NOA2301W [ONSEMI]
具有中断功能的数据近距离传感器;
| 型号： | NOA2301W |
| 厂家： | 
ONSEMI |
| 描述： | 具有中断功能的数据近距离传感器 传感器 |
| 文件： | 总20页 (文件大小：254K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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NOA2301W
Digital Proximity Sensor
with Interrupt
Description
The NOA2301W combines an advanced digital proximity sensor
2
and LED driver coupled with a tri−mode I C interface with interrupt
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capability in an integrated monolithic device. Multiple power
management features and very low active sensing power consumption
directly address the power requirements of battery operated mobile
phones and mobile internet devices.
The proximity sensor measures reflected light intensity with a high
degree of precision and excellent ambient light rejection. The
NOA2301W enables a proximity sensor system with a 16:1
programmable LED drive current range and a 30 dB overall proximity
detection range.
The NOA2301W is ideal for improving the user experience by
enhancing the screen interface with the ability to measure distance for
near/far detection in real time.
AMBIENT LIGHT PROXIMITY SENSOR
ORDERING INFORMATION
Features
• Proximity Sensor and LED Driver in One Device
2
• Proximity Detection Distance Threshold I C Programmable with
Device
Wafer Size
Temp Range
12−bit Resolution and Eight Integration Time Ranges (16−bit
effective resolution)
NOA2301W
200 mm wafer
−40°C to 80°C
• Effective for Measuring Distances up to 200 mm and Beyond
• Excellent IR and Ambient Light Rejection including Sunlight (up to
50K lux) and CFL Interference
• Programmable LED Drive Current from 10 mA to 160 mA in 5 mA
Steps, No External Resistor Required
• User Programmable LED Pulse Frequency
• Very Low Power Consumption
2
♦ Stand−by current 2.8 ꢀ A (monitoring I C interface only, Vdd=3V)
♦ Proximity sensing average operational current 100 ꢀA
♦ Average LED sink current 75 ꢀ A
• No External Components Required except the IR LED
and Power Supply Decoupling Caps
• Programmable interrupt function including independent
upper and lower threshold detection or threshold based
hysteresis
• These Devices are Pb−Free, Halogen Free/BFR Free
and are RoHS Compliant
Applications
• Level or Edge Triggered Interrupts
• Proximity persistence feature reduces interrupts by
providing hysteresis to filter fast transients such as
camera flash
• Senses human presence in terms of distance for saving
display power and preventing inadvertent command
initiation in applications such as:
♦ Smart phones, mobile internet devices, MP3 players,
GPS
• Automatic power down after single measurement or
continuous measurements with programmable interval
time
♦ Mobile device displays and backlit keypads
♦ Headphone use detection
♦ Cameras
• Wide Operating Voltage Range (2.3 V to 3.6 V)
• Wide Operating Temperature Range (−40°C to 80°C)
♦ Game controllers, media players
2
• I C Serial Communication Port
• Contactless Switches
♦ Standard mode – 100 kHz
♦ Fast mode – 400 kHz
♦ Touch−less switches for light controls
♦ Money detection, coin or paper
♦ Sanitary switches for medical environments
♦ High speed mode – 3.4 MHz
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
March, 2015 − Rev. 0
NOA2301W/D
NOA2301W
VDD_I2C
VDD
1μF
NOA2301
MCU
INT
INT
SCL
SDA
SCL
SDA
VDD
I2C Interface
&
Control
ADC
DSP
22μF
0.01μF
hꢁ
Proximity
IR Diode
LED
Drive
IR LED
LED
Osc
VSS_LED
VSS
Figure 1. NOA2301W Application Block Diagram
Table 1. PAD FUNCTION DESCRIPTION
Pad
1
Pad Name
VDD
Description
Power pad
2
VSS
Ground pad
3
LED_GND
LED
Ground pad for IR LED driver
IR LED output pad
4
5
INT
Interrupt output pad, open−drain
6
SDA
Bi−directional data signal for communications with the I2C master
External I2C clock supplied by the I2C master
7
SCL
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2
NOA2301W
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
V
Input power supply
VDD
4.0
Input voltage range
V
in
−0.3 to VDD + 0.2
V
Output voltage range
V
out
−0.3 to VDD + 0.2
V
Maximum Junction Temperature
Storage Temperature
T
100
°C
°C
kV
V
J(max)
T
−40 to 80
STG
ESD Capability, Human Body Model (Note 1)
ESD Capability, Charged Device Model (Note 1)
Moisture Sensitivity Level
ESD
2
HBM
CDM
ESD
500
3
MSL
−
Lead Temperature Soldering (Note 2)
T
SLD
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Charged Device Model tested per ESD−STM5.3.1−1999
Latchup Current Maximum Rating: 100 mA per JEDEC standard: JESD78
2. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
Table 3. OPERATING RANGES
Rating
Symbol
Min
Typ
Max
3.6
5
Unit
V
Power supply voltage
VDD
2.3
Power supply current, stand−by mode (VDD = 3.0 V)
IDD
2.8
47
ꢀ A
ꢀ A
STBY
Power supply average current, PS operating 300 ꢀ s integration
IDD
100
PS
time and 100 ms intervals
LED average sink current, PS operating at 300 ꢀ s integration time
I
75
ꢀ
A
LED
and 100 ms intervals and LED current set at 50 mA
2
I C signal voltage (Note 3)
VDD_I2C
1.6
1.8
2.0
V
V
Low level input voltage (VDD_I2C related input levels)
High level input voltage (VDD_I2C related input levels)
Hysteresis of Schmitt trigger inputs
V
IL
−0.3
0.3 VDD_I2C
VDD_I2C + 0.2
V
IH
0.7 VDD_I2C
0.1 VDD_I2C
V
V
hys
V
Low level output voltage (open drain) at 3 mA sink current (INT)
V
0.2 VDD_I2C
10
V
OL
Input current of IO pin with an input voltage between 0.1 VDD and
0.9 VDD
I
−10
ꢀ
A
I
Output low current (INT)
I
OL
3
−
mA
Operating free−air temperature range
T
A
−40
80
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
2
3. The I C interface is functional to 3.0 V, but timing is only guaranteed up to 2.0 V. High Speed mode is guaranteed to be functional to 2.0 V.
