NLAS1053 [ONSEMI]
2:1 Mux/Demux Analog Switches; 2 ： 1复用器/解复用器模拟开关
| 型号： | NLAS1053 |
| 厂家： | 
ONSEMI |
| 描述： | 2:1 Mux/Demux Analog Switches |
| 文件： | 总12页 (文件大小：127K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NLAS1053
2:1 Mux/Demux Analog
Switches
The NLAS1053 is an advanced CMOS analog switch fabricated
with silicon gate CMOS technology. It achieves very high speed
propagation delays and low ON resistances while maintaining CMOS
low power dissipation. The device consists of a single 2:1
Mux/Demux (SPDT), similar to ON Semiconductor’s NLAS4053
analog and digital voltages that may vary across the full power supply
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MARKING
DIAGRAMS
range (from V
to GND).
CC
The inhibit and select input pins have over voltage protection that
allows voltages above V up to 7.0 V to be present without damage
CC
8
or disruption of operation of the part, regardless of the operating
voltage.
US8
US SUFFIX
CASE 493–01
D
AC
• High Speed: t
= 1 ns (Typ) at V
= 5.0 V
PD
• Low Power Dissipation: I
CC
= 2 µA (Max) at T = 25°C
CC
A
• High Bandwidth, Improved Linearity, and Low RDS
ON
• INH Pin Allows a Both Channels ‘OFF’ Condition (With a High)
• RDS 25 Ω , Performance Very Similar to the NLAS4053
1
ON
AC
D
= Device Code
= Date Code
• Break Before Make Circuitry, Prevents Inadvertent Shorts
• Useful For Switching Video Frequencies Beyond 50 MHz
• Latch–Up Performance Exceeds 300 mA
• ESD Performance: HBM > 2000 V; MM > 200 V, CDM > 1500 V
• Tiny US8 Package, Only 2.1 X 3.0 mm
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
COM
1
2
3
4
8
7
6
5
V
CC
FUNCTION TABLE
INH
Select
Ch 0
Ch 1
INH
N/C
CH0
H
L
L
X
L
OFF
ON
OFF
OFF
ON
CH1
H
OFF
GND
Select
Figure 1. Pin Assignment
Semiconductor Components Industries, LLC, 2002
1
Publication Order Number:
February, 2002 – Rev. 0
NLAS1053/D
NLAS1053
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
V
V
Positive DC Supply Voltage
Digital Input Voltage (Select and Inhibit)
Analog Output Voltage (V or V
−0.5 to +7.0
CC
−0.5 ≤ V is ≤ +7.0
V
IN
)
−0.5 ≤ V is ≤ V +0.5
CC
V
IS
CH COM
I
DC Current, Into or Out of Any Pin
Storage Temperature Range
50
mA
_C
IK
T
T
T
q
−65 to +150
260
STG
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance
_C
L
J
+150
_C
_C/W
mW
250
JA
P
Power Dissipation in Still Air at 85_C
Moisture Sensitivity
250
D
MSL
Level 1
F
R
Flammability Rating
Oxygen Index: 30% – 35%
UL–94–VO (0.125 in)
V
ESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
> 2000
200
V
Charged Device Model (Note 4)
N/A
I
Latch–Up Performance
Above V
and Below GND at 85_C (Note 5)
±300
mA
Latch–Up
CC
Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm–by–1 inch, 2–ounce copper trace with no air flow.
