NTP45N06LG [ONSEMI]

Power MOSFET 45 Amps, 60 Volts, Logic Level, N-Channel TO-220;
NTP45N06LG
型号: NTP45N06LG
厂家: ONSEMI    ONSEMI
描述:

Power MOSFET 45 Amps, 60 Volts, Logic Level, N-Channel TO-220

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onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
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NTP45N06L, NTB45N06L  
Power MOSFET  
45 Amps, 60 Volts  
Logic Level, N−Channel TO−220 and  
D2PAK  
http://onsemi.com  
Designed for low voltage, high speed switching applications in  
power supplies, converters and power motor controls and bridge  
circuits.  
45 AMPERES, 60 VOLTS  
RDS(on) = 28 mW  
Features  
N−Channel  
Higher Current Rating  
D
Lower R  
DS(on)  
Lower V  
DS(on)  
Lower Capacitances  
G
Lower Total Gate Charge  
Tighter V Specification  
SD  
S
Lower Diode Reverse Recovery Time  
Lower Reverse Recovery Stored Charge  
Pb−Free Packages are Available  
4
4
Typical Applications  
1
2
Power Supplies  
Converters  
Power Motor Controls  
Bridge Circuits  
3
2
TO−220AB  
CASE 221A  
STYLE 5  
D PAK  
CASE 418B  
STYLE 2  
1
2
3
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
4
4
Drain  
Drain  
NTx  
45N06LG  
AYWW  
NTx45N06LG  
AYWW  
1
3
1
2
3
Gate  
Source  
Gate Drain Source  
2
Drain  
NTx45N06L = Device Code  
x
= B or P  
A
Y
= Assembly Location  
= Year  
WW  
G
= Work Week  
= Pb−Free Package  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
August, 2005 − Rev. 2  
NTP45N06L/D  
NTP45N06L, NTB45N06L  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
60  
Unit  
Vdc  
Vdc  
Vdc  
Drain−to−Source Voltage  
V
DSS  
DGR  
Drain−to−Gate Voltage (R = 10 MW)  
V
60  
GS  
Gate−to−Source Voltage  
− Continuous  
V
V
"15  
"20  
GS  
GS  
− Non−Repetitive (t v10 ms)  
p
Drain Current  
− Continuous @ T = 25°C  
I
I
45  
30  
150  
Adc  
Apk  
A
D
D
− Continuous @ T = 100°C  
A
− Single Pulse (t v10 ms)  
I
p
DM  
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
125  
0.83  
3.2  
W
W/°C  
W
A
D
Total Power Dissipation @ T = 25°C (Note 1)  
A
Total Power Dissipation @ T = 25°C (Note 2)  
2.4  
W
A
Operating and Storage Temperature Range  
T , T  
55 to +175  
240  
°C  
J
stg  
Single Pulse Drain−to−Source Avalanche Energy − Starting T = 25°C  
E
mJ  
J
AS  
(V = 50 Vdc, V = 5.0 Vdc, L = 0.3 mH  
DD  
GS  
I
= 40 A, V = 60 Vdc, R = 25 W)  
DS G  
L(pk)  
Thermal Resistance  
°C/W  
− Junction−to−Case  
− Junction−to−Ambient (Note 1)  
− Junction−to−Ambient (Note 2)  
R
R
R
1.2  
46.8  
63.2  
q
JC  
JA  
JA  
q
q
Maximum Lead Temperature for Soldering Purposes, 1/8 in from case for 10 seconds  
T
260  
°C  
L
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
2
1. When surface mounted to an FR4 board using 1pad size, (Cu Area 1.127 in ).  
2
2. When surface mounted to an FR4 board using the minimum recommended pad size, (Cu Area 0.412 in ).  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NTP45N06L  
TO−220  
50 Units / Rail  
50 Units / Rail  
NTP45N06LG  
TO−220  
(Pb−Free)  
2
NTB45N06L  
D PAK  
50 Units / Rail  
50 Units / Rail  
2
NTB45N06LG  
D PAK  
(Pb−Free)  
2
NTB45N06LT4  
D PAK  
800 Tape & Reel  
800 Tape & Reel  
2
NTB45N06LT4G  
D PAK  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
2
 