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3
NOA2301W
Table 4. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply over 2.3 V < VDD < 3.6 V,
1.7 V < VDD_I2C < 1.9 V, −40°C < T < 80°C, 10 pF < Cb < 100 pF) (See Note 4)
A
Parameter
Symbol
Min
Typ
Max
Unit
mA
mA
%
LED pulse current
I
10
160
LED_pulse
LED pulse current step size
LED pulse current accuracy
Interval Timer Tolerance
I
5
LED_pulse_step
I
−20
−35
+20
+35
LED_acc
Tol
%
f_timer
Edge Triggered Interrupt Pulse Width
SCL clock frequency
PW
50
ꢀ
S
INT
f
10
100
100
4.0
100
400
3400
−
kHz
SCL_std
f
SCL_fast
f
SCL_hs
Hold time for START condition. After this period, the first
clock pulse is generated.
T
ꢀ S
ꢀ S
ꢀ S
ꢀ S
nS
nS
nS
nS
nS
ꢀ S
HD;STA_std
HD;STA_fast
t
0.6
−
t
0.160
4.7
−
HD;STA_hs
Low period of SCL clock
t
−
LOW_std
t
1.3
−
LOW_fast
t
0.160
4.0
−
LOW_hs
High period of SCL clock
t
−
HIGH_std
t
0.6
−
HIGH_fast
t
0.060
0
−
HIGH_hs
HD;DAT_d_std
SDA Data hold time
t
3.45
0.9
0.070
−
t
0
HD;DAT_d_fast
t
0
HD;DAT_d_hs
SDA Data set−up time
t
250
100
10
SU;DAT_std
t
−
SU;DAT_fast
t
SU;DAT_hs
Rise time of both SDA and SCL (input signals) (Note 5)
Fall time of both SDA and SCL (input signals) (Note 5)
Rise time of SDA output signal (Note 5)
Fall time of SDA output signal (Note 5)
Set−up time for STOP condition
t
20
1000
300
40
r_INPUT_std
r_INPUT_fast
t
20
t
10
r_INPUT_hs
t
20
300
300
40
f_INPUT_std
t
20
f_INPUT_fast
t
10
f_INPUT_hs
t
20
300
300
80
r_OUT_std
t
20 + 0.1 Cb
10
r_OUT_fast
t
r_OUT_hs
t
20
300
300
80
f_OUT_std
t
20 + 0.1 Cb
10
f_OUT_fast
t
f_OUT_hs
t
4.0
−
SU;STO_std
t
0.6
−
SU;STO_fast
t
0.160
−
SU;STO_hs
4. Refer to Figure 2 and Figure 3 for more information on AC characteristics.
5. The rise time and fall time are dependent on both the bus capacitance (Cb) and the bus pull−up resistor R Max and min pull−up resistor
p.
values are determined as follows: R
= t
r (max)
/(0.8473 x Cb) and R
= (Vdd_I2C – V )/I .
ol(max) ol
p(max)
p(min)
6. Cb = capacitance of one bus line, maximum value of which including all parasitic capacitances should be less than 100 pF. Bus capacitance
up to 400 pF is supported, but at relaxed timing.
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4
NOA2301W
Table 4. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply over 2.3 V < VDD < 3.6 V,
1.7 V < VDD_I2C < 1.9 V, −40°C < T < 80°C, 10 pF < Cb < 100 pF) (See Note 4)
A
Parameter
Symbol
Min
4.7
Typ
Max
−
Unit
Bus free time between STOP and START condition
t
ꢀ S
BUF_std
t
1.3
−
BUF_fast
t
0.160
10
−
BUF_hs
Capacitive load for each bus line (including all parasitic
capacitance) (Note 6)
C
100
pF
V
b
Noise margin at the low level (for each connected de-
vice − including hysteresis)
V
0.1 VDD
0.2 VDD
−
−
nL
Noise margin at the high level (for each connected de-
vice − including hysteresis)
V
nH
V
4. Refer to Figure 2 and Figure 3 for more information on AC characteristics.
5. The rise time and fall time are dependent on both the bus capacitance (Cb) and the bus pull−up resistor R Max and min pull−up resistor
p.
values are determined as follows: R
= t
r (max)
/(0.8473 x Cb) and R
= (Vdd_I2C – V )/I .
