NOM02A4-AR03G [ONSEMI]
接触式图像传感器模块，200 dpi，A4尺寸，红色 LED，346 µs/行;
| 型号： | NOM02A4-AR03G |
| 厂家： | 
ONSEMI |
| 描述： | 接触式图像传感器模块，200 dpi，A4尺寸，红色 LED，346 µs/行 传感器 图像传感器 |
| 文件： | 总10页 (文件大小：308K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NOM02A4-AR03G
200DPI High-Speed Contact
Image Sensor Module
Description
The NOM02A4−AR03G contact image sensor (CIS) module
integrates a red LED light source, lens and image sensor in a compact
housing. The module is designed for document scanning, mark
reading, gaming and office automation equipment applications and is
suitable for scanning documents up to 216 mm wide. An analog video
output achieves a scanning rate of 346 msec/line. The
NOM02A4−AR03G module employs proprietary CMOS image
sensing technology from ON Semiconductor to achieve high−speed
performance and high sensitivity.
http://onsemi.com
Features
• Light Source, Lens and Sensor are Integrated Into a Single Module
• 216 mm Scanning Width at 7.9 dots per mm Resolution
• 346 msec/Line Scanning Speed @ 5.0 MHz Pixel Rate
• Analog Video Output
IMAGE SENSOR MODULE A4
CASE MODAC
MARKING DIAGRAM
• Supports A4 Paper Size at up to 74 Pages per Minute
• Red LED Light Source
NOM02A4−AR03G
YYMMSSSSSS
• Wide Dynamic Range
• Compact 232.1 mm x 19.2 mm x 13.7 mm Module Housing
• Low Power
YY
= Year
MM
= Month
SSSSSS = Serial Number
= Pb−Free Package
• Light Weight 2.1 oz Packaging
G
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
CONNECTOR PIN ASSIGNMENT
Applications
• Currency Verification
• Document Scanning
• Mark Readers Including Balloting, Test Scoring and Gaming
Machines
1
2
3
4
5
6
7
8
9
10
• Office Automation Equipment
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Contact Image
Sensor Module
Analog to Digital
Converters
DSP
Parallel Port
Transceiver
LED Drivers
Paper Insertion
Sensing Switch
Scan System
Timing and Control
Motor Controller
and Driver
Motor
Figure 1. Typical Scanner Application
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
March, 2012 − Rev. 1
NOM02A4−AR03G/D
NOM02A4−AR03G
Table 1. ORDERING INFORMATION
Part Number
Package
Shipping Configuration
NOM02A4−AR03G
(Pb−free)
100 per packing carton
Red LED Light Bar
VLED
GLED
VDD (+5 V)
GND
Rod Lens
VSS (−5 V)
Photo Sensor Array
4
1
2
3
1728
SP
CP
Buf
Buf
Amp
VOUT
Shift Register
Pixel 1 corresponds to connector end of the module
Figure 2. Simplified Block Diagram
Table 2. PIN FUNCTION DESCRIPTION
Pin
1
Pin Name
VOUT
GND
VDD
Description
Analog Video Output
Ground
2
3
+5 V power supply
−5 V to −12 V power supply
Ground
4
VSS
5
GND
SP
6
Shift register start pulse
Ground
7
GND
CP
8
Sampling clock pulse
Ground for the LED light source
Power supply for the LED light source
9
GLED
VLED
10
http://onsemi.com
2
NOM02A4−AR03G
Table 3. ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Value
7
Unit
V
Power supply voltage
V
DD
V
−15
6
V
SS
V
V
LED
LED
Power supply current
I
600
mA
V
Input voltage range for SP, CP
Storage Temperature
V
−0.5 to V + 0.5
in
DD
T
−20 to 75
10 to 90
$2
°C
%
STG
Storage Humidity, Non−Condensing
ESD Capability, Contact Discharge (Note 1)
H
STG
ESD
kV
HBM
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This module assembly has been ESD tested to IEC61000−4−2 (HBM) Contact Discharge
Table 4. RECOMMENDED OPERATING RANGES (Unless otherwise specified, these specifications apply T = 25°C) (Note 2)
