NSVS1001CLTWG [ONSEMI]

Bipolar Transistor -100V, -2.5A PNP Low VCE(sat) PNP Single LFPAK8;
NSVS1001CLTWG
型号: NSVS1001CLTWG
厂家: ONSEMI    ONSEMI
描述:

Bipolar Transistor -100V, -2.5A PNP Low VCE(sat) PNP Single LFPAK8

开关 光电二极管 晶体管
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中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Bipolar Transistor  
-100 V, -2.5 A, Low VCE(sat) PNP  
Single LFPAK  
LFPAK8 3.3x3.3, 0.65P  
CASE 760AD  
NSS1001CL  
ELECTRICAL CONNECTION  
This device is bipolar junction transistor featuring high current, low  
saturation voltage, and high speed switching.  
Suitable for automotive applications. AECQ101 qualified and  
PPAP capable. (NSVS1001CLTWG)  
Features  
Complement to NSS1002CL  
Large Current Capacitance  
Low Collector to Emitter Saturation Voltage  
Thin Profile LFPAK8 3.3 x 3.3 Package  
HighSpeed Switching  
MARKING DIAGRAM  
NSS  
1001G  
AWLYW  
High Allowable Power Dissipation  
AECQ101 Qualified and PPAP Capable (NSVS1001CLTWG)  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
NSS1001 = Specific Device Code  
= Assembly Location  
WL = Wafer Lot  
A
Compliant  
Y
W
G
= Year  
= Work Week  
= PbFree Package  
Typical Applications  
Load Switch  
Gate Driver Buffer  
DCDC Converters  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
Specifications  
ABSOLUTE MAXIMUM RATING at Ta = 25°C  
Parameter  
CollectortoBase Voltage  
CollectortoEmitter Voltage  
EmittertoBase Voltage  
Collector Current  
Symbol  
Value  
120  
100  
7  
Unit  
V
V
CBO  
V
CEO  
V
EBO  
V
V
I
C
2.5  
A
Collector Current (Pulse)  
Collector Dissipation  
I
4  
A
CP  
P
P
(Note 1)  
(Note 2)  
0.8  
W
C
2.2  
C
Junction Temperature  
T
175  
°C  
°C  
J
Storage Temperature Range  
T
stg  
55 to +175  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Mounted on FRB with minimum pad of Copper 2 oz  
2. Mounted on FRB with 1 in/sq pad of Copper 2 oz  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
February, 2022 Rev. 0  
NSS1001CL/D  
 
NSS1001CL  
ELECTRICAL CHARACTERISTICS at Ta = 25°C  
Value  
Typ  
Min  
Max  
Parameter  
Collector Cutoff Current  
Symbol  
Conditions  
Unit  
I
VCB = 120 V  
0.1  
mA  
CBO  
IE = 0 A  
Emitter Cutoff Current  
I
VEB = 7 V  
IC = 0 A  
0.1  
mA  
EBO  
DC Current Gain  
h
FE  
VCE = 5 V  
IC = 100 mA  
140  
400  
GainBandwidth Product  
Output Capacitance  
f
VCE = 10 V  
IC = 100 mA  
200  
24  
MHz  
pF  
V
T
C
VCB = 10 V  
f = 1 MHz  
ob  
CollectortoEmitter Saturation Voltage  
V
V
V
IC = 100 mA  
IB = 10 mA  
0.025  
0.08  
0.3  
0.05  
0.16  
0.6  
CE(sat)1  
CE(sat)2  
CE(sat)3  
IC = 1 A  
IB = 100 mA  
V
IC = 2.5 A  
IB = 250 mA  
V
BasetoEmitter Saturation Voltage  
V
IC = 1 A  
IB = 100 mA  
0.85  
1.2  
V
BE(sat)  
CollectortoBase Breakdown Voltage  
CollectortoEmitter Breakdown Voltage  
EmittertoBase Breakdown Voltage  
TurnOn Time  
V
V
V
IC = 10 mA, IE = 0 A  
IC = 1 mA, RBE = ∞  
IE = 10 mA, IC = 0 A  
See Figure 1  
120  
100  
7  
V
V
(BR)CBO  
(BR)CEO  
(BR)EBO  
V
t
on  
24  
440  
20  
ns  
ns  
ns  
Storage Time  
t
stg  
Fall Time  
t
f
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
RB  
100  
IC=10|B1=10|B2=1A  
Figure 1. Switching Time Test Circuit  
ESD RATING  
Parameter  
Symbol  
HBM  
Value  
>2000, <4000  
>400  
Unit  
V
Class  
2
Electrostatic Discharge Human Body Model  
Electrostatic Discharge Machine Model  
MM  
V
M4  
www.onsemi.com  
2
 
