NLU1GU04CMUTCG [ONSEMI]
Single Unbuffered Inverter;
| 型号： | NLU1GU04CMUTCG |
| 厂家： | 
ONSEMI |
| 描述： | Single Unbuffered Inverter |
| 文件： | 总7页 (文件大小：143K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NLU1GU04
Single Unbuffered Inverter
The NLU1GU04 MiniGatet is an advanced high−speed CMOS
unbuffered inverter in ultra−small footprint.
This device is well suited for use in oscillator, pulse−shaping and
high input impedance amplifier applications. For digital applications,
the NLU1GU04 is recommended.
The NLU1GU04 input and output structures provide protection
when voltages up to 7.0 V are applied, regardless of the supply
voltage.
www.onsemi.com
MARKING
DIAGRAMS
Features
UDFN6
1.2 x 1.0
CASE 517AA
KM
• High Speed: t = 2.5 ns (Typ) @ V = 5.0 V
PD
CC
• Low Power Dissipation: I = 1 mA (Max) at T = 25°C
CC
A
1
• Power Down Protection Provided on inputs
UDFN6
1.0 x 1.0
CASE 517BX
• Balanced Propagation Delays
Y M
T M
• Overvoltage Tolerant (OVT) Input and Output Pins
• Ultra−Small Packages
1
• These are Pb−Free Devices
UDFN6
1.45 x 1.0
CASE 517AQ
1
NC
IN A
GND
1
2
3
6
5
V
CC
K
M
= Device Marking
= Date Code
NC
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
4
OUT Y
Figure 1. Pinout (Top View)
1
IN A
OUT Y
Figure 2. Logic Symbol
PIN ASSIGNMENT
1
2
3
4
5
6
NC
IN A
GND
OUT Y
NC
FUNCTION TABLE
A
Y
L
H
H
L
V
CC
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
June, 2016 − Rev. 5
NLU1GU04/D
NLU1GU04
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
CC
DC Supply Voltage
−0.5 to +7.0
V
IN
DC Input Voltage
−0.5 to +7.0
V
V
OUT
DC Output Voltage
−0.5 to +7.0
V
I
DC Input Diode Current
V
< GND
< GND
OUT
−20
mA
mA
mA
mA
mA
°C
IK
IN
I
DC Output Diode Current
V
20
OK
I
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
12.5
O
I
25
CC
I
25
−65 to +150
260
GND
T
STG
T
°C
L
T
150
°C
J
MSL
Level 1
F
R
Flammability Rating Oxygen
Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
I
Latchup Performance Above V and Below GND at 125 °C (Note 5)
500
mA
LATCHUP
CC
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22−A114−A.
3. Tested to EIA / JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
1.65
0
Max
5.5
Unit
V
V
CC
Positive DC Supply Voltage
Digital Input Voltage
V
IN
5.5
V
V
OUT
Output Voltage
0
5.5
V
T
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
−55
+125
°C
ns/V
A
Dt/DV
V
CC
V
CC
= 3.3 V 0.3 V
= 5.0 V 0.5 V
0
0
100
20
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2
NLU1GU04
DC ELECTRICAL CHARACTERISTICS
T
A
= −555C to
+1255C
T
A
= 25 5C
Typ
T
= +855C
A
Min
Max
Min
Max
Min
Max
Symbol
Parameter
Conditions
V
CC
(V)
Unit
V
IH
Low−Level
Input
Voltage
1.65
0.85 x
0.85 x
V
V
V
CC
CC
2.3 to 5.5
0.80 x
0.80 x
V
CC
V
CC
V
Low−Level
Input
1.65
0.15 x
0.15 x
0.15 x
V
V
IL
V
V
V
CC
CC
CC
Voltage
2.3 to 5.5
0.20 x
0.20 x
0.20 x
V
CC
V
CC
V
CC
V
OH
High−Level
Output
Voltage
V
OH
= V or V
2.0
3.0
4.5
1.9
2.9
4.4
2.0
3.0
4.5
1.9
2.9
4.4
1.9
2.9
4.4
IN
IH
IL
IL
IL
IL
I
= −50 mA
V
= V or V
IN
OH
OH
IH
I
I
= −4 mA
= −8 mA
3.0
4.5
2.58
3.94
2.48
3.80
2.34
3.66
V
OL
Low−Level
Output
Voltage
V
OL
= V or V
2.0
3.0
4.5
0
0
0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
IN
IH
I
= 50 mA
V
= V or V
IN
OL
OL
IH
I
I
= 4 mA
= 8 mA
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
I
Input
Leakage
Current
0 v V v 5.5 V
0 to 5.5
0.1
1.0
1.0
mA
mA
IN
IN
I
Quiescent
Supply
Current
V
IN
= 5.5 V or
5.5
1.0
20
40
CC
GND
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0 ns)
r
f
T
= −555C
A
to +1255C
T
A
= 25 5C
Typ
3.5
T
= +855C
A
V
(V)
Test
Condition
CC
Min
Max
Min
Max
10.5
13
Min
Max
Symbol
Parameter
Unit
t
,
Propagation Delay, Input A to
Output Y
3.0 to
3.6
C = 15 pF
L
8.9
11.4
5.5
7.0
10
12
15.5
8.0
9.5
10
ns
PLH
t
PHL
C = 50 pF
L
4.8
4.5 to
5.5
C = 15 pF
L
2.5
6.5
8.0
10
C = 50 pF
L
3.8
C
Input Capacitance
4
pF
pF
IN
C
Power Dissipation
Capacitance (Note 6)
5.0
22
PD
6. C is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
PD
load. Average operating current can be obtained by the equation I
= C • V • f + I . C is used to determine the no−load
CC(OPR)
PD CC in CC PD
2
dynamic power consumption: P = C • V
• f + I • V
D
PD
CC
in CC CC.