A
Parameter
Power supply voltage (Note 3)
Symbol
Min
4.5
−12
4.5
53
Typ
5
Max
5.5
Unit
V
V
DD
V
SS
−5
5
−4.5
5.5
V
V
LED
I
DD
V
Power supply current
60
67
mA
mA
mA
V
I
SS
5.0
400
0
6.0
450
0
7.0
I
500
0.8
LED
Low level input voltage for SP, CP
High level input voltage for SP, CP
Line scanning rate (Note 4)
V
IL
V
IH
4.5
314
2.0
182
46
5.0
346
5.0
200
50
V
+ 0.3
V
DD
T
int
864
5.5
500
125
60
ms
MHz
ns
ns
%
Clock frequency (Note 5)
f
Clock period
t
o
Clock pulse width (Note 6)
t
w
Clock pulse high duty cycle
DC
20
25
CP
Start pulse width (Note 6)
t
150
20
180
480
ns
ns
ns
ns
ns
ns
°C
%
wSP
Start pulse setup time
t
su
Start pulse hold time
t
h
20
Prohibit crossing time (Note 7)
Clock to Video output propagation delay rising
Clock to Video output propagation delay falling
Operating Temperature
t
20
prh
t
115
20
pcor
t
pcof
T
0
50
60
op
Operating Humidity, Non−Condensing
2. Refer to Figure 3 for more information on AC characteristics
H
10
op
3. V
directly affects illumination intensity, which directly affects V
.
OUT
LED
4. T is the line scanning rate or integration time. T is determined by the interval between two start pulses. The clock is proportional to T .
int
int
int
5. Main clock frequency (f) corresponds to the video sampling frequency.
6. Min, Typ, Max specifications reflect operation at the corresponding Min, Typ, Max clock frequency.
7. Prohibit crossing time is to insure that two start pulses are not supplied in the same scan line time. SP may only be active high during one
falling edge of CP for any given scan.
http://onsemi.com
3
NOM02A4−AR03G
Table 5. PHYSICAL SPECIFICATIONS
Parameter
Symbol
Typ
216
27
Unit
mm
Scan width
PD
w
Number of Photo Detector Arrays
Number of Photo Detectors
PDA
arrays
elements
n
PD
1728
n
Table 6. PHYSICAL CHARACTERISTICS
Parameter
Symbol
PD
Min
Typ
125
180
0
Max
Unit
mm
mm
mm
nm
Pixel pitch
sp
Inter−array spacing
PDA
150
−40
634
210
40
sp
Inter−array vertical alignment
Green LED peak wavelength
PDA
vxp
l
p
644
Table 7. ELECTRO−OPTICAL CHARACTERISTICS TEST CONDITIONS
Parameter
Symbol
Value
5.0
Unit
V
Power supply voltage
V
DD
V
−5.0
5.0
V
SS
V
LED
V
Clock frequency
f
5.0
MHz
%
Clock pulse high duty cycle
Line scanning rate
DC
25
CP
T
int
346
26
ms
LED arrays pulsed time on (Note 8)
LED arrays pulsed time off (Note 8)
Operating Temperature
LED_Ton
LED_Toff
ms
ms
°C
356
25
T
op
8. Production tested with pulsing LEDs.
http://onsemi.com
4
NOM02A4−AR03G
Table 8. ELECTRO−OPTICAL CHARACTERISTICS (Unless otherwise specified, these specifications were achieved with the
test conditions defined in Table 7)
Parameter
Bright analog output voltage (Note 9)
Bright output non−uniformity (Note 10)
Bright output non−uniformity total (Note 11)
Adjacent pixel non−uniformity (Note 12)
Dark output voltage (Note 13)
Symbol
Min
0.9
Typ
Max
1.1
30
Unit
V
V
pavg
1.0
U
−30
%
p
U
60
%
ptotal
U
25
%
padj
V
d
150
100
mV
mV
%
Dark non−uniformity (Note 14)
U
d
Modulation transfer function at 50 line pairs per in (lp/in) (Note 15)
MTF
40
20
50
Modulation transfer function at 100 line pairs per in (lp/in)
(Notes 15, 16)
MTF
%
100
9. V
= Ȍ V /1728, where
p(n)
pavg
V is the pixel amplitude value of V
for a bright signal defined as a white document with LEDs turned on,
p
OUT
n is the sequential pixel number in one scan line.
