NLSV22T244_12 [ONSEMI]
Dual 2-Bit Dual-Supply Non-Inverting Level Translator; 双路2位双电源非反相电平转换器型号: | NLSV22T244_12 |
厂家: | ONSEMI |
描述: | Dual 2-Bit Dual-Supply Non-Inverting Level Translator |
文件: | 总8页 (文件大小:133K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NLSV22T244
Dual 2-Bit Dual-Supply
Non-Inverting Level
Translator
The NLSV22T244 is a dual 2−bit configurable dual−supply bus
buffer level translator. The input ports A and the output ports B are
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MARKING
designed to track two different power supply rails V
and V
.
CCA
CCB
Both supply rails are configurable from 1.6 V to 3.6 V allowing
universal low−voltage translations from the input port A to the output
B port.
DIAGRAM
1
WEMG
Features
G
UQFN12
MU SUFFIX
CASE 523AE
• Wide V
and V
Operating Range: 1.6 V to 3.6 V
CCA
CCB
• High−Speed w/ Balanced Propagation Delay
WE = Specific Device Code
• Inputs and Outputs have OVT Protection to 5.5 V
M
G
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
• Non−preferential V
and V
Sequencing
CCA
CCB
• Outputs at 3−State until Active V is reached
CC
• Power−Off Protection
PIN ASSIGNMENT
• Ultra−Small packaging: 1.7mm x 2.0 mm UQFN−12
• This is a Pb−Free Device
OE
V
V
CCA
1
2
3
4
5
12
11
10
9
CCB
Typical Applications
• Mobile Phones, PDAs, Other Portable Devices
IN_A1
IN_A2
OUT_B1
OUT_B2
IN_B3
V
CCA
V
CCB
OUT_A3
8
6
7
IN_B4
OUT_A4
IN_A1
IN_A2
OUT_B1
OUT_B2
GND
(Top View)
OE
ORDERING INFORMATION
V
CCB
V
CCA
†
Device
NLSV22T244MUTAG
Package Shipping
UQFN12 3000
(Pb−Free) / Tape & Reel
IN_B3
IN_B4
OUT_A3
OUT_A4
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
OE
OE
GND
Figure 1. Logic Diagram
©
Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
June, 2009 − Rev. 3
NLSV22T244/D
NLSV22T244
NLSV22T244
2.8V
V
V
1.8V
CCB
CCA
V
CCB
V
CCA
Module B
(2.8V)
Module A
(1.8V)
IN_B3
IN_B4
OUT_A3
OUT_A4
USB D+
USB Rx_D+
USB D−
USB Rx_D−
OE
1.8V
OE
Tx/Rx
Tx/Rx
NLU1G50
OE
OUT_B1
OUT_B2
IN_A1
IN_A2
USB Tx_D+
USB Tx_D−
V
CCB
V
CCA
OE = High, Module B Transmits, Module A Receives = B → A
OE = Low, Module A Transmits, Module B Receives = A → B
Figure 2. Typical Application Bi−Directional to Uni−Directional Logic Level Translator
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2
NLSV22T244
PIN ASSIGNMENT
Pin
Function
Inputs
IN_A1
Outputs
V
A DC Power Supply
B DC Power Supply
Ground
IN_B3,
IN_B4
OUT_B1,
OUT_B2
OUT_A3
OUT_A4
CCA
CCB
IN_A2
OE
V
H
X
L
L
H
X
3−State
L
H
GND
IN_A1, IN_A2, IN_B3, IN_B4
Inputs
L
L
L
3−State
OUT_B1, OUT_B2, OUT_A3, OUT_A4 Outputs
H
H
OE
Output Enable
MAXIMUM RATINGS
Symbol
Rating
Value
Condition
Unit
V
V
, V
DC Supply Voltage