NTP45N06L, NTB45N06L  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain−to−Source Breakdown Voltage (Note 3)  
(V = 0 Vdc, I = 250 mAdc)  
V
Vdc  
(BR)DSS  
60  
67  
67.2  
GS  
D
Temperature Coefficient (Positive)  
mV/°C  
mAdc  
Zero Gate Voltage Drain Current  
I
I
DSS  
GSS  
(V = 60 Vdc, V = 0 Vdc)  
1.0  
10  
DS  
GS  
(V = 60 Vdc, V = 0 Vdc, T = 150°C)  
DS  
GS  
J
Gate−Body Leakage Current (V  
=
15 Vdc, V = 0 Vdc)  
100  
nAdc  
Vdc  
GS  
DS  
ON CHARACTERISTICS (Note 4)  
Gate Threshold Voltage (Note 4)  
V
GS(th)  
(V = V , I = 250 mAdc)  
Threshold Temperature Coefficient (Negative)  
1.0  
1.8  
4.7  
2.0  
DS  
GS  
D
mV/°C  
mW  
Static Drain−to−Source On−Resistance (Note 4)  
R
V
DS(on)  
(V = 5.0 Vdc, I = 22.5 Adc)  
23  
28  
GS  
D
Static Drain−to−Source On−Voltage (Note 4)  
(V = 5.0 Vdc, I = 45 Adc)  
Vdc  
DS(on)  
1.03  
0.93  
1.51  
GS  
D
(V = 5.0 Vdc, I = 22.5 Adc, T = 150°C)  
GS  
D
J
Forward Transconductance (Note 4) (V = 8.0 Vdc, I = 12 Adc)  
g
FS  
22.8  
mhos  
pF  
DS  
D
DYNAMIC CHARACTERISTICS  
Input Capacitance  
C
iss  
1212  
352  
90  
1700  
480  
(V = 25 Vdc, V = 0 Vdc,  
DS  
GS  
Output Capacitance  
Transfer Capacitance  
C
oss  
f = 1.0 MHz)  
C
rss  
180  
SWITCHING CHARACTERISTICS (Note 5)  
Turn−On Delay Time  
t
13  
341  
36  
30  
680  
75  
320  
32  
ns  
d(on)  
Rise Time  
t
r
(V = 30 Vdc, I = 45 Adc,  
= 5.0 Vdc, R = 9.1 W) (Note 4)  
G
DD  
D
V
GS  
Turn−Off Delay Time  
Fall Time  
t
d(off)  
t
158  
23  
f
Gate Charge  
Q
T
Q
1
Q
2
nC  
(V = 48 Vdc, I = 45 Adc,  
DS  
D
4.6  
14.1  
V
= 5.0 Vdc) (Note 4)  
GS  
SOURCE−DRAIN DIODE CHARACTERISTICS  
Forward On−Voltage  
(I = 45 Adc, V = 0 Vdc) (Note 4)  
V
SD  
1.01  
0.92  
1.15  
Vdc  
ns  
S
GS  
(I = 45 Adc, V = 0 Vdc, T = 150°C)  
S
GS  
J
Reverse Recovery Time  
t
56  
30  
rr  
(I = 45 Adc, V = 0 Vdc,  
S
GS  
t
a
dI /dt = 100 A/ms) (Note 4)  
S
t
26  
b
Reverse Recovery Stored Charge  
Q
0.09  
mC  
RR  
2
3. When surface mounted to an FR4 board using the minimum recommended pad size, (Cu Area 0.412 in ).  
4. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%.  
5. Switching characteristics are independent of operating junction temperatures.  
http://onsemi.com  
3
 