2. Tested to EIA/JESD22–A114–A.
3. Tested to EIA/JESD22–A115–A.
4. Tested to JESD22–C101–A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
2.0
Max
5.5
Unit
V
V
V
V
V
Positive DC Supply Voltage
CC
Digital Input Voltage (Select and Inhibit)
Static or Dynamic Voltage Across an Off Switch
Analog Input Voltage (CH, COM)
GND
GND
GND
−55
5.5
V
IN
V
V
V
IO
IS
CC
V
CC
T
A
Operating Temperature Range, All Package Types
+125
°C
ns/V
t , t
r f
Input Rise or Fall Time,
(Enable Input)
V
cc
V
cc
= 3.3 V ± 0.3 V
= 5.0 V ± 0.5 V
0
0
100
20
DEVICE JUNCTION TEMPERATURE VERSUS TIME
TO 0.1% BOND FAILURES
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Junction
Temperature 5C
Time, Hours
1,032,200
419,300
178,700
79,600
Time, Years
117.8
47.9
80
90
100
110
120
130
140
20.4
1
9.4
1000
1
10
100
37,000
4.2
TIME, YEARS
17,800
2.0
Figure 2. Failure Rate versus
Time Junction Temperature
8,900
1.0
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2
NLAS1053
DC CHARACTERISTICS – Digital Section (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Condition
V
CC
*55_C to
t85_C
t125_C
Unit
25_C
V
V
Minimum High–Level Input
Voltage, Select and Inhibit
Inputs
2.0
2.5
3.0
4.5
5.5
1.5
1.5
1.9
1.5
1.9
V
IH
1.9
2.1
2.1
2.1
3.15
3.85
3.15
3.85
3.15
3.85
Maximum Low–Level Input
Voltage, Select and Inhibit
Inputs
2.0
2.5
3.0
4.5
5.5
0.5
0.6
0.5
0.6
0.5
0.6
V
IL
0.9
0.9
0.9
1.35
1.65
1.35
1.65
1.35
1.65
I
I
Maximum Input Leakage
Current, Select and Inhibit
Inputs
V
= 5.5 V or GND
0 V to 5.5 V
$0.1
$1.0
$1.0
m A
m A
IN
IN
Maximum Quiescent Supply
Current
Select and Inhibit = V
CC
or GND
5.5
1.0
1.0
2.0
CC
DC ELECTRICAL CHARACTERISTICS – Analog Section
Guaranteed Limit
Symbol
Parameter
Maximum “ON”
Resistance
(Figures 17 – 23)
Condition
= V or V
V
-
5
5
t
o
2
5
5
C
< 855C
85
46
28
22
<
1
2
5
5
C
Unit
CC
R
V
V
2.5
3.0
4.5
5.5
70
40
20
16
105
52
W
ON
IN
IS
IL
IH
= GND to V
CC
I
IN
I ≤ 10.0 mA
34
28
R
ON Resistance Flatness
(Figures 17 – 23)
V
I
= V or V
IL IH
4.5
4.5
5.5
4
4
5
3
W
W
FLAT
IN
I ≤ 10.0 mA
IN
(ON)
V
IS
= 1V, 2V, 3.5V
D R
ON
(ON)
ON Resistance Match
Between Channels
V
= V or V
IL IH
I ≤ 10.0 mA
2
2
IN
I
V
IN
or V = 3.5 V
CH1
CH0
I
I
CH1 or CH0 Off Leakage
Current (Figure 9)
V
V
= V or V
IL IH
1
1
10
10
100
100
nA
nA
CH0
CH1
IN
CH1
or V = 1.0 V
CH0 COM
4.5 V
I
COM ON Leakage
Current (Figure 9)
V
V
= V or V
IL IH
1.0 V or 4.5 V with V
floating or
1.0 V or 4.5 V with V
floating
5.5
COM(ON)
IN
CH1
CH0
CH1
V
CH1
V
COM
= 1.0 V or 4.5 V
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3
NLAS1053
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0 ns)
r
f
Guaranteed Max Limit
V
-55 to 25_C
<
8
5
_
C
<
1
2
5
_
C
CC
Symbol
Parameter
Turn–On Time
(Figures 12 and 13)
INH to Output
Test Conditions
= 300 WC, = 35 pF
(V)
Min Typ* Max Min Max Min Max Unit
t
R
2.5
3.0
4.5
5.5
2
2
1
1
7
5
4
3
12
10
9
2
2
1
1
15
15
12
12
2
2
1
1
15
15
12
12
ns
ns
ns
ns
ON
L
L
(Figures 4 and 5)
8
t
t
t
Turn–Off Time
(Figures 12 and 13)
INH to Output
R
= 300 WC, = 35 pF
2.5
3.0
4.5
5.5
2
2
1
1
7
5
4
3
12
10
9
2
2
1
1
15
15
12
12
2
2
1
1
15
15
12
12
OFF
trans
BBM
L
L
(Figures 4 and 5)
8
Transition Time (Channel
Selection Time)
(Figure )
R
= 300 WC, = 35 pF
2.5
3.0
4.5
5.5
5
5
2
2
18
13
12
9
28
21
16
14
5
5
2
2
30
25
20
20
5
5
2
2
30
25
20
20
L
L
(Figures and )
Select to Output
Minimum
Break–Before–Make Time
V
= 3.0 V (Figure 3)
2.5
3.0
4.5
5.5
1
1
1
1
12
11
6
1
1
1
1
1
1
1
1
IS
R = 300 W ,WC, = 35 pF
L
L
5
*Typical Characteristics are at 25_C.