DC Input Voltage
Control Input
−0.5 to +5.5
−0.5 to +5.5
−0.5 to +5.5
−0.5 to +5.5
−0.5 to +5.5
−0.5 to +5.5
−20
CCA CCB
V
I
IN_X
V
n
V
C
V
O
OE
V
DC Output Voltage
(Power Down) OUT_X
V
= V = 0
CCB
V
n
n
n
CCA
(Active Mode) OUT_X
(Tri−State Mode) OUT_X
I
IK
DC Input Diode Current
V < GND
I
mA
mA
mA
mA
mA
°C
I
DC Output Diode Current
−50
V < GND
O
OK
I
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature
50
O
I
, I
100
CCA CCB
I
100
GND
T
−65 to +150
STG
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
, V
Parameter
Min
1.6
Max
3.6
3.6
3.6
3.6
3.6
3.6
+85
10
Unit
V
V
Positive DC Supply Voltage
Bus Input Voltage
Control Input
CCA CCB
V
I
GND
GND
GND
GND
GND
−40
0
V
V
C
OE
V
V
IO
Bus Output Voltage
(Power Down Mode) OUT_X
(Active Mode) OUT_X
V
n
n
n
V
(Tri−State Mode) OUT_X
V
T
A
Operating Temperature Range
Input Transition Rise or Rate
°C
nS
Dt / DV
V , from 30% to 70% of V ; V = 3.3 V 0.3 V
I
CC CC
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NLSV22T244
DC ELECTRICAL CHARACTERISTICS
−405C to +855C
Min
Max
Symbol
Parameter
Test Conditions
V
CCA
(V)
V
CCB
(V)
Unit
V
Input HIGH Voltage
1.6 − 3.6
V
2.7 − 3.6
2.3 − 2.7
1.4 − 2.3
2.7 − 3.6
2.3 − 2.7
1.6 − 2.3
1.6 − 3.6
1.6
2.0
−
IH
1.6
−
−
0.65 * V
CCA
V
Input LOW Voltage
1.6 − 3.6
V
V
−
−
−
0.8
0.7
0.35 * V
−
IL
CCA
V
OH
Output HIGH Voltage
I
I
= −100 mA; V = V
1.6 − 3.6
1.6
V
− 0.2
OH
I
IH
CCB
= −6 mA; V = V
1.25
−
OH
I
IH
2.3
2.3
2.0
1.8
2.2
1.7
2.4
2.2
−
−
I
I
= −12 mA; V = V
2.3
2.3
−
OH
I
IH
2.7
2.7
−
= −18 mA; V = V
2.3
2.3
−
OH
I
IH
3.0
3.0
−
I
I
I
I
= −24 mA; V = V
3.0
3.0
−
OH
OL
OL
OL
I
IH
V
OL
Output LOW Voltage
V
= 100 mA; V = V
1.6 − 3.6
1.6
1.6 − 3.6
1.6
0.2
0.3
0.4
0.4
0.6
0.5
0.6
+1.0
2.0
I
IL
= 6 mA; V = V
−
I
IL
= 12 mA; V = V
2.3
2.3
−
I
IL
IL
2.7
2.7
−
I
OL
= 18 mA; V = V
2.3
2.3
−
I
3.0
3.0
−
I
OL
= 24 mA; V = V
3.0
3.0
−
I
IL
I
Input Leakage Current
V = V or GND
CCA
1.6 − 3.6
1.6 − 3.6
1.6 − 3.6
1.6 − 3.6
−1.0
−
mA
mA
I
I
I
I/O Tri−State Output Leakage
Current
T = 25°C, OE = GND
A
OZ
I
I
Quiescent Supply Current
Quiescent Supply Current
Quiescent Supply Current
V = V
O
or GND;
or GND;
or GND;
1.6 − 3.6
1.6 − 3.6
1.6 − 3.6
1.6 − 3.6
1.6 − 3.6
1.6 − 3.6
−
−
−
2.0
2.0
4.0
mA
mA
mA
CCA
CCB
I
CCA
CCA
CCA
I
= 0
V = V
I
O
I
= 0
I
+ I
CCB
V = V
I
CCA
I
O
= 0
TOTAL STATIC POWER CONSUMPTION (ICCA + ICCB
)
−405C to +855C
V
CCB
(V)
3.6
2.8
1.6
Min
Max
2
Min
Max
2
Min
Max
2
V
(V)
Unit
mA
CCA
3.6
2.8
1.6
< 1
< 1
< 1
< 1
< 0.5
< 0.5
mA
mA
NOTE: Connect ground before applying supply voltage V
or V . This device is designed with the feature that the power−up
CCB
CCA
sequence of V
and V
will not damage the IC.