NTP45N06L, NTB45N06L  
80  
70  
60  
50  
40  
30  
20  
10  
80  
V
= 5.5 V  
GS  
V
= 10 V  
GS  
V
> = 10 V  
DS  
70  
60  
50  
40  
30  
20  
10  
V
= 5 V  
GS  
V
= 6 V  
GS  
V
= 4.5 V  
GS  
V
= 7 V  
GS  
V
= 4 V  
GS  
T = 25°C  
J
V
= 8 V  
GS  
V
= 3.5 V  
GS  
T = 100°C  
J
V
= 9 V  
GS  
T = −55°C  
J
0
0
0
1
2
3
4
1.8  
2.6  
3.4  
4.2  
5
5.8  
V
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)  
DS  
V
, GATE−TO−SOURCE VOLTAGE (VOLTS)  
GS  
Figure 1. On−Region Characteristics  
Figure 2. Transfer Characteristics  
0.046  
0.042  
0.038  
0.034  
0.03  
0.046  
0.042  
0.038  
0.034  
0.03  
V
= 5 V  
GS  
T = 100°C  
J
T = 25°C  
J
V
= 5 V  
GS  
0.026  
0.022  
0.018  
0.014  
0.026  
0.022  
0.018  
T = −55°C  
J
V
= 10 V  
GS  
0
10  
20  
30  
40  
50  
60  
70  
80  
0
10  
20  
30  
40  
50  
60  
70  
80  
I , DRAIN CURRENT (AMPS)  
D
I , DRAIN CURRENT (AMPS)  
D
Figure 3. On−Resistance vs. Gate−to−Source  
Voltage  
Figure 4. On−Resistance vs. Drain Current and  
Gate Voltage  
10000  
1000  
100  
2
I
V
= 22.5 A  
V
= 0 V  
D
GS  
= 5 V  
GS  
1.8  
T = 150°C  
J
1.6  
1.4  
1.2  
1
T = 125°C  
J
T = 100°C  
J
0.8  
10  
0.6  
−50 −25  
0
25  
50  
75 100 125 150 175  
0
10  
20  
30  
40  
50  
60  
T , JUNCTION TEMPERATURE (°C)  
J
V
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)  
DS  
Figure 5. On−Resistance Variation with  
Temperature  
Figure 6. Drain−to−Source Leakage Current  
vs. Voltage  
http://onsemi.com  
4
NTP45N06L, NTB45N06L  
6
4000  
3600  
3200  
V
= 0 V  
V
= 0 V  
GS  
T = 25°C  
DS  
J
C
C
Q
Q
iss  
T
5
V
GS  
Q
1
2
2800  
2400  
rss  
4
3
2
1
0
2000  
1600  
1200  
800  
400  
0
C
iss  
C
oss  
I
= 45 A  
D
C
rss  
T = 25°C  
J
V
V
DS  
10  
5
0
5
10  
15  
20  
25  
0
4
8
12  
16  
20  
24  
GS  
GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE  
(VOLTS)  
Q , TOTAL GATE CHARGE (nC)  
g
Figure 7. Capacitance Variation  
Figure 8. Gate−to−Source and  
Drain−to−Source Voltage vs. Total Charge  
1000  
48  
40  
32  
24  
16  
V
= 30 V  
= 45 A  
= 5 V  
DS  
GS  
V
= 0 V  
GS  
I
D
T = 25°C  
J
V
t
t
r
f
100  
t
d(off)  
8
0
t
d(on)  
10  
1
10  
R , GATE RESISTANCE (W)  
100  
0.6 0.64 0.68 0.72 0.76 0.8 0.84 0.88 0.92 0.96  
1
V
, SOURCE−TO−DRAIN VOLTAGE (VOLTS)  
SD  
G
Figure 9. Resistive Switching Time Variation  
vs. Gate Resistance  
Figure 10. Diode Forward Voltage vs. Current  
1000  
280  
240  
V
= 15 V  
GS  
I
= 45 A  
D
SINGLE PULSE  
= 25°C  
T
C
100  
10  
1
200  
160  
120  
80  
dc  
10 ms  
1 ms  
100 ms  
R
Limit  
Thermal Limit  
Package Limit  
DS(on)  
40  
0.1  
0.10  
0
1
10  
100  
25  
50  
75  
100  
125  
150  
175  
V
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)  
DS  
T , STARTING JUNCTION TEMPERATURE (°C)  
J
Figure 11. Maximum Rated Forward Biased  
Safe Operating Area  
Figure 12. Maximum Avalanche Energy vs.  
Starting Junction Temperature  
