NLV14067BDWR2G [ONSEMI]

Analog Multiplexers / Demultiplexers;
NLV14067BDWR2G
型号: NLV14067BDWR2G
厂家: ONSEMI    ONSEMI
描述:

Analog Multiplexers / Demultiplexers

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MC14067B  
Analog Multiplexers /  
Demultiplexers  
The MC14067 multiplexer/demultiplexer is a digitally controlled  
analog switch featuring low ON resistance and very low leakage  
current. This device can be used in either digital or analog  
applications.  
http://onsemi.com  
The MC14067 is a 16channel multiplexer/demultiplexer with an  
inhibit and four binary control inputs A, B, C, and D. These control  
inputs select 1of16 channels by turning ON the appropriate analog  
switch (see MC14067 truth table.)  
Features  
SOIC24  
DW SUFFIX  
CASE 751E  
Low OFF Leakage Current  
Matched Channel Resistance  
Low Quiescent Power Consumption  
Low Crosstalk Between Channels  
Wide Operating Voltage Range: 3 to 18 V  
Low Noise  
MARKING DIAGRAM  
14067B  
AWLYYWWG  
Pin for Pin Replacement for CD4067B  
These Devices are PbFree and are RoHS Compliant  
NLV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AECQ100  
Qualified and PPAP Capable  
A
= Assembly Location  
WL = Wafer Lot  
YY = Year  
MAXIMUM RATINGS (Voltages Referenced to V  
)
WW = Work Week  
SS  
G
= PbFree Package  
Symbol  
Parameter  
Value  
– 0.5 to + 18.0  
Unit  
V
V
DD  
DC Supply Voltage Range  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
V , V  
in out  
Input or Output Voltage Range  
(DC or Transient)  
– 0.5 to V + 0.5  
V
DD  
I
in  
Input Current (DC or Transient),  
per Control Pin  
10  
mA  
I
sw  
Switch Through Current  
25  
mA  
P
D
Power Dissipation, per Package  
(Note 1)  
500  
mW  
T
Ambient Temperature Range  
Storage Temperature Range  
– 55 to + 125  
– 65 to + 150  
260  
_C  
_C  
_C  
A
T
stg  
T
Lead Temperature  
(8–Second Soldering)  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Temperature Derating:  
Plastic “P and D/DW” Packages: 7.0 mW/_C From 65_C To 125_C  
This device contains protection circuitry to guard against damage due to high  
static voltages or electric fields. However, precautions must be taken to avoid  
applications of any voltage higher than maximum rated voltages to this  
highimpedance circuit. For proper operation, V and V should be constrained  
in  
out  
to the range V v (V or V ) v V  
.
SS  
in  
out  
DD  
Unused inputs must always be tied to an appropriate logic voltage level  
(e.g., either V or V ). Unused outputs must be left open.  
SS  
DD  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
May, 2013 Rev. 8  
MC14067B/D  
 
MC14067B  
TRUTH TABLE  
Control Inputs  
Selected  
Channel  
A
B
C
D
Inh  
X
0
1
0
X
0
0
1
X
0
0
0
X
0
0
0
1
0
0
0
None  
X0  
X1  
X2  
1
0
1
0
1
0
0
1
0
1
1
1
0
0
0
0
0
0
0
0
X3  
X4  
X5  
X6  
1
0
1
0
1
0
0
1
1
0
0
0
0
1
1
1
0
0
0
0
X7  
X8  
X9  
X10  
1
0
1
0
1
1
0
0
1
1
0
1
1
1
1
1
1
1
1
1
0
0
0
0
0
X11  
X12  
X13  
X14  
X15  
PIN ASSIGNMENT  
16Channel Analog  
Multiplexer/Demultiplexer  
X
X7  
X6  
X5  
X4  
X3  
1
2
3
4
5
6
24  
V
DD  
23 X8  
22 X9  
21 X10  
20 X11  
19 X12  
15  
10  
11  
14  
13  
9
INHIBIT  
A
B
CONTROLS  
C
D
X0  
8
X1  
X2  