ol(max) ol
p(max)
p(min)
6. Cb = capacitance of one bus line, maximum value of which including all parasitic capacitances should be less than 100 pF. Bus capacitance
up to 400 pF is supported, but at relaxed timing.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Table 5. OPTICAL CHARACTERISTICS (Unless otherwise specified, these specifications are for VDD = 3.0 V, T = 25°C)(Note 7)
A
Parameter
Symbol
Min
Typ
Max
Unit
Detection range, Tint = 4800 ꢀ s, I
= 160 mA, 860 nm IR LED (OS-
D
200
mm
LED
PS_4800_WHITE_
RAM SFH4650), White Reflector (RGB = 220, 224, 223), LED Modula-
tion Frequency = 308 kHz, Sample Delay = 250 ns, SNR = 7:1
MOD
Detection range, Tint = 4800 ꢀ s, I
RAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
= 160 mA, 860 nm IR LED (OS-
D
D
D
D
D
148
66
80
88
90
88
76
74
62
48
64
36
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
LED
PS_4800_WHITE_
160
Detection range, Tint = 4800 ꢀ s, I = 25 mA, 860 nm IR LED (OS-
LED
PS_4800_WHITE_
RAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
25
Detection range, Tint = 2400 ꢀ s, I = 50 mA, 860 nm IR LED (OS-
LED
PS_2400_WHITE_
RAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
25
Detection range, Tint = 1800 ꢀ s, I = 75 mA, 860 nm IR LED (OS-
LED
PS_1800_WHITE_
RAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
75
Detection range, Tint = 1200 ꢀ s, I = 100 mA, 860 nm IR LED (OS-
LED
PS_1200_WHITE_
RAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
100
Detection range, Tint = 600 ꢀ s, I = 125 mA, 860 nm IR LED (OS-
D
LED
PS_600_WHITE_
RAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
125
Detection range, Tint = 600 ꢀ s, I = 100 mA, 860 nm IR LED (OS-
D
LED
PS_600_WHITE_
RAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
100
Detection range, Tint = 300 ꢀ s, I = 150 mA, 860 nm IR LED (OS-
D
D
D
LED
PS_300_WHITE_
RAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
150
Detection range, Tint = 300 ꢀ s, I = 100 mA, 860 nm IR LED (OS-
LED
PS_300_WHITE_
RAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
100
Detection range, Tint = 150 ꢀ s, I = 100 mA, 860 nm IR LED (OS-
LED
PS_150_WHITE_
RAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
100
Detection range, Tint = 1200 ꢀ s, I = 100 mA, 860 nm IR LED (OS-
D
LED
PS_1200_GREY_
RAM SFH4650), Grey Reflector (RGB = 162, 162, 160), SNR = 6:1
100
Detection range, Tint = 2400 ꢀ s, I = 150 mA, 860 nm IR LED (OS-
D
LED
PS_2400_BLACK_
RAM SFH4650), Black Reflector (RGB = 16, 16, 15), SNR = 6:1
150
2
Saturation power level
P
0.8
11
mW/cm
DMAX
Measurement resolution, Tint = 150 ꢀ s
MR
150
bits
7. Measurements performed with default modulation frequency and sample delay unless noted.
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5
NOA2301W
Table 5. OPTICAL CHARACTERISTICS (Unless otherwise specified, these specifications are for VDD = 3.0 V, T = 25°C)(Note 7)