CCA
CCB
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4
NLSV22T244
AC ELECTRICAL CHARACTERISTICS
−405C to +855C
V
CCB
(V)
3.6
2.8
1.6
Min
Max
3.4
Min
Max
Min
Max
3.8
Symbol
Parameter
V
CCA
(V)
Unit
t
t
,
Propagation Delay,
3.6
3.6
3.8
nS
PLH
A to B
n
n
PHL
2.8
1.6
3.6
2.8
1.6
3.6
2.8
1.6
3.6
2.8
1.6
3.6
4.0
3.9
4.0
4.5
t
t
,
,
Output Enable,
OE to OUT_X
5.8
6.0
6.2
nS
nS
nS
PZH
n
PZL
6.0
6.2
6.4
8.2
8.4
8.6
t
t
Output Disable,
OE to OUT_X
5.8
6.0
6.2
PHZ
n
PLZ
6.0
6.2
6.4
8.2
8.4
8.6
t
t
,
Output−to−Output Skew,
Data−to−Output
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
OSHL
OSLH
1. Propagation delays defined per Figure 3.
CAPACITANCE
Symbol
Parameter
Test Conditions
Typ (Note 2)
Unit
pF
C
Control Pin Input Capacitance
I/O Pin Input Capacitance
Power Dissipation Capacitance
V
= V
= V
= V
= 3.3 V, V = 0 V or V
3.5
5.0
10
IN
I/O
PD
CCA
CCA
CCA
CCB
CCB
CCB
I
CCA/B
CCA/B
C
C
V
= 3.3 V, V = 0 V or V
pF
I
V
= 3.3 V, V = 0 V or V
, f = 10 MHz
pF
I
CCA
2. Typical values are at T = +25°C.
A
3. C is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from:
PD
I
^ C x V x f x N
where I = I
+ I
CCB
and N = total number of outputs switching.
CC(operating)
PD
CC
IN
SW
CC
CCA
SW
V
CC
V
CCO
x 2
OPEN
GND
R
L
Pulse
Generator
DUT
C
L
R
L
Figure 3. AC (Propagation Delay) Test Circuit
Test
, t
Switch
t
OPEN
PLH PHL
t
, t
V
CCO
x 2 at VCCB = 3.0 V − 3.6 mV, 2.3 V − 2.7 V, 1.6 V −
PLZ PZL
1.95 V
t
, t
GND
PHZ PZH
C = 15 pF or equivalent (includes probe and jig capacitance)
L
R = 2 kW or equivalent
L
Z
of pulse generator = 50 W
OUT
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5
NLSV22T244
V
IH
Input (A )
n
Vm
Vm
0 V
t
t
PHL
PLH
V
OH
Output (B )
n
Vm
Vm
V
OL
Waveform 1 − Propagation Delays
= t = 2.0 ns, 10% to 90%; f = 1 MHz; t = 500 ns
t
R
F
W
V
IH
OE
Vm
Vm
n
0 V
t
t
PHZ
PZH
V
V
OH
Y
Output (B )
n
Vm
Vm
≈ 0 V
≈ V
t
t
PLZ
PZL
CC
Output (B )
n
V
V
X
OL
Waveform 2 − Output Enable and Disable Times
= t = 2.0 ns, 10% to 90%; f = 1 MHz; t = 500 ns
t
R
F
W
Figure 4. AC (Propagation Delay) Test Circuit Waveforms
V
CC
3.0 V – 3.6 V
Symbol
V
V
V
/2
/2
mA
mB
CCA
V
CCB
V
V
x 0.1
x 0.9
X
Y
OL
V
V
OH
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6
NLSV22T244
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
−0.1
In_Ax
or In_Bx
0
0.5
1
1.5
2
2.5
3
3.5
V , INPUT VOLTAGE (V)
in
Figure 5. Delta ICC
Increase in ICC per Input Voltage, Other Inputs at VCCA / VCCB or GND
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NLSV22T244
PACKAGE DIMENSIONS
UQFN12 1.7x2.0, 0.4P
CASE 523AE−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
D
A B
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
L1
PIN 1 REFERENCE
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH 0.03
MAX ON BOTTOM SURFACE OF
TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
DETAIL A
NOTE 5
E
0.10
0.10
C
C
2X
2X
MILLIMETERS
TOP VIEW
DIM MIN
MAX
0.55
0.05
A
A1
A3
b
0.45
0.00
DETAIL B
0.127 REF
A
0.15
0.25
0.05
0.05
C
DETAIL B
OPTIONAL
D
1.70 BSC
CONSTRUCTION
E
2.00 BSC
0.40 BSC
e
12X
C
K
0.20
----
0.55
0.03
A1
SEATING
PLANE
C
L
0.45
0.00
A3
SIDE VIEW
L1
L2
0.15 REF
8X
K
5
1
7
DETAIL A
12X L
e
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
2.00
11
12X
b
0.10
1
L2
M
M
C A B
C
BOTTOM VIEW
0.05
NOTE 3
0.40
0.32
PITCH
2.30
11X
0.22
12X
0.69
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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NLSV22T244/D
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