X1  
X0  
A
7
18 X13  
17 X14  
16 X15  
15 INHIBIT  
7
X2  
6
X3  
8
5
X4  
9
COMMON  
OUT/IN  
4
X5  
X
1
10  
11  
12  
3
X6  
B
14  
13  
C
D
2
X7  
SWITCHES  
IN/OUT  
23  
22  
21  
20  
19  
18  
17  
16  
X8  
V
SS  
X9  
V
DD  
= PIN 24  
= PIN 12  
X10  
X11  
X12  
X13  
X14  
X15  
V
SS  
FUNCTIONAL DIAGRAM  
INHIBIT  
A
B
C
D
CONTROL  
INPUTS  
1-OF-16 DECODER  
X0  
X1  
X2  
X3  
X4  
X5  
X6  
X7  
X8  
X9  
X
IN/OUT  
X
OUT/IN  
X10  
X11  
X12  
X13  
X14  
X15  
http://onsemi.com  
2
MC14067B  
ELECTRICAL CHARACTERISTICS  
55°C  
Min Max Min  
25_C  
125_C  
Max Min Max  
(2)  
Typ  
Characteristic  
Symbol  
V
DD  
Test Conditions  
Unit  
SUPPLY REQUIREMENTS (Voltages Referenced to V  
)
SS  
Power Supply Voltage  
Range  
V
DD  
3.0  
18  
3.0  
18  
3.0  
18  
V
Quiescent Current Per  
Package  
I
5.0 Control Inputs: V  
5.0  
10  
20  
0.005  
0.010  
0.015  
5.0  
10  
20  
150  
300  
600  
mA  
DD  
in =  
10  
V
SS  
or V  
,
DD  
15 Switch I/O: V v V  
v
(3)  
SS  
I/O  
V
DD  
, and  
DV  
v500 mV  
switch  
Total Supply Current  
(Dynamic Plus  
Quiescent,  
I
5.0  
10  
15  
T
A
= 25_C only (The  
mA  
D(AV)  
(0.07 mA/kHz) f + I  
(0.20 mA/kHz) f + I  
(0.36 mA/kHz) f + I  
DD  
DD  
DD  
channel component,  
Typical  
(V – V )/R , is  
in  
out  
on  
Per Package  
not included.)  
CONTROL INPUTS — INHIBIT, A, B, C, D (Voltages Referenced to V  
)
SS  
LowLevel Input Voltage  
V
5.0  
10  
15  
R
= per spec,  
on  
= per spec  
1.5  
3.0  
4.0  
2.25  
4.50  
6.75  
1.5  
3.0  
4.0  
1.5  
3.0  
4.0  
V
V
IL  
IH  
in  
I
off  
HighLevel Input Voltage  
V
5.0  
10  
15  
R
= per spec,  
3.5  
7.0  
11  
3.5  
7.0  
11  
2.75  
5.50  
8.25  
3.5  
7.0  
11  
on  
I
off  
= per spec  
Input Leakage Current  
Input Capacitance  
I
15  
V
in  
= 0 or V  
0.1  
0.00001  
5.0  
0.1  
7.5  
1.0  
mA  
DD  
C
pF  
in  
SWITCHES IN/OUT AND COMMONS OUT/IN — X, Y (Voltages Referenced to V  
)
SS  
Recommended Peakto−  
Peak Voltage Into or  
Out of the Switch  
V
Channel On or Off  
0
V
0
0
V
0
0
V
V
pp  
I/O  
DD  
DD  
DD  
Recommended Static or  
Dynamic Voltage  
DV  
Channel On  
0
600  
600  
300  
mV  
switch  
(3)  
Across the Switch  
(Figure 1)  
Output Offset Voltage  
ON Resistance  
V
V
= 0 V, No Load  
10  
mV  
OO  
in  
(3)  
R
5.0 DV  
10  
15  
v 500 mV  
,
800  
400  
220  
250  
120  
80  
1050  
500  
280  
1300  
550  
320  
W
on  
switch  
V = V or V  
in IL IH  
(Control), and V  
in  
0 to V (Switch)  
DD  
DON Resistance  
Between  
DR  
5.0  
10  
15  
70  
50  
45  
25  
10  
10  
70  
50  
45  
135  
95  
65  
W
on  
Any Two Channels  
in the Same Package  
OffChannel Leakage  
I
off  
15  
V
in  
= V or V  
IH  
100  
0.05  
100  
1000 nA  
IL  
Current (Figure 2)  
(Control) Channel to  
Channel or Any One  
Channel  
Capacitance, Switch I/O  
C
C
Inhibit = V  
10  
pF  
pF  
I/O  
DD  
Capacitance, Common O/I  
Inhibit = V  
O/I  
DD  
(MC14067B)  
(MC14097B)  
100  
60  
Capacitance, Feedthrough  
(Channel Off)  
C
Pins Not Adjacent  
Pins Adjacent  
0.47  
pF  
I/O  
2. Data labeled “Typ” is not to be used for design purposes, but is intended as an indication of the IC’s potential performance.  