Typical @ 25, VCC = 5.0 V
C
C
C
C
Maximum Input Capacitance, Select/INH Input
Analog I/O (switch off)
Common I/O (switch off)
8
pF
IN
NO
COM
(ON)
orC
NC
10
10
20
Feedthrough (switch on)
ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
V
CC
Typical
Symbol
Parameter
Condition
V
25°C
Unit
BW
Maximum On–Channel –3dB Bandwidth or
Minimum Frequency Response
(Figure 10)
V
V
= 0 dBm
centered between V
CC
3.0
4.5
5.5
170
200
200
MHz
IN
IN
and GND
(Figure 7)
V
V
Maximum Feedthrough On Loss
V
V
= 0 dBm @ 100 kHz to 50 MHz
3.0
4.5
5.5
−3
−3
−3
dB
dB
ONL
IN
IN
centered between V
CC
and GND
(Figure 7)
Off–Channel Isolation
(Figure 10)
f = 100 kHz; V = 1 V RMS
3.0
4.5
5.5
−93
−93
−93
ISO
IS
V
centered between V
CC
and GND
IN
(Figure 7)
Q
Charge Injection Select Input to
Common I/O
(Figure 15)
V
V
GND, F = 20 kHz
IS
IN = CC to
t = t = 3 ns
3.0
5.5
1.5
3.0
pC
r
f
R
= 0 W, C = 1000 pF
IS L
Q = C * ∆V
(Figure 8)
L
OUT
THD
Total Harmonic Distortion
THD + Noise
(Figure 14)
F
C
= 20 Hz to 100 kHz, R = Rgen = 600 W,
= 50 pF
IS
L
L
V
IS
= 5.0 V
PP
sine wave
5.5
0.1
%
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4
NLAS1053
V
CC
DUT
Input
V
CC
Output
GND
V
OUT
0.1 m F
t
BMM
300 Ω
35 pF
90% of V
90%
OH
Output
Switch Select Pin
GND
Figure 3. t
(Time Break–Before–Make)
BBM
V
CC
DUT
Input
50%
50%
90%
V
CC
Output
0 V
V
OUT
0.1 m F
V
OH
Open
300 Ω
35 pF
90%
Output
INH
Input
V
OL
t
t
OFF
ON
Figure 4. t
/t
ON OFF
V
CC
V
CC
Input
50%
50%
DUT
0 V
300 Ω
Output
V
OUT
V
OH
Open
35 pF
Output
10%
10%
V
OL
INH
Input
t
t
ON
OFF
Figure 5. t
/t
ON OFF
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5
NLAS1053
V
CC
V
Output
CC
Input
50%
50%
V
OUT
0.1 m F
0 V
GND
300 Ω
35 pF
V
CC
90%
Output
Select Pin
10%
GND
t
t
trans
trans
Figure 6. t
(Channel Selection Time)
trans
50 Ω
DUT
Reference
Input
50 Ω Generator
Transmitted
Output
50 Ω
Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is
the bandwidth of an On switch. V , Bandwidth and V are independent of the input signal direction.
