NSV20200DMTWTBG [ONSEMI]

Dual 20V 2A Low VCE(sat) PNP Transistors in WDFN6;
NSV20200DMTWTBG
型号: NSV20200DMTWTBG
厂家: ONSEMI    ONSEMI
描述:

Dual 20V 2A Low VCE(sat) PNP Transistors in WDFN6

开关 光电二极管 晶体管
文件: 总7页 (文件大小:204K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Low VCE(sat) PNP Transistors  
20 V, 2 A  
20 Volt, 2 Amp  
PNP Low V Transistors  
CE(sat)  
NSS20200DMT  
2
MARKING  
DIAGRAM  
onsemi’s e PowerEdge family of low V  
transistors are  
CE(sat)  
1
2
3
6
5
4
miniature surface mount devices featuring ultra low saturation voltage  
WDFN6  
CASE 506AN  
AT MG  
(V ) and high current gain capability. These are designed for use  
CE(sat)  
G
1
in low voltage, high speed switching applications where affordable  
efficient energy control is important.  
AT = Specific Device Code  
M
G
= Date Code  
Typical applications are DCDC converters and LED lightning,  
power managementetc. In the automotive industry they can be used  
in air bag deployment and in the instrument cluster. The high current  
= PbFree Package  
(Note: Microdot may be in either location)  
2
gain allows e PowerEdge devices to be driven directly from PMU’s  
control outputs, and the Linear Gain (Beta) makes them ideal  
components in analog amplifiers.  
PIN CONNECTIONS  
6
5
4
1
2
3
Features  
7
8
NSV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AECQ101  
Qualified and PPAP Capable  
NSV20200DMTWTBG Wettable Flanks Device  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
6,7  
5
1
2
MAXIMUM RATINGS (T = 25°C)  
A
Rating  
CollectorEmitter Voltage  
Symbol  
Max  
20  
20  
7
Unit  
Vdc  
Vdc  
Vdc  
A
V
CEO  
V
CBO  
V
EBO  
CollectorBase Voltage  
EmitterBase Voltage  
4
3,8  
Collector Current Continuous  
Collector Current Peak  
I
C
2
I
3
A
ORDERING INFORMATION  
CM  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Device  
Package  
Shipping  
NSS20200DMTTBG  
WDFN6  
(PbFree)  
3000 / Tape &  
Reel  
THERMAL CHARACTERISTICS  
NSV20200DMTWTBG  
WDFN6  
(PbFree)  
3000 / Tape &  
Reel  
Characteristic  
Symbol  
Max  
Unit  
Thermal Resistance JunctiontoAmbient  
R
60  
°C/W  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
q
JA  
(Notes 1 and 2)  
Total Power Dissipation per Package @  
T = 25°C (Note 2)  
A
P
2.10  
79  
W
°C/W  
W
D
Thermal Resistance JunctiontoAmbient  
(Note 3)  
R
q
JA  
Power Dissipation per Transistor @ T = 25°C  
P
1.59  
A
D
(Note 3)  
Junction and Storage Temperature Range  
T , T  
55 to  
+150  
°C  
J
stg  
2
1. Per JESD517 with 100 mm pad area and 2 oz. Cu (Dual Operation).  
2. P per Transistor when both are turned on is one half of Total P or 1.13 Watts.  
D
D
2
3. Per JESD517 with 100 mm pad area and 2 oz. Cu (SingleOperation).  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
January, 2022 Rev. 1  
NSS20200DMT/D  
 
NSS20200DMT  
Table 1. ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
CollectorEmitter Breakdown Voltage (I = 10 mA, I = 0)  
V
20  
20  
7  
V
V
C
B
(BR)CEO  
(BR)CBO  
(BR)EBO  
CollectorBase Breakdown Voltage (Ic = 0.1 mA, I = 0)  
V
V
E
EmitterBase Breakdown Voltage (I = 0.1 mA, I = 0)  
V
E
C
Collector Cutoff Current (V = 60 V, I = 0)  
I
CBO  
100  
100  
nA  
nA  
CB  
E
Emitter Cutoff Current (V = 5.0 V)  
I
EBO  
BE  
ON CHARACTERISTICS  
DC Current Gain (Note 4)  
h
FE  
(I = 100 mA, V = 2.0 V)  
250  
210  
160  
100  
C
CE  
(I = 500 mA, V = 2.0 V)  
C
CE  
(I = 1 A, V = 2.0 V)  
C
CE  
(I = 2 A, V = 2.0 V  
C
CE  
CollectorEmitter Saturation Voltage (Note 4)  
(I = 500 mA, I = 50 mA)  
V
V
CE(sat)  
0.11  
0.20  
0.22  
0.39  
C
B
(I = 700 mA, I = 7 mA)  
C
B
(I = 1 A, I = 50 mA)  
C
B
(I = 2 A, I = 200 mA)  
C
B
Base*Emitter Saturation Voltage (Note 4)  
V
V
V
BE(sat)  
(I = 500 mA, I = 50 mA)  
1.0  
1.1  
1.2  
C
B
(I = 1 A, I = 50 mA)  
C
B
(I = 1 A, I = 100 mA)  
C
B
BaseEmitter Turnon Voltage (Note 4)  
(I = 500 mA, I = 50 mA)  
V
0.9  
BE(on)  
C
B
DYNAMIC CHARACTERISTICS  
Output Capacitance  
CB  
C
18  
pF  
obo  
(V = 10 V, f = 1.0 MHz)  
Cutoff Frequency  
f
T
155  
MHz  
(I = 50 mA, V = 2.0 V, f = 100 MHz)  
C
CE  
SWITCHING TIMES  
Delay Time (V = 10 V, I = 0.5 A, I = 25 mA, I = 25 mA)  
t
d
15  
13  
ns  
ns  
ns  
ns  
CC  
C
B1  
B2  
Rise Time (V = 10 V, I = 0.5 A, I = 25 mA, I = 25 mA)  
t
r
CC  
C
B1  
B2  
Storage Time (V = 10 V, I = 0.5 A, I = 25 mA, I = 25 mA)  
t
s
360  
22  
CC  
C
B1  
B2  
Fall Time (V = 10 V, I = 0.5 A, I = 25 mA, I = 25 mA)  
t
f
CC  
C
B1  
B2  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Pulse Condition: Pulse Width = 300 msec, Duty Cycle 2%  
www.onsemi.com  
2
 