3. For voltage drops across the switch (DV  
) > 600 mV ( > 300 mV at high temperature), excessive V  
DD  
current may be drawn; i.e.  
switch  
DD  
the current out of the switch may contain both V and switch input components. The reliability of the device will be unaffected unless the  
Maximum Ratings are exceeded. (See first page of this data sheet.)  
http://onsemi.com  
3
 
MC14067B  
ELECTRICAL CHARACTERISTICS (C = 50 pF, T = 25_C)  
L
A
V
– V  
SS  
DD  
Vdc  
(4)  
Characteristic  
Symbol  
,t  
Typ  
Max  
Unit  
Propagation Delay Times  
t
ns  
PLH PHL  
Channel InputtoChannel Output (R = 200 kW)  
L
MC14067B  
(Figure 3)  
5.0  
10  
15  
35  
15  
12  
90  
40  
30  
Propagation Delay Times  
t
,t  
ns  
ns  
ns  
ns  
ns  
PLH PHL  
Channel InputtoChannel Output (R = 1.0 kW)  
MC14067B  
L
(Figure 3)  
5.0  
10  
15  
50  
30  
20  
Control InputtoChannel Output  
Channel TurnOn Time (R = 10 kW)  
MC14067B  
L
5.0  
10  
15  
240  
115  
75  
600  
290  
190  
t
, t  
PZH PZL  
Channel TurnOff Time (R = 300 kW)  
MC14067B  
L
(Figure 4)  
5.0  
10  
15  
250  
120  
75  
625  
300  
190  
t
,t  
PHZ PLZ  
Channel TurnOff Time (R = 10 kW)  
MC14067B  
L
(Figure 4)  
5.0  
10  
15  
625  
450  
350  
Any Pair of Address Inputs to Output  
MC14067B  
t
, t  
PLH PHL  
5.0  
10  
15  
280  
115  
85  
700  
290  
215  
Second Harmonic Distortion  
10  
0.3  
%
(R = 10 kW, f = 1 kHz, V = 5 V  
)
L
in  
pp  
ON Channel Bandwidth  
BW  
MHz  
[R = 50 W, V = 1/2 (V – V )  
(sinewave)]  
Off Channel Feedthrough Attenuation  
[R = 50 W, V = 1/2 (V V ) (sinewave)]  
SS pp  
L
in  
DD  
SS pp  
20 Log10 (V /V ) = 3 dB  
MC14067B  
(Figure 5)  
10  
10  
15  
out in  
– 40  
dB  
dB  
L
in  
DD  
f
in  
= 20 MHz – MC14067B  
(Figure 5)  
Channel Separation  
[R = 1 kW, V = 1/2 (V V ) (sinewave)]  
SS pp  
10  
10  
– 40  
30  
L
in  
DD  
f
= 20 MHz  
(Figure 6)  
in  
Crosstalk, Control InputstoCommon O/I  
(R1 = 1 kW, R = 10 kW,  
mV  
L
Control t = t = 20 ns, Inhibit = V )  
(Figure 7)  
r
f
SS  
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.  
http://onsemi.com  
4
 
MC14067B  
ORDERING INFORMATION  
Device  
Package  
Shipping  
SOIC24  
(PbFree)  
30 Units / Rail  
MC14067BDWG  
NLV14067BDWG*  
MC14067BDWR2G  
NLV14067BDWR2G*  
SOIC24  
(PbFree)  
1000 Units / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP  
Capable.  