10.U = [(V – V )/V ] x 100%, or [V – V
)/V ] x 100%, whichever is greater, where
pavg
p
pmax
pavg
pavg
pavg
pmin
V
V
ptotal
padj
padj
is the maximum pixel voltage of any pixel at full bright
is the minimum pixel voltage of any pixel at full bright
pmax
pmin
= [(V
11. U
12.U
U
– V
)/V
] x 100%,
pmax
= MAX [ | (V
pmin
p(n)
pavg
p(n+1) p(n)
– V
| / V ] x 100%, where
is the nonuniformity in percent between adjacent pixels for a bright background
for a dark signal defined as a black document with LEDs turned off
13.V is the pixel amplitude value of V
14.U = V
d
OUT
– V
, where
d
dmax
dmin
V
V
is the maximum pixel voltage of any dark pixel with the LEDs turned off
is the minimum pixel voltage of any dark pixel with the LEDs turned off
dmax
dmin
15.MTF = [(V
– V )/(V
+ V )] x 100%, where
max
min
max min
V
V
is the maximum output voltage at the specified line pairs per inch (lp/in)
is the minimum output voltage at the specified lp/in
max
min
16.For information only.
t
o
t
w
CP
t
t
prh
prh
t
h
SP
t
su
t
pcof
t
wSP
V
d
V
p
VOUT
t
pcor
GND
Pixel 1
Pixel 2
Pixel 3
Pixel 4
Figure 3. Timing Diagram
http://onsemi.com
5
NOM02A4−AR03G
DESCRIPTION OF OPERATION
Functional Description
Initialization
The NOM02A4−AR03G module consists of 27 contact
image sensors, each with 64 pixel elements, that are
cascaded to provide 1728 photo−detectors with their
associated multiplex switches and double−buffered digital
shift register that controls its sequential readout. A buffer
amplifies the video pixels from the image sensors and output
the analog video signal of the module as shown in Figure 2.
In operation, the sensors produce an analog image pixel
signal (or video signal) proportional to the exposure on the
corresponding picture elements on the document. The
VOUT signal outputs 1728 pixels for each scan line. The
first bit shifted out from VOUT during each scan represents
the first pixel on the connector end of the module.
A pictorial of the NOM02A4−AR03G cross section view
is shown in Figure 4. Mounted in the module is a one−to−one
graded−index micro lens array that focuses the scanned
document image onto the sensing plane. Illumination is
accomplished by means of an integrated LED light source.
All components are housed in a small plastic housing, which
has a glass cover. The top surface of the glass acts as the focal
point for the object being scanned and protects the imaging
array, micro lens assembly and LED light source from dust.
Document
Detected?
no
Start Scan
, CP=
SP=
CTR=0
CP=
Read Pixel into Memory
CTR++ == 1728
no
Transfer Scan Line Data
Document
Detected?
yes
Done
Glass Window
Light Path
LED Bar
Document Surface
Figure 5. Typical Scanner Algorithm
Figure 5 outlines the basic steps in the scanner control
sequence. First the circuits are initialized and the scanner
waits for a document to be detected, usually by a paper
sensing switch. Then a start pulse and clock pulse are
supplied to capture a line image. At the next clock pulse the
first pixel value appears on the output. The pixel can be
stored in a local line buffer memory. Subsequent clocks
cause the remaining pixels to be shifted out and stored in the
line buffer. Once the complete line has been shifted out it can
be transferred to the host application and the system
advances the paper and the line scan process repeats until the
paper sensing switch indicates the document has passed
completely through the scanner.
Rod
Lens
Module Housing
Sensors
PCB
Figure 4. Module Cross Section View
Connector Pin Out Description
Connections to the module are via a 2.4x14.50mm 10−pin
connector (ECE part number EBW−PK23−P010L2−3Z)
located at one end of the module as shown in the package
drawing on page 8. The location of pin number 1 is
indicated on the package drawing.