NSS1001CL  
TYPICAL CHARACTERISTICS  
1.8  
1.6  
1.4  
1.2  
1
1200  
80mA  
120mA  
IB = 160mA  
140mA  
100mA  
60mA  
40mA  
1000  
800  
600  
400  
200  
0
TA = 55°C  
25°C  
20mA  
5mA  
0.8  
0.6  
0.4  
0.2  
0
175°C  
TA = 25°C  
0
0.2  
0.4  
0.6  
0.8  
1
1
10  
100  
1000  
5000  
VCE, Collector to Emitter Voltage (V)  
IC, Collector Current (mA)  
Figure 2. IC VCE  
Figure 3. VBE IC  
1
0.1  
1000  
100  
10  
TA = 175°C  
VCE = 5 V  
IC / IB = 5  
25°C  
55°C  
TA = 175°C  
55°C  
0.01  
25°C  
1
0.001  
1
10  
100  
1000  
5000  
10  
100  
1000  
5000  
IC, Collector Current (mA)  
IC, Collector Current (mA)  
Figure 5. VCE(sat) IC  
Figure 4. hFE IC  
10  
1
10  
IC / IB = 10  
IC / IB = 10  
55°C  
1
25°C  
0.1  
TA = 175°C  
TA = 175°C  
55°C  
25°C  
0.01  
0.1  
10  
100  
1000  
5000  
10  
100  
1000  
5000  
IC, Collector Current (mA)  
IC, Collector Current (mA)  
Figure 6. VCE(sat) IC  
Figure 7. VBE(sat) IC  
www.onsemi.com  
3
NSS1001CL  
TYPICAL CHARACTERISTICS  
10  
1
1000  
VCE = 10 V  
TA = 25°C  
TA = 25°C  
IC / IB = 10  
100  
0.1  
IC / IB = 5  
10  
0.01  
0.001  
1
10  
100  
1000  
5000  
1
10  
100  
1000  
5000  
IC, Collector Current, (mA)  
IC, Collector Current, (mA)  
Figure 8. VCE(sat) IC  
Figure 9. fT IC  
100  
10  
1
10  
f = 1 MHz  
TA = 25°C  
PT = 1 ms  
10 ms  
DC Operation  
1
0.1  
PC = 2.2 W  
PC = 0.8 W  
TA = 25°C  
Single Pulse  
mounted on FRB  
100 ms  
0.01  
0.001  
1
10  
100  
0.01  
0.1  
1
10  
100 200  
VCB, CollectortoBase Voltage (V)  
Figure 10. Cob VCB  
VCE, CollectortoEmitter Voltage (V)  
Figure 11. Safe Operating Area  
Mounted on FRB with 1 in/sq  
pad of Copper 2 oz  
2
1
0
Mounted on FRB with  
minimum pad of Copper 2 oz  
0
50  
100  
150  
200  
Ta, Ambient Temperature (°C)  
Figure 12. Power Derating  
www.onsemi.com  
4
NSS1001CL  
ORDERING INFORMATION  
Device  
Marking  
Package  
Shipping (Qty / Packing)  
NSVS1001CLTWG  
NSS1001G  
LFPAK8  
(PbFree / Halogen Free)  
3,000 / Tape & Reel  
NSS1001CLTWG  
NSS1001G  
LFPAK8  
(PbFree / Halogen Free)  
3,000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
LFPAK8 3.3x3.3, 0.65P  
CASE 760AD  
ISSUE E  
DATE 16 NOV 2020  
GENERIC  
MARKING DIAGRAM*  
XXXXX  
XXXXX  
AWLYW  
XXXX = Specific Device Code  
A
= Assembly Location  
WL = Wafer Lot  
Y
= Year  
W
= Work Week  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON05544H  
LFPAK8 3.3x3.3, 0.65P  
PAGE 1 OF 1  
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© Semiconductor Components Industries, LLC, 2018  
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TECHNICAL PUBLICATIONS:  
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