OFF CHANNEL UNDER TEST  
V
DD  
ON SWITCH  
A
V
CONTROL  
SECTION  
OF IC  
SS  
CONTROL  
SECTION  
OF IC  
OTHER  
CHANNEL(S)  
V
V
SS  
LOAD  
V
DD  
SOURCE  
V
V
SS  
DD  
Figure 1. DV Across Switch  
Figure 2. Off Channel Leakage  
V
C
A
B
C
D
PULSE  
GENERATOR  
V
DD  
V
out  
A
B
C
D
C = 50 pF  
L
INH  
R
L
V
out  
V
in  
V
X
INH  
C = 50 pF  
L
R
L
V
DD  
V
SS  
V V  
SS DD  
20 ns  
20 ns  
V
in  
90%  
50%  
V
C
20 ns  
20 ns  
90%  
10%  
V
V
DD  
V
in  
50%  
90%  
V = V  
in  
V = V  
DD  
10%  
V
out  
50%  
SS  
X
SS  
t
t
PHL  
PLH  
t , t  
PZH PZL  
t , t  
PHZ PLZ  
50%  
V
out  
V = V  
in  
V = V  
V
out  
50%  
SS  
10%  
X
DD  
Figure 3. Propagation Delay Test Circuit  
and Waveforms Vin to Vout  
Figure 4. TurnOn and Delay TurnOff  
Test Circuit and Waveforms  
http://onsemi.com  
5
MC14067B  
V
DD  
A, B, and C inputs used to turn ON or OFF  
the switch under test.  
R
L
A
B
C
D
ON  
A
B
C
OFF  
INH  
V
out  
V
D
out  
C = 50 pF  
L
R
L
INH  
R
C = 50 pF  
L
L
V
in  
V
in  
Figure 5. Bandwidth and OffChannel  
Figure 6. Channel Separation  
Feedthrough Attenuation  
(Adjacent Channels Used for Setup)  
A
B
C
D
V
C
V
out  
R
INH  
C = 50 pF  
L
L
R1  
Figure 7. Crosstalk, Control to Common O/I  
V
A
B
C
D
A
V
B
INH  
V
DD  
C
V
DD  
L
V
out  
KEITHLEY 160  
DIGITAL  
MULTIMETER  
50%  
50%  
V
A
10 k  
V
DD  
1 kW  
RANGE  
X-Y  
PLOTTER  
V
B
t
t
PLH  
PHL  
V
SS  
V
out  
50%  
Figure 8. Channel Resistance (RON) Test Circuit  
Figure 9. Propagation Delay, Any Pair of  
Address Inputs to Output  
http://onsemi.com  
6
MC14067B  
TYPICAL RESISTANCE CHARACTERISTICS  
350  
300  
350  
300  
250  
200  
150  
100  
250  
200  
150  
T = 125°C  
A
T = 125°C  
A
100  
25°C  
25°C  
-ꢀ55°C  
-ꢀ55°C  
50  
0
50  
0
-ꢀ10 -ꢀ8.0 -ꢀ6.0 -ꢀ4.0 -ꢀ2.0  
-ꢀ10 -ꢀ8.0 -ꢀ6.0 -ꢀ4.0 -ꢀ2.0  
0
0.2 4.0 6.0 8.0  
10  
0
0.2 4.0  
6.0 8.0 10  
V , INPUT VOLTAGE (VOLTS)  
in  
V , INPUT VOLTAGE (VOLTS)  
in  
Figure 10. VDD = 7.5 V, VSS = 7.5 V  
Figure 11. VDD = 5.0 V, VSS = 5.0 V  
350  
300  
700  
600  
T = 25°C  
A
250  
200  
150  
100  
500  
400  
300  
200  
V
DD  
= 2.5 V  
T = 125°C  
5.0 V  
A
7.5 V  
25°C  
50  
0
100  
0
-ꢀ55°C  
-ꢀ10 -ꢀ8.0 -ꢀ6.0 -ꢀ4.0 -ꢀ2.0  
0
0.2 4.0  
6.0 8.0 10  
-ꢀ10 -ꢀ8.0 -ꢀ6.0 -ꢀ4.0 -ꢀ2.0  
0
0.2 4.0 6.0 8.0  
10  
V , INPUT VOLTAGE (VOLTS)  
in  
V , INPUT VOLTAGE (VOLTS)  
in  
Figure 13. Comparison at 25°C, VDD = VSS  
Figure 12. VDD = 2.5 V, VSS = 2.5 V  
http://onsemi.com  
7
MC14067B  
APPLICATIONS INFORMATION  
Figure A illustrates use of the Analog Multiplexer /  
Demultiplexer. The 0to5 V Digital Control signal is used  
signal which allows no margin at either peak. If voltage  
transients above V and/or below V are anticipated on  
DD  
SS  
to directly control a 5 V analog signal.  