Device Marking and Barcode Description
Each module is marked with a tag that contains the part
number, a number combining the manufacturing date code
and serial number and a barcode. The barcode presents the
date code and serial number in Interleave 2 of 5 barcode
format as follows
Scanner Applications
A typical use of the NOM02A4−AR03G module in
scanner applications is shown in Figure 6. The document to
be digitized is fed into the scanner where a sensor detects its
presence. The scanner then operates the motor to move the
paper under the contact image sensor module. The module
illuminates the paper with internal LEDs and the image
sensor pixel array detects the amount of reflected light and
simultaneously measures a full line of pixels which are
sampled and transferred to a FIFO for storage and
conversion to a parallel output format. Once the pixel line is
processed, the motor advances the paper and the next scan
line is captured.
YYMMSSSSSS
where
YY is the year,
MM is the month, and
SSSSSS is the serial number.
Glass Lens Care
Precautions should be taken to avoid scratching or
touching the glass lens. The glass lens may be cleaned with
alcohol.
http://onsemi.com
6
NOM02A4−AR03G
Figure 6. Typical Scanner Assembly
http://onsemi.com
7
NOM02A4−AR03G
PACKAGE DIMENSIONS
IMAGE SENSOR MODULE A4
CASE MODAC
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEADING EDGE OF THE APPROACH ANGLE ON THE GLASS IS
LOWER THAN THE TOP OF THE HOUSING.
4. BORE DEPTH IS 6.0 WITH A 0.3 LEAD−IN CHAMFER.
5. PIN HEADER, MODEL NUMBER EBW−PK23−P010L2−3Z, 1X10 PIN,
PITCH 1.25.
6. GLASS IS GLUED ON ALL 4 SIDES.
7. GLASS THICKNESS IS 1.85.
8. USE M2.3 SELF TAPPING SCREWS FOR MOUNTING. TORQUE
SCREWS BETWEEN 1.80 KGF−CM AND 2.00 KGF−CM.
9. DIMENSION D1 DENOTES THE SCAN LENGTH.
10. DIMENSION K DENOTES THE POSITION OF THE FIRST PIXEL.
MILLIMETERS
DIM MIN
MAX
13.60
6.45
14.20
18.30
19.50
6.50
A
A1
A2
B
B1
B2
C
12.60
5.45
13.20
17.70
18.90
5.50
15.40
15.60
D
D1
E
231.60 232.60
216.00 REF
2.10
2.30
F
H
J
K
112.50 113.50
34.80
5.70
5.30
35.80
6.30
7.30
L
6.00 REF
http://onsemi.com
8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
IMAGE SENSOR MODULE
CASE MODAC
ISSUE A
DATE 11 MAY 2010
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEADING EDGE OF THE APPROACH ANGLE ON THE GLASS IS
LOWER THAN THE TOP OF THE HOUSING.
4. BORE DEPTH IS 6.0 WITH A 0.3 LEAD−IN CHAMFER.
5. PIN HEADER, MODEL NUMBER EBW−PK23−P010L2−3Z, 1X10 PIN,
PITCH 1.25.
6. GLASS IS GLUED ON ALL 4 SIDES.
7. GLASS THICKNESS IS 1.85.
8. USE M2.3 SELF TAPPING SCREWS FOR MOUNTING. TORQUE
SCREWS BETWEEN 1.80 KGF−CM AND 2.00 KGF−CM.
9. DIMENSION D1 DENOTES THE SCAN LENGTH.
10. DIMENSION K DENOTES THE POSITION OF THE FIRST PIXEL.
MILLIMETERS
DIM MIN
MAX
13.60
6.45
14.20
18.30
19.50
6.50
A
A1
A2
B
B1
B2
C
12.60
5.45
13.20
17.70
18.90
5.50
15.40
15.60
D
D1
E
231.60 232.60
216.00 REF
2.10
2.30
F
H
J
K
112.50 113.50
34.80
5.70
5.30
35.80
6.30
7.30
L
6.00 REF
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON48436E
IMAGE SENSOR MODULE
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS:
Technical Library: www.onsemi.com/design/resources/technical−documentation
onsemi Website: www.onsemi.com
ONLINE SUPPORT: www.onsemi.com/support
For additional information, please contact your local Sales Representative at
www.onsemi.com/support/sales
相关型号：
©2020 ICPDF网 联系我们和版权申明