A
Parameter
Measurement resolution, Tint = 300 ꢀ s
Symbol
Min
Typ
12
13
14
15
15
16
16
Max
Unit
bits
bits
bits
bits
bits
bits
bits
MR
MR
300
600
Measurement resolution, Tint = 600 ꢀ s
Measurement resolution, Tint = 1200 ꢀ s
Measurement resolution, Tint = 1800 ꢀ s
Measurement resolution, Tint = 2400 ꢀ s
Measurement resolution, Tint = 3600 ꢀ s
Measurement resolution, Tint = 4800 ꢀ s
MR
MR
MR
MR
MR
1200
1800
2400
3600
4800
7. Measurements performed with default modulation frequency and sample delay unless noted.
Figure 2. AC Characteristics, Standard and Fast Modes
Figure 3. AC Characteristics, High Speed Mode
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6
NOA2301W
TYPICAL CHARACTERISTICS
16K
14K
12K
10K
8K
9K
160 mA
8K
160 mA
7K
6K
80 mA
80 mA
5K
4K
3K
2K
40 mA
20 mA
6K
40 mA
20 mA
4K
2K
0
1K
0
10 mA
10 mA
0
0
50
100
150
200
250
200
250
50
100
150
200
DISTANCE (mm)
DISTANCE (mm)
Figure 4. PS Response vs. Distance and LED
Current (1200 ms Integration Time, White
Reflector (RGB = 220, 224, 223))
Figure 5. PS Response vs. Distance and LED
Current (1200 ms Integration Time, Grey
Reflector (RGB = 162, 162, 160))
1200
1000
800
45K
40K
35K
30K
4800 ꢀ s
160 mA
25K
20K
15K
10K
600
2400 ꢀ s
300 ꢀ s
80 mA
400
150 ꢀ s
40 mA
20 mA
1200 ꢀ s
200
0
600 ꢀ s
5K
0
10 mA
0
50
100
150
0
50
100
150
200
250
DISTANCE (mm)
DISTANCE (mm)
Figure 6. PS Response vs. Distance and LED
Current (1200 ms Integration Time, Black
Reflector (RGB = 16, 16, 15))
Figure 7. PS Response vs. Distance and
Integration Time (80 mA LED Current, White
Reflector (RGB = 220, 224, 223))
3500
3000
2500
2000
1500
1000
2500
2000
1500
1000
2.3 V
3.0 V
3.6 V
Ambient
CFL 3000K (2kLux)
Halogen (40kLux)
Incandescent (6kLux)
White LED (7kLux)
500
0
500
0
0
50
100
150
200
0
50
100
150
200
250
DISTANCE (mm)
DISTANCE (mm)
Figure 8. PS Response vs. Distance and Supply
Voltage (1200 ms Integration Time, 40 mA LED
Current, White Reflector (RGB = 220, 224, 223))
Figure 9. PS Ambient Rejection (1200 ms
Integration Time, 100 mA LED Current, White
Reflector (RGB = 220, 224, 223))
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7
NOA2301W
TYPICAL CHARACTERISTICS
25
20
15
10
180
160
140
120
100
80
60
40
5
0
20
0
2.0
2.5
3.0
(V)
3.5
4.0
2.0 2.2 2.4
2.6 2.8 3.0
(V)
3.2 3.4
3.6 3.8
V
V
DD
DD
Figure 10. Supply Current vs. Supply Voltage
Figure 11. Supply Current vs. Supply Voltage
TINT = 300 ms, TR = 100 ms
TINT = 1200 ms, TR = 50 ms
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NOA2301W
Description of Operation
Proximity Sensor Architecture
NOA2301W combines an advanced digital proximity
sensor, LED driver and a tri−mode I C interface as shown in
obviously cannot exceed the LED pulse width or there
would be no sampling of the data when the LED is
illuminated. There is also a minimum step size of 125 ns.
2
Figure 1. The LED driver draws a modulated current
through the external IR LED to illuminate the target. The
LED current is programmable over a wide range. The
infrared light reflected from the target is detected by the
proximity sensor photo diode. The proximity sensor
The delay values are programmed as follows:
0 or 1: No delay
2−31: Selects (N−1)*125 ns
N must be less than or equal to the
PS_LED_FREQUENCY Value
The default delay is 0x05 (500 ns)
employs
a
sensitive photo diode fabricated in
ON Semiconductor’s standard CMOS process technology.
The modulated light received by the on−chip photodiode is
converted to a digital signal using a variable slope
integrating ADC with a default resolution (at 300 ꢀ s) of
12−bits, unsigned. The signal is processed to remove all
unwanted signals resulting in a highly selective response to
the generated light signal. The final value is stored in the
Table 6 shows some common LED pulse frequencies and
sample delays and the resulting register values.
Table 6. COMMON LED PULSE FREQUENCY SETTINGS
PS_LED_
FREQUENCY
Register
PS_SAMPLE_
DELAY
Register
(0x0E) Value
LED Pulse
Frequency
(KHz)
Sample
Delay
(ns)
2
PS_DATA register where it can be read by the I C interface.
(0x0D) Value
200
200
200
250
250
500
500
1000
250
500
750
250
500
250
500
250
0x14
0x14
0x14
0x10
0x10
0x08
0x08
0x04
0x03
0x05
0x07
0x03
0x05
0x03
0x05
0x03
Proximity Sensor LED Frequency and Delay Settings
The LED current modulation frequency is user selectable
from approximately 128 KHz to 2 MHz using the PS_LED_
FREQUENCY register. An internal precision 4 MHz
oscillator provides the frequency reference. The 4 MHz
clock is divided by the value in register 0x0D to determine
the pulse rate. The default is 0x10 (16) which results in an
LED pulse frequency of 250 KHz (4 ꢀ s period). Values
below 200 KHz and above 1 MHz are not recommended.
Switching high LED currents can result in noise injected
into the proximity sensor receiver causing inaccurate
readings. The PS receiver has a user programmable delay
from the LED edge to when the receiver samples the data
(PS_SAMPLE_DELAY – register 0x0E). Longer delays
may reduce the effect of switching noise but also reduce the
sensitivity.
I2C Interface
2
The NOA2301W acts as an I C slave device and supports
single register and block register read and write operations.
All data transactions on the bus are 8 bits long. Each data
byte transmitted is followed by an acknowledge bit. Data is
transmitted with the MSB first.
Since the value of the delay is dependent on the pulse
frequency, its value must be carefully computed. The value
Device
Address
Register
Address
D[7:0] ACK
Register
Data
A[6:0] WRITE ACK
D[7:0] ACK
011 0111
0
0
0000 0110
0
0000 0000
0
0x6E
7
8
8
Start
Condition
Stop
Condition
Figure 12. I2C Write Command
2
Figure 12 shows an I C write operation. Write
NOA2301W register bank. The NOA2301W will send an
ACK after each byte and increment the address pointer by
one in preparation for the next transfer. Write transactions
2
transactions begin with the master sending an I C start
sequence followed by the seven bit slave address
(NOA2301W = 0x37) and the write(0) command bit. The
NOA2301W will acknowledge this byte transfer with an
appropriate ACK. Next the master will send the 8 bit register
address to be written to. Again the NOA2301W will
acknowledge reception with an ACK. Finally, the master
will begin sending 8 bit data segment(s) to be written to the
2
2
are terminated with either an I C STOP or with another I C
START (repeated START).