ISO
ONL
V
V
OUT
IN
= Off Channel Isolation = 20 Logǒ Ǔ
V
for V at 100 kHz
IN
ISO
V
OUT
= On Channel Loss = 20 Logǒ Ǔ
V
for V at 100 kHz to 50 MHz
IN
ONL
V
IN
Bandwidth (BW) = the frequency 3 dB below V
ONL
Figure 7. Off Channel Isolation/On Channel Loss (BW)/Crosstalk
(On Channel to Off Channel)/V
ONL
DUT
V
CC
V
IN
Output
Open
GND
C
L
Output
Off
∆V
OUT
Off
On
V
IN
Figure 8. Charge Injection: (Q)
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6
NLAS1053
100
10
1
0
Bandwidth
(ON–RESPONSE)
–20
–40
–60
Off Isolation
I
COM(ON)
0.1
I
COM(OFF)
V
T
= 5.0 V
= 25_C
CC
A
0.01
–80
V
CC
= 5.0 V
85
I
CH(OFF)
0.001
–100
0.01
0.1
1
10
100 200
–55
–20
25
70
125
FREQUENCY (MHz)
TEMPERATURE (°C)
Figure 9. Switch Leakage versus Temperature
Figure 10. Bandwidth and Off–Channel
Isolation
30
25
20
15
10
0
10
20
30
t
(ns)
trans
V
T
= 5.0 V
0.1
CC
A
t
/t
(ns)
5
0
ON OFF
= 25_C
2.5
3
3.5
4
(VOLTS)
4.5
5
0.01
1
10
100 200
FREQUENCY (MHz)
V
CC
Figure 11. Phase versus Frequency
Figure 12. t
and t
versus V
CC
at 255C
ON
OFF
30
25
20
15
10
5
1
V
CC
= 4.5 V
V
= 3.0 V
= 3.6 V
INpp
V
CC
0.1
V
= 5.0 V
= 5.5 V
INpp
V
CC
t
trans
t
/t
ON OFF
0.01
0
–55
1
10
FREQUENCY (kHz)
100
–40
25
Temperature (°C)
85
125
Figure 14. Total Harmonic Distortion
Plus Noise versus Frequency
Figure 13. t
and t versus Temp
OFF
ON
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7
NLAS1053
3.0
2.5
2.0
1.5
1.0
0.5
100
10
1
0.1
V
= 5 V
CC
0.01
V
CC
= 3.0 V
0.001
0.0001
V
CC
= 3 V
0
V
= 5.0 V
60
CC
–0.5
0.00001
0
1
2
3
4
5
–40
–20
0
20
80
100
120
Temperature (°C)
V
COM
(V)
Figure 16. I
versus Temp, V
= 3 V & 5 V
CC
CC
Figure 15. Charge Injection versus COM Voltage
100
90
80
70
60
50
40
30
20
100
80
60
40
20
0
V
= 2.0 V
CC
85°C
V
CC
= 2.5 V
125°C
V
= 3.0 V
CC
25°C
V
CC
= 4.5 V
–55°C
10
0
0
0.5
1
1.5
2
2.5
0
1
2
3
4
5
V
COM
(VOLTS)
V
COM
(VOLTS)
Figure 17. R
versus V
and V
255C
Figure 18. R
versus V
COM
and Temperature,
ON
COM
CC (@
ON
V
2.0 V
CC
70
60
50
40
30
20
40
35
30
25
20
15
10
25°C
25°C
125°C
125°C
85°C
–55°C
85°C
10
0
–55°C
5
0
0
0.5
1
1.5
(VOLTS)
2
2.5
3
0
0.5
1
1.5
2
2.5
3
3.5
V
COM
V
(VOLTS)
COM
Figure 19. R
versus V
COM
and Temperature,
Figure 20. R
versus V and Temperature,
COM
ON
ON
V
= 2.5 V
V
= 3.0 V
CC
CC
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8
NLAS1053
20
18
16
14
12
10
8
18
16
125°C
125°C
14
12
85°C
10
8
85°C
–55°C
6
6
25°C
–55°C
25°C
4
4
2
0
2
0
0
1
2
3
4
5
0
1
2
3
4
5
6
V
COM
(VOLTS)
V
COM
(VOLTS)
Figure 22. R
versus V and Temperature,
COM
Figure 21. R
versus V
and Temperature,
ON
ON
COM
V