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3
NLU1GU04
V
CC
A or B
50%
GND
t
PLH
t
PHL
Y
50% V
CC
Figure 3. Switching Waveforms
OUTPUT
INPUT
C
L*
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for propagation delay tests.
Figure 4. Test Circuit
ORDERING INFORMATION
Device
†
Package
Shipping
NLU1GU04MUTCG
UDFN6, 1.2 x 1.0, 0.4P
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
(Pb−Free)
NLU1GU04AMUTCG
NLU1GU04CMUTCG
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLU1GU04
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
DETAIL A
PIN ONE
REFERENCE
OPTIONAL
E
MILLIMETERS
CONSTRUCTIONS
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
A
0.10
C
EXPOSED Cu
MOLD CMPD
A2
b
0.07 REF
0.20
1.45 BSC
TOP VIEW
0.30
0.10
C
D
E
e
1.00 BSC
0.50 BSC
DETAIL B
L
L1
0.30
−−−
0.40
0.15
DETAIL B
OPTIONAL
0.05
0.05
C
C
CONSTRUCTIONS
A
MOUNTING FOOTPRINT
6X
A1
6X
SEATING
PLANE
A2
C
SIDE VIEW
e
0.30
PACKAGE
OUTLINE
6X L
1.24
3
1
DETAIL A
6X
1
0.53
0.50
PITCH
6
4
DIMENSIONS: MILLIMETERS
6X b
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10
C A B
NOTE 3
0.05
C
BOTTOM VIEW
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5
NLU1GU04
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
NOTES:
A B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
PIN ONE
REFERENCE
E
2X
0.10
C
MILLIMETERS
DIM MIN
MAX
0.55
0.05
A
A1
A3
b
0.45
0.00
0.13 REF
2X
0.10
C
TOP VIEW
0.12
0.22
A3
D
E
e
L
1.00 BSC
1.00 BSC
0.35 BSC
0.05
C
C
A
0.25
0.30
0.35
0.40
L1
0.05
A1
SEATING
RECOMMENDED
C
SIDE VIEW
e
PLANE
SOLDERING FOOTPRINT*
05.4X8
6X
0.22
5X L
3
1
L1
1.18
6
4
6X b
1
0.35
0.53
M
M
0.10
C
A
B
PITCH
PKG
OUTLINE
NOTE 3
0.05
C
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
6
NLU1GU04
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
EDGE OF PACKAGE
NOTES:
A
B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
L1
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
E
DETAIL A
REFERENCE
Bottom View
MILLIMETERS
2X
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
(Optional)
A
0.10
C
MOLD CMPD
EXPOSED Cu
TOP VIEW
A3
b
D
E
0.127 REF
2X
0.15
0.25
0.10
C
C
1.20 BSC
1.00 BSC
0.40 BSC
A3
e
L
0.30
0.40
0.15
0.50
(A3)
L1 0.00
L2 0.40
0.10
0.08
A1
DETAIL B
Side View
(Optional)
A
SEATING
PLANE
MOUNTING FOOTPRINT*
10X
C
SIDE VIEW
6X
0.42
6X
0.22
C
A1
5X L
3
1
L2
6X b
6
4
0.40
PITCH
1.07
0.10
0.05
C
A B
e
C
NOTE 3
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NLU1GU04/D
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