2
Figure 13 shows an I C read command sent by the master
to the slave device. Read transactions begin in much the
same manner as the write transactions in that the slave
address must be sent with a write(0) command bit.
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9
NOA2301W
Device
Address
Register
Address
Register
Data
A[6:0] WRITE ACK
011 0111
0x6E
D[7:0] ACK
D[7:0] ACK
0
0
0000 0110
0
0000 0000
0
7
8
8
Start Condition
Device
Stop Condition
Register
Data [A]
Register
Data [A+1]
Address
A[6:0] READ ACK
011 0111
0x6F
D[7:0] ACK
D[7:0] NACK
1
0
bbbb bbbb
0
bbbb bbbb 1
7
8
8
Start Condition
Stop Condition
Figure 13. I2C Read Command
After the NOA2301W sends an ACK, the master sends the
register address as if it were going to be written to. The
NOA2301W will acknowledge this as well. Next, instead of
performance characteristics of its I/O cells in preparation for
2
2
I C transactions at the I C high speed data protocol rates.
2
From then on, standard I C commands may be issued by the
2
sending data as in a write, the master will re−issue an I C
master, including repeated START commands. When the
2
2
START (repeated start) and again send the slave address and
this time the read(1) command bit. The NOA2301W will
then begin shifting out data from the register just addressed.
If the master wishes to receive more data (next register
address), it will ACK the slave at the end of the 8 bit data
transmission, and the slave will respond by sending the next
byte, and so on. To signal the end of the read transaction, the
master will send a NACK bit at the end of a transmission
I C master terminates any I C transaction with a STOP
sequence, the master and all slave devices immediately
revert back to standard/fast mode I/O performance.
By using a combination of high−speed mode and a block
write operation, it is possible to quickly initialize the
2
NOA2301W I C register bank.
NOA2301W Data Registers
NOA2301W operation is observed and controlled by
internal data registers read from and written to via the
2
followed by an I C STOP.
The NOA2301W also supports I C high−speed mode.
2
2
external I C interface. Registers are listed in Table 7.
The transition from standard or fast mode to high−speed
Default values are set on initial power up or via a software
reset command (register 0x01).
2
mode is initiated by the I C master. A special reserve device
address is called for and any device that recognizes this and
supports high speed mode immediately changes the
2
The I C Slave Address of the NOA2301W is 0x37.
Table 7. NOA2301W DATA REGISTERS
Address
0x00
0x01
0x02
0x0D
0x0E
0x0F
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x40
0x41
0x42
Type
R
Name
PART_ID
Description
NOA2301W part number and revision IDs
Software reset control
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
R
RESET
INT_CONFIG
Interrupt pin functional control settings
PS LED Pulse Frequency
PS_LED_FREQUENCY
PS_SAMPLE_DELAY
PS_LED_CURRENT
PS_TH_UP_MSB
PS_TH_UP_LSB
PS_TH_LO_MSB
PS_TH_LO_LSB
PS_FILTER_CONFIG
PS_CONFIG
PS Sample Delay
PS LED pulse current
PS Interrupt upper threshold, most significant bits
PS Interrupt upper threshold, least significant bits
PS Interrupt lower threshold, most significant bits
PS Interrupt lower threshold, least significant bits
PS Interrupt Filter configuration
PS Integration time configuration
PS Interval time configuration
PS_INTERVAL
PS_CONTROL
INTERRUPT
PS Operation mode control
Interrupt status
R
PS_DATA_MSB
PS_DATA_LSB
PS measurement data, most significant bits
PS measurement data, least significant bits
R
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10
NOA2301W
PART_ID Register (0x00)
The PART_ID register provides part and revision identification. These values are hard−wired at the factory and cannot be
modified.
Table 8. PART_ID Register (0x00)
Bit
7
6
5
4
3
2
1
0
Field
Part number ID
Revision ID
Field
Bit
7:4
3:0
Default
0101
NA
Description
Part number ID
Revision ID
Part number identification
Silicon revision number
RESET Register (0x01)
Software reset is controlled by this register. Setting this
register followed by an I2C_STOP sequence will
immediately reset the NOA2301W to the default startup
standby state. Triggering the software reset has virtually the
same effect as cycling the power supply tripping the internal
Power on Reset (POR) circuitry.
Table 9. RESET Register (0x01)
Bit
7
6
5
4
3
2
1
0
Field
NA
SW_reset
Field
Bit
7:1
0
Default
XXXXXXX
0
Description
NA
SW_reset
Don’t care
Software reset to startup state
INT_CONFIG Register (0x02)
INT_CONFIG register controls the external interrupt pin function.
