NSR0170HT1G [ONSEMI]
70V, 100mA Schottky Barrier Diode Series in X2DFNW2;
| 型号： | NSR0170HT1G |
| 厂家： | 
ONSEMI |
| 描述： | 70V, 100mA Schottky Barrier Diode Series in X2DFNW2 光电二极管 整流二极管 |
| 文件： | 总3页 (文件大小：62K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NSR0170P2T5G
Schottky Barrier Diode
Schottky barrier diodes are optimized for very low forward voltage
drop and low leakage current and are used in a wide range of dc-dc
converter, clamping and protection applications in portable devices.
NSR0170P2 in a SOD-923 miniature package enables designers to
meet the challenging task of achieving higher efficiency and meeting
reduced space requirements.
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Features
70 V SCHOTTKY
BARRIER DIODE
•ꢀVery Low Forward Voltage Drop - 560 mV @ 10 mA
•ꢀLow Reverse Current - 25 nA @ 50 V VR
•ꢀ70 mA of Continuous Forward Current
•ꢀPower Dissipation of 240 mW with Minimum Trace
•ꢀVery High Switching Speed
1
2
CATHODE
ANODE
•ꢀLow Capacitance - CT = 2 pF
•ꢀThis is a Pb-Free Device
MARKING
DIAGRAM
Typical Applications
2
•ꢀLCD and Keypad Backlighting
•ꢀCamera Photo Flash
•ꢀBuck and Boost dc-dc Converters
•ꢀReverse Voltage and Current Protection
•ꢀClamping & Protection
1
MG
SOD-923
CASE 514AB
PLASTIC
G
1
2
Q
M
G
= Specific Device Code
= Month Code
= Pb-Free Package
Markets
•ꢀMobile Handsets
•ꢀMP3 Players
(Note: Microdot may be in either location)
•ꢀDigital Camera and Camcorders
•ꢀNotebook PCs & PDAs
•ꢀGPS
ORDERING INFORMATION
Device
Package
Shipping†
NSR0170P2T5G SOD-923 2 mm Pitch
(Pb-Free) 8000/Tape & Reel
MAXIMUM RATINGS
Rating
Reverse Voltage
Symbol
Value
70
Unit
V
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
V
I
R
Forward Current (DC)
70
mA
F
ESD Rating: Human Body Model
Machine Model
ESD
Class 2
Class B
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
©ꢀ Semiconductor Components Industries, LLC, 2008
April, 2008 - Rev. 0
1
Publication Order Number:
NSR0170P2/D
NSR0170P2T5G
THERMAL CHARACTERISTICS
Characteristic
Symbol
Min
Typ
Max
Unit
Thermal Resistance
Junction-to-Ambient (Note 1)
R
P
520
240
°C/W
mW
q
JA
Total Power Dissipation @ T = 25°C
A
D
Thermal Resistance
Junction-to-Ambient (Note 2)
R
P
175
710
°C/W
mW
q
JA
Total Power Dissipation @ T = 25°C
A
D
Junction and Storage Temperature Range
T , T
J
-55 to +150
°C
stg
1. Mounted onto a 4 in square FR-4 board 10 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
2. Mounted onto a 4 in square FR-4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Min
Typ
Max
Unit
Reverse Leakage
(V = 50 V)
(V = 70 V)
I
R
25
-
90
3.0
nA
mA
R
R
Forward Voltage
(I = 1.0 mA)
V
F
V
0.34
0.56
0.65
0.39
0.64
0.73
F
(I = 10 mA)
F
(I = 15 mA)
F
Total Capacitance
(V = 0 V, f = 1 MHz)
2.0
pF
CT
R
100
10
1000
150°C
125°C
100
10
1
150°C
1
85°C
25°C
0.1
125°C
85°C
25°C
0.01
0.001
0.1
-40°C
0.01
0.0001
-40°C
0.001
0.00001
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
10
20
30
40
50
60
70
V , FORWARD VOLTAGE (V)
F
V , REVERSE VOLTAGE (V)
R
Figure 1. Forward Voltage
Figure 2. Leakage Current
2.5
T = 25°C
A
2.0
1.5
1.0
0.5
0
0
10
20
30
40
50
60
70
80
V , REVERSE VOLTAGE (V)
R
Figure 3. Total Capacitance
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2
NSR0170P2T5G
PACKAGE DIMENSIONS
SOD-923
CASE 514AB-01
ISSUE B
-X-
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
-Y-
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
E
1
2
b 2X
0.08 (0.0032)
X
Y
MILLIMETERS
DIM MIN NOM MAX
INCHES
MIN
NOM MAX
A
A
b
c
0.34
0.15
0.07
0.75
0.55
0.95
0.05
0.37
0.20
0.12
0.80
0.60
1.00
0.10
0.40
0.25
0.17
0.85
0.65
1.05
0.15
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.002 0.004 0.006
D
E
H
E
L
c
L
H
E
SOLDERING FOOTPRINT*
0.90
0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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NSR0170P2/D
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