NSS20200DMT  
TYPICAL CHARACTERISTICS  
700  
600  
500  
400  
300  
200  
100  
0
800  
150°C  
150°C  
100°C  
V
CE  
= 2 V  
V
CE  
= 5 V  
700  
600  
500  
400  
300  
200  
100  
0
100°C  
25°C  
25°C  
55°C  
55°C  
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
1
10  
I , COLLECTOR CURRENT (A)  
C
I , COLLECTOR CURRENT (A)  
C
Figure 1. DC Current Gain  
Figure 2. DC Current Gain  
2.8  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
18 mA  
I
= 20 mA  
B
0.4  
0.04  
I /I = 20  
C
B
16 mA  
14 mA  
12 mA  
10 mA  
150°C  
100°C  
8.0 mA  
55°C  
6.0 mA  
4.0 mA  
2.0 mA  
25°C  
0.001  
0
1
2
3
4
5
6
0.001  
0.01  
0.1  
1
10  
V
CE  
, COLLECTOR EMITTER VOLTAGE (V)  
I , COLLECTOR CURRENT (A)  
C
Figure 3. Collector Current as a Function of  
Collector Emitter Voltage  
Figure 4. CollectorEmitter Saturation Voltage  
1
I /I = 100  
C
B
55°C  
150°C  
100°C  
150°C  
0.1  
0.1  
100°C  
25°C  
25°C  
I /I = 50  
C
B
55°C  
0.01  
0.01  
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
1
I , COLLECTOR CURRENT (A)  
C
I , COLLECTOR CURRENT (A)  
C
Figure 5. CollectorEmitter Saturation Voltage  
Figure 6. CollectorEmitter Saturation Voltage  
www.onsemi.com  
3
NSS20200DMT  
TYPICAL CHARACTERISTICS  
1.2  
1.0  
1.0  
55°C  
55°C  
0.8  
25°C  
25°C  
0.6  
100°C  
0.5  
0
100°C  
0.4  
150°C  
150°C  
I /I = 20  
0.2  
0
C
B
V
CE  
= 2 V  
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
1
10  
I , COLLECTOR CURRENT (A)  
C
I , COLLECTOR CURRENT (A)  
C
Figure 7. BaseEmitter Saturation Voltage  
Figure 8. BaseEmitter “ON” Voltage  
4
3.5  
3
115  
105  
95  
I
C
= 1.0 A  
T = 25°C  
A
T = 25°C  
A
f = 1 MHz  
2.5  
2
85  
I
C
= 2.0 A  
75  
1.5  
1
65  
55  
0.5  
0
I
= 0.5 A  
C
45  
0.0001  
0.001  
0.01  
0.1  
1
0
1
2
3
4
5
6
7
I , BASE CURRENT (A)  
B
V
EB  
, BASEEMITTER VOLTAGE (V)  
Figure 9. Collector Saturation Region  
Figure 10. Input Capacitance  
60  
50  
40  
30  
20  
10  
0
1000  
100  
10  
T = 25°C  
CE  
J
V
T = 25°C  
A
= 2 V  
f = 1 MHz  
f
= 100 MHz  
test  
1
0
5
10  
15  
20  
25  
30  
1
10  
100  
1000  
V
CB  
, COLLECTORBASE VOLTAGE (V)  
I , COLLECTOR CURRENT (mA)  
C
Figure 11. Output Capacitance  
Figure 12. fT, Current Gain Bandwidth Product  
www.onsemi.com  
4
NSS20200DMT  
TYPICAL CHARACTERISTICS  
3
2.5  
2.0  
1.5  
1.0  
Dual Device  
Single Device  
0.5  
0
0
25  
50  
75  
100  
125  
150  
175  
TEMPERATURE (°C)  
Figure 13. Power Derating  
100  
10  
1
Duty Cycle = 0.5  
0.20  
0.10  
0.05  
0.02  
0.01  
Single Pulse  
0.1  
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t, PULSE TIME (sec)  
Figure 14. Thermal Resistance by Transistor  
100  
Duty Cycle = 0.5  
0.20  
0.10  
10  
1
0.05  
0.02  
0.01  
Single Pulse  
0.1  
0.000001 0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t, PULSE TIME (sec)  
Figure 15. Thermal Resistance for Both Transistors  
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5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
WDFN6 2x2, 0.65P  
CASE 506AN  
ISSUE H  
DATE 25 JAN 2022  
GENERIC  
MARKING DIAGRAM*  
1
XX M  
XX = Specific Device Code  
M
= Date Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON20861D  
WDFN6 2x2, 0.65P  
PAGE 1 OF 1  
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© Semiconductor Components Industries, LLC, 2013  
www.onsemi.com  
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