http://onsemi.com  
5
NTP45N06L, NTB45N06L  
1
Normalized to R  
at Steady State  
q
JC  
0.1  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
t, TIME (s)  
Figure 13. Thermal Response  
10  
Normalized to R  
1square Cu Pad, Cu Area 1.127 in ,  
3 x 3 inch FR4 board  
at Steady State,  
q
JA  
2
1
0.1  
0.01  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t, TIME (s)  
Figure 14. Thermal Response  
http://onsemi.com  
6
NTP45N06L, NTB45N06L  
PACKAGE DIMENSIONS  
D2PAK  
CASE 418B−04  
ISSUE J  
NOTES:  
C
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. 418B−01 THRU 418B−03 OBSOLETE,  
NEW STANDARD 418B−04.  
E
V
W
−B−  
4
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
MAX  
A
B
C
D
E
F
G
H
J
0.340 0.380  
0.380 0.405  
0.160 0.190  
0.020 0.035  
0.045 0.055  
0.310 0.350  
0.100 BSC  
8.64  
9.65 10.29  
4.06  
0.51  
1.14  
7.87  
9.65  
A
4.83  
0.89  
1.40  
8.89  
S
1
2
3
2.54 BSC  
−T−  
SEATING  
PLANE  
K
0.080  
0.018 0.025  
0.090 0.110  
0.110  
2.03  
0.46  
2.29  
1.32  
7.11  
5.00 REF  
2.00 REF  
0.99 REF  
2.79  
0.64  
2.79  
1.83  
8.13  
W
J
G
K
L
0.052 0.072  
0.280 0.320  
0.197 REF  
0.079 REF  
0.039 REF  
H
M
N
P
R
S
V
D 3 PL  
M
M
0.13 (0.005)  
T B  
0.575 0.625 14.60 15.88  
0.045 0.055 1.14 1.40  
STYLE 2:  
PIN 1. GATE  
VARIABLE  
CONFIGURATION  
ZONE  
2. DRAIN  
3. SOURCE  
4. DRAIN  
N
P
R
U
L
L
L
M
M
M
F
F
F
VIEW W−W  
1
VIEW W−W  
2
VIEW W−W  
3
SOLDERING FOOTPRINT*  
8.38  
0.33  
1.016  
0.04  
10.66  
0.42  
5.08  
0.20  
3.05  
0.12  
17.02  
0.67  
mm  
inches  
ǒ
Ǔ
SCALE 3:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
7
NTP45N06L, NTB45N06L  
PACKAGE DIMENSIONS  
TO−220  
CASE 221A−09  
ISSUE AA  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
SEATING  
PLANE  
−T−  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION Z DEFINES A ZONE WHERE ALL  
BODY AND LEAD IRREGULARITIES ARE  
ALLOWED.  
C
B
F
T
S
4
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
14.48  
9.66  
4.07  
0.64  
3.61  
2.42  
2.80  
0.46  
12.70  
1.15  
4.83  
2.54  
2.04  
1.15  
5.97  
0.00  
1.15  
−−−  
MAX  
15.75  
10.28  
4.82  
0.88  
3.73  
2.66  
3.93  
0.64  
14.27  
1.52  
5.33  
3.04  
2.79  
1.39  
6.47  
1.27  
−−−  
A
K
Q
Z
A
B
C
D
F
0.570  
0.380  
0.160  
0.025  
0.142  
0.095  
0.110  
0.018  
0.500  
0.045  
0.190  
0.100  
0.080  
0.045  
0.235  
0.000  
0.045  
0.620  
0.405  
0.190  
0.035  
0.147  
0.105  
0.155  
0.025  
0.562  
0.060  
0.210  
0.120  
0.110  
0.055  
0.255  
0.050  
−−−  
1
2
3
U
H
G
H
J
K
L
L
R
N
Q
R
S
T
V
J
G
D
U
V
Z
N
−−− 0.080  
2.04  
STYLE 5:  
PIN 1. GATE  
2. DRAIN  
3. SOURCE  
4. DRAIN  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
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Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
NTP45N06L/D  

相关型号:

NTP476M10TRC(100)

CAPACITOR, TANTALUM, SOLID POLYMER, POLARIZED, 10V, 47uF, SURFACE MOUNT, