0.05
0.05
C
C
CONSTRUCTIONS
A
MOUNTING FOOTPRINT
6X
A1
6X
SEATING
PLANE
A2
C
SIDE VIEW
e
0.30
PACKAGE
OUTLINE
6X L
1.24
3
1
DETAIL A
6X
1
0.53
0.50
PITCH
DIMENSIONS: MILLIMETERS
6
4
6X b
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10 C A B
NOTE 3
C
0.05
BOTTOM VIEW
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10
NL17SG126
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
A
ISSUE L
NOTES:
G
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
3
−B−
S
1
2
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
M
M
B
D 5 PL
0.2 (0.008)
0.026 BSC
0.65 BSC
---
0.004
0.004
0.004
0.010
0.012
---
0.10
0.10
0.10
0.25
0.30
N
K
N
S
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
J
C
K
H
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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