Table 10. INT_CONFIG Register (0x02)
Bit
7
6
5
4
3
2
1
0
Field
NA
edge_triggered
auto_clear
polarity
Field
Bit
7:3
2
Default
XXXXX
0
Description
NA
Don’t care
Edge_triggered
auto_clear
polarity
0
1
Interrupt pin stays asserted while the INTERRUPT register bit is set (level)
Interrupt pin pulses at the end of each measurement while the INTERRUPT
register bit is set
1
0
1
0
0
When an interrupt is triggered, the interrupt pin remains asserted until cleared
by an I C read of INTERRUPT register
2
1
0
1
Interrupt pin state is updated after each measurement
Interrupt pin active low when asserted
Interrupt pin active high when asserted
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11
NOA2301W
PS_LED_FREQUENCY Register (0x0D)
The LED FREQUENCY register controls the frequency
of the LED pulses. The LED modulation frequency is
determined by dividing 4 MHz by the register value. Valid
divisors are 2−31. The default value is 16 which results in an
LED pulse frequency of 250 KHz (one pulse every 4 ꢀ s).
Table 11. PS_LED_FREQUENCY Register (0x0D)
Bit
7
6
5
4
3
2
1
0
Field
NA
LED_modulation frequency
Field
Bit
7:5
4:0
Default
XXX
Description
NA
LED_modulation _frequency
Don’t care
10000
Defines the divider of the 4MHz clock to generate the LED pulses.
Valid values are 2−31
PS_SAMPLE_DELAY Register (0x0E)
The PS_SAMPLE_DELAY register controls the time
delay after an LED pulse edge before the resulting signal is
sampled by the proximity sensor. This can be used to reduce
the effect of noise caused by the LED current switching.
There is no delay for programmed values of 0x00 or 0x001.
For other values the delay is (N−1)*125 ns, where N is the
decimal value of the register. Default value is 0x05 (500 ns).
N must be less than or equal to the value in register 0x0D
(PS_LED_FREQUENCY). See the Description of
Operation section for more information on programming
this register.
Table 12. PS_SAMPLE_DELAY Register (0x0E)
Bit
7
6
5
4
3
2
1
0
Field
NA
sample_delay
Field
Bit
Default
XXX
Description
NA
sample_delay
7:5
4:0
Don’t care
Defines the delay from the LED pulse edge before the pulse is sampled
00101
PS_LED_CURRENT Register (0x0F)
The LED_CURRENT register controls how much current
the internal LED driver sinks through the IR LED during
modulated illumination. The current sink range is 5 mA plus
a binary weighted value of the LED_Current register times
5 mA, for an effective range of 10 mA to 160 mA in steps of
5 mA. The default setting is 50 mA. A register setting of 00
turns off the LED Driver.
Table 13. PS_LED_CURRENT Register (0x0F)
Bit
7
6
5
4
3
2
1
0
Field
NA
LED_Current
Field
Bit
7:5
4:0
Default
XXX
Description
NA
LED_Current
Don’t care
01001
Defines current sink during LED modulation. Binary weighted value times 5 mA plus 5 mA
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12
NOA2301W
PS_TH Registers (0x10 – 0x13)
With hysteresis not enabled (see PS_CONFIG register),
the PS_TH registers set the upper and lower interrupt
thresholds of the proximity detection window. Interrupt
functions compare these threshold values to data from the
PS_DATA registers. Measured PS_DATA values outside
this window will set an interrupt according to the
INT_CONFIG register settings.
threshold hysteresis value where the interrupt would be
cleared. Setting the PS_hyst_trig low reverses the function
such that the PS_TH_LO register sets the lower threshold at
which an interrupt will be set and the PS_TH_UP represents
the hysteresis value at which the interrupt would be
subsequently cleared. Hysteresis functions only apply in
“auto_clear” INT_CONFIG mode.
With hysteresis enabled, threshold settings take on a
different meaning. If PS_hyst_trig is set, the PS_TH_UP
register sets the upper threshold at which an interrupt will be
set, while the PS_TH_LO register then sets the lower
The controller software must ensure the settings for LED
current, sensitivity range, and integration time (LED pulses)
are appropriate for selected thresholds. Setting thresholds to
extremes (default) effectively disables interrupts.
Table 14. PS_TH_UP Registers (0x10 – 0x11)
Bit
7
6
5
4
3
2
1
0
Field
PS_TH_UP_MSB(0x10), PS_TH_UP_LSB(0x11)
Field
Bit
7:0
7:0
Default
0xFF
Description
Upper threshold for proximity detection, MSB
Upper threshold for proximity detection, LSB
PS_TH_UP_MSB
PS_TH_UP_LSB
0xFF
Table 15. PS_TH_LO Registers (0x12 – 0x13)
Bit
7
6
5
4
3
2
1
0
Field
PS_TH_LO_MSB(0x12), PS_TH_LO_LSB(0x13)
Field
Bit
7:0
7:0
Default
0x00
Description
Lower threshold for proximity detection, MSB
Lower threshold for proximity detection, LSB
PS_TH_LO_MSB
PS_TH_LO_LSB
0x00
PS_FILTER_CONFIG Register (0x14)
PS_FILTER_CONFIG register provides a hardware
mechanism to filter out single event occurrences or similar
anomalies from causing unwanted interrupts. Two 4 bit
registers (M and N) can be set with values such that M out
of N measurements must exceed threshold settings in order
to set an interrupt. The default setting of 1 out of 1 effectively
turns the filter off and any single measurement exceeding
thresholds can trigger an interrupt. N must be greater than or
equal to M. A setting of 0 for either M or N is not allowed
and disables the PS interrupt.