the analog channels, external diodes (D ) are recommended  
pp  
x
The digital control logic levels are determined by V  
as shown in Figure B. These diodes should be small signal  
types able to absorb the maximum anticipated current surges  
during clipping.  
DD  
and V . The V voltage is the logic high voltage; the V  
SS  
DD  
SS  
voltage is logic low. For the example. V = + 5 V = logic  
DD  
high at the control inputs; V = GND = 0 V = logic low.  
The absolute maximum potential difference between V  
SS  
DD  
The maximum analog signal level is determined by V  
and V is 18.0 volts. Most parameters are specified up to  
DD  
SS  
and V . The analog voltage must swing neither higher than  
15 V which is the recommended maximum difference  
SS  
V
nor lower than V . The example shows a 5 V  
between V and V .  
DD  
SS  
pp  
DD SS  
+5 V  
V
DD  
V
SS  
+ꢀ5.0 V  
5 V  
SWITCH  
I/O  
p-p  
5 V  
ANALOG SIGNAL  
COMMON  
O/I  
p-p  
+2.5 V  
ANALOG SIGNAL  
+5 V  
GND  
MC14067B  
EXTERNAL  
CMOS  
DIGITAL  
0-TO-5 V DIGITAL  
CONTROL SIGNALS  
CIRCUITRY  
Figure A. Application Example  
V
DD  
V
DD  
D
D
D
X
X
X
X
SWITCH  
I/O  
COMMON  
O/I  
D
V
SS  
V
SS  
Figure B. External Germanium or Schottky Clipping Diodes  
http://onsemi.com  
8
MC14067B  
PACKAGE DIMENSIONS  
SOIC24 WB  
CASE 751E04  
ISSUE F  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
H
D
A
B
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSIONS b AND c APPLY TO THE FLAT SEC-  
TION OF THE LEAD AND ARE MEASURED  
BETWEEN 0.10 AND 0.25 FROM THE LEAD TIP.  
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS. MOLD  
FLASH, PROTRUSIONS OR GATE BURRS SHALL  
NOT EXCEED 0.15 mm PER SIDE. INTERLEAD  
FLASH OR PROTRUSION SHALL NOT EXCEED  
0.25 PER SIDE. DIMENSIONS D AND E1 ARE  
DETERMINED AT DATUM H.  
0.25 C  
24  
1
13  
12  
E
E1  
L
C
DETAIL A  
5. A1 IS DEFINED AS THE VERTICAL DISTANCE  
FROM THE SEATING PLANE TO THE LOWEST  
POINT ON THE PACKAGE BODY.  
24X  
b
PIN 1  
INDICATOR  
M
S
S
B
0.25  
C A  
MILLIMETERS  
DIM MIN  
MAX  
2.65  
0.29  
0.49  
0.32  
15.54  
TOP VIEW  
NOTE 3  
A
A1  
b
2.35  
0.13  
0.35  
h
x 45  
_
A
M
c
0.23  
D
E
15.25  
10.30 BSC  
E1  
e
h
L
M
7.40  
1.27 BSC  
7.60  
c
SEATING  
PLANE  
e
A1  
DETAIL A  
C
NOTE 3  
0.25  
0.41  
0
0.75  
0.90  
8
NOTE 5  
END VIEW  
SIDE VIEW  
_
_
RECOMMENDED  
SOLDERING FOOTPRINT*  
24X  
1.62  
24X  
0.52  
11.00  
1
1.27  
PITCH  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
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MC14067B/D  

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