= 5.0 V
V
= 4.5 V
CC
CC
20
15
10
5
125°C
85°C
25°C
–55°C
0
0
1
2
3
4
5
6
V
COM
(VOLTS)
Figure 23. R
versus V and Temperature,
COM
ON
V
= 5.5 V
CC
DEVICE ORDERING INFORMATION
Device Nomenclature
Device
Order Number
Circuit
Indicator
Device
Function
Package
Suffix
Package Type
Tape and Reel Size
Technology
NLAS1053US
NL
AS
1053
US
US8
178 mm (7″)
3000 Unit
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9
NLAS1053
TAPE TRAILER
(Connected to Reel Hub)
NO COMPONENTS
160 mm MIN
TAPE LEADER
NO COMPONENTS
400 mm MIN
COMPONENTS
DIRECTION OF FEED
CAVITY TOP TAPE
TAPE
Figure 24. Tape Ends for Finished Goods
TAPE DIMENSIONS mm
4.00
4.00
Ğ1.50 TYP
2.00
1.75
3.50 $ 0.25
+ 0.30
8.00
– 0.10
1
Ğ1.00 ± 0.25 TYP
DIRECTION OF FEED
Figure 25. US8 Reel Configuration/Orientation
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10
NLAS1053
t MAX
13.0 mm $0.2 mm
(0.512 in $0.008 in)
1.5 mm MIN
(0.06 in)
50 mm MIN
(1.969 in)
20.2 mm MIN
(0.795 in)
A
FULL RADIUS
G
Figure 26. Reel Dimensions
REEL DIMENSIONS
Tape Size
T and R Suffix
A Max
G
t Max
8 mm
US
178 mm
(7 in)
8.4 mm, + 1.5 mm, –0.0
(0.33 in + 0.059 in, –0.00)
14.4 mm
(0.56 in)
DIRECTION OF FEED
BARCODE LABEL
POCKET
HOLE
Figure 27. Reel Winding Direction
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11
NLAS1053
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493–01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–X–
A
J
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION A" DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR. MOLD
FLASH. PROTRUSION AND GATE BURR SHALL
NOT EXCEED 0.140 MM (0.0055") PER SIDE.
4. DIMENSION B" DOES NOT INCLUDE
INTER-LEAD FLASH OR PROTRUSION.
INTER-LEAD FLASH AND PROTRUSION SHALL
NOT E3XCEED 0.140 (0.0055") PER SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076-0. 0203 MM. (300-800
INCH).
8
5
–Y–
DETAIL E
B
L
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002").
1
4
R
S
G
MILLIMETERS
INCHES
MIN
P
DIM MIN
MAX
2.10
2.40
0.90
0.25
0.35
MAX
0.083
0.094
0.035
0.010
0.014
U
A
B
C
D
F
1.90
2.20
0.60
0.17
0.20
0.075
0.087
0.024
0.007
0.008
C
H
–T–
0.10 (0.004)
T
K
G
H
J
0.50 BSC
0.40 REF
0.020 BSC
0.016 REF
SEATING
PLANE
D
N
0.10
0.18
0.10
3.20
6
0.004
0.007
0.004
0.126
6
M
R 0.10 TYP
M
0.10 (0.004)
T
X Y
K
L
0.00
3.00
0
0.000
0.118
0
M
N
P
R
S
U
V
_
_
_
_
5
10
5
10
V
_
_
_
_
0.28
0.23
0.37
0.60
0.44
0.33
0.47
0.80
0.011
0.009
0.015
0.024
0.017
0.013
0.019
0.031
0.12 BSC
0.005 BSC
F
DETAIL E
3.8
1.8 TYP
0.5 TYP
0.3 TYP
1.0
(mm)
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