Table 16. PS_FILTER_CONFIG Register (0x14)
Bit
7
6
5
4
3
2
1
0
Field
filter_N
Default
filter_M
Field
Bit
Description
filter_N
filter_M
7:4
3:0
0001
0001
Filter N
Filter M
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13
NOA2301W
PS_CONFIG Register (0x15)
Proximity measurement sensitivity is controlled by
specifying the integration time. The integration time sets the
number of LED pulses during the modulated illumination.
The LED modulation frequency remains constant with a
period of 1.5 ꢀ s. Changing the integration time affects the
sensitivity of the detector and directly affects the power
consumed by the LED. The default is 1200 ꢀ s integration
period.
Hyst_enable and hyst_trigger work with the PS_TH
(threshold) settings to provide jitter control of the INT
function.
Table 17. PS_CONFIG Register (0x15)
Bit
7
6
5
4
3
2
1
0
Field
NA
hyst_enable
hyst_trigger
NA
integration_time
Field
Bit
7:6
5
Default
Description
NA
XX
0
Don’t Care
hyst_enable
hyst_trigger
0
1
Disables hysteresis
Enables hysteresis
4
0
0
Lower threshold with hysteresis
Upper threshold with hysteresis
1
NA
3
X
Don’t care
000
001
010
011
100
101
110
111
integration_time
2:0
011
150 ꢀ s integration time
300 ꢀ s integration time
600 ꢀ s integration time
1200 ꢀ s integration time
1800 ꢀ s integration time
2400 ꢀ s integration time
3600 ꢀs integration time
4800 ꢀs integration time
PS_INTERVAL Register (0x16)
The PS_INTERVAL register sets the wait time between
consecutive proximity measurements in PS_Repeat mode.
The register is binary weighted times 10 in milliseconds plus
10 ms. The range is therefore 10 ms to 1.28 s. The default
startup value is 0x04 (50 ms).
Table 18. PS_INTERVAL Register (0x16)
Bit
7
6
5
4
3
2
1
0
Field
NA
interval
Field
Bit
Default
Description
NA
Interval
7
X
Don’t care
0x00 to 0x7F
6:0
0x04
Interval time between measurement cycles. Binary weighted value
times 10 ms plus a 10 ms offset.
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14
NOA2301W
PS_CONTROL Register (0x17)
The PS_CONTROL register is used to control the
functional mode and commencement of proximity sensor
measurements. The proximity sensor can be operated in
either a single shot mode or consecutive measurements
taken at programmable intervals.
Both single shot and repeat modes consume a minimum
of power by immediately turning off LED driver and sensor
circuitry after each measurement. In both cases the quiescent
current is less than the IDD
parameter. These automatic
STBY
power management features eliminate the need for power
down pins or special power down instructions.
Table 19. PS_CONTROL Register (0x17)
Bit
7
6
5
4
3
2
1
0
Field
NA
PS_Repeat PS_OneShot
Field
Bit
7:2
1
Default
Description
NA
XXXXXX
Don’t care
Initiates new measurements at PS_Interval rates
PS_Repeat
0
0
PS_OneShot
0
Triggers proximity sensing measurement. In single shot mode this bit clears
itself after cycle completion.
INTERRUPT Register (0x40)
The INTERRUPT register displays the status of the interrupt pin. If “auto_clear” is disabled (see INT_CONFIG register),
reading this register also will clear the interrupt.
Table 20. INTERRUPT Register (0x40)
Bit
7
6
5
4
3
2
1
0
Field
NA
INT
PS_intH
PS_intL
Field
Bit
7:5
4
Default
Description
NA
XXX
0
Don’t care
INT
Status of external interrupt pin (1 is asserted)
Don’t care
NA
3:2
1
XX
0
PS_intH
PS_intL
Interrupt caused by PS exceeding maximum
Interrupt caused by PS falling below the minimum
0
0
PS_DATA Registers (0x41 – 0x42)
The PS_DATA registers store results from completed
proximity measurements. When an I C read operation
begins, the current PS_DATA registers are locked until the
operation is complete (I2C_STOP received) to prevent
possible data corruption from a concurrent measurement
cycle.
2
Table 21. PS_DATA Registers (0x41 – 0x42)
Bit
7
6
5
4
3
2
1
0
Field
PS_DATA_MSB(0x41), PS_DATA_LSB(0x42)
Field
Bit
7:0
7:0
Default
0x00
Description
Proximity measurement data, MSB
PS_DATA_MSB
PS_DATA_LSB
0x00
Proximity measurement data, LSB
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15
NOA2301W
Proximity Sensor Operation
NOA2301W operation is divided into three phases: power
up, configuration and operation. On power up the device
initiates a reset which initializes the configuration registers
to their default values and puts the device in the standby
state. At any time, the host system may initiate a software
reset by writing 0x01 to register 0x01. A software reset
performs the same function as a power−on−reset.
Sending an I2C_STOP sequence at the end of the write
signals the internal state machines to wake up and begin the
next measurement cycle. Figure 14 and Figure 15 illustrate
the activity of key signals during a proximity sensor
measurement cycle. The cycle begins by starting the
precision oscillator and powering up the proximity sensor
receiver. Next, the IR LED current is modulated according
to the LED current setting at the chosen LED frequency and
the values during both the on and off times of the LED are
stored (illuminated and ambient values). Finally, the
proximity reading is calculated by subtracting the ambient
value from the illuminated value and storing the result in the
16 bit PS_Data register. In One−shot mode, the PS receiver
is then powered down and the oscillator is stopped. If Repeat
mode is set, the PS receiver is powered down for the
specified interval and the process is repeated. With default
configuration values (receiver integration time = 1200 ꢀ s),
the total measurement cycle will be less than 2 ms.
The configuration phase may be skipped if the default
register values are acceptable, but typically it is desirable to
change some or all of the configuration register values.
Configuration is accomplished by writing the desired
configuration values to registers 0x02 through 0x17.
Writing to configuration registers can be done with either
2
individual I C byte−write commands or with one or more
2
I C block write commands. Block write commands specify
the first register address and then write multiple bytes of data
in sequence. The NOA2301W automatically increments the
register address as it acknowledges each byte transfer.
Proximity sensor measurement is initiated by writing
appropriate values to the CONTROL register (0x17).
I2C Stop
50 − 200μs
9μs
PS Power
0 − 100μs
4MHz Osc On
~600μs
LED Burst
8 clks 12μs
Integration Time
Integration
100 − 150μs
Data Available
Figure 14. Proximity Sensor One−Shot Timing
(Repeat)
Interval
I2C Stop
50 − 200μs
9μs
0 − 100μs
PS Power
4MHz Osc On
~600μs
LED Burst
8 clks 12μs
Integration Time
Integration
100 − 150μs
Data Available
Figure 15. Proximity Sensor Repeat Timing
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16
NOA2301W
Example Programming Sequence
The following pseudo code configures the NOA2301W
interrupt determines if the interrupts was caused by the
proximity sensor and if so, reads the PS_Data from the
device, sets a flag and then waits for the main polling loop
to respond to the proximity change.
proximity sensor in repeat mode with 50 ms wait time
between each measurement and then runs it in an interrupt
driven mode. When the controller receives an interrupt, the
external subroutine I2C_Read_Byte (I2C_Address, Data_Address);
external subroutine I2C_Read_Block (I2C_Address, Data_Start_Address, Count, Memory_Map);
external subroutine I2C_Write_Byte (I2C_Address, Data_Address, Data);
external subroutine I2C_Write_Block (I2C_Address, Data_Start_Address, Count, Memory_Map);
subroutine Initialize_PS () {
MemBuf[0x02] = 0x02;
MemBuf[0x0F] = 0x09;
MemBuf[0x10] = 0x8F;
MemBuf[0x11] = 0xFF;
MemBuf[0x12] = 0x70;
MemBuf[0x13] = 0x00;
MemBuf[0x14] = 0x11;
MemBuf[0x15] = 0x09;
MemBuf[0x16] = 0x0A;
MemBuf[0x17] = 0x02;
// INT_CONFIG assert interrupt until cleared
// PS_LED_CURRENT 50mA
// PS_TH_UP_MSB
// PS_TH_UP_LSB
// PS_TH_LO_MSB
// PS_TH_LO_LSB
// PS_FILTER_CONFIG turn off filtering
// PS_CONFIG 300us integration time
// PS_INTERVAL 50ms wait
// PS_CONTROL enable continuous PS measurements
I2C_Write_Block (I2CAddr, 0x02, 37, MemBuf);
}
subroutine I2C_Interupt_Handler () {
// Verify this is a PS interrupt
INT = I2C_Read_Byte (I2CAddr, 0x40);
if (INT == 0x11 || INT == 0x12) {
// Retrieve and store the PS data
PS_Data_MSB = I2C_Read_Byte (I2CAddr, 0x41);
PS_Data_LSB = I2C_Read_Byte (I2CAddr, 0x42);
NewPS = 0x01;
}
}
subroutine main_loop () {
I2CAddr = 0x37;
NewPS = 0x00;
Initialize_PS ();
loop {
// Do some other polling operations
if (NewPS == 0x01) {
NewPS = 0x00;
// Do some operations with PS_Data
}
}
}
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17
NOA2301W
Physical Location of Photodiode Sensor
The physical locations of the NOA2301W proximity sensor photodiode is shown in Figure 16 referenced to the lower left
hand corner of the die.
60 um
LED
GND
LED
VDD
VSS
LED
INT
VDD
VSS
60 um
Scribe Line
SCL
SCL
INT
SDA
1300 um
PS
840 um
485.95 um
441.9 um
LED
GND
LED
INT
VDD
VSS
LED
INT
VDD
VSS
SCL
SCL
SDA
Figure 16. Photodiode Location
Table 22. BONDING PAD LOCATIONS
(Dimensions in ꢀ m measured from the lower left corner of the die to the middle of the bond pad) (Note 8)
Pad
VDD
Description
X
Y
Pad Size
75x75
75x75
75x75
75x75
75x75
75x75
75x75
Power supply
Ground
139
58.4
58.4
54.7
65.85
784.55
786
VSS
248.5
655.85
1243.7
1211.7
554.85
114.25
LED_GND
LED
Ground for IR LED driver
IR LED output
INT
Interrupt output
SDA
I2C data signal
SCL
I2C clock signal
786
8. Bond pad material is AL + 0.5% Cu
Table 23. MECHANICAL DIMENSIONS
Parameter
Symbol
Min
Typ
725
200
Max
Unit
Wafer thickness
700
750
ꢀ
m
Wafer diameter
mm
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18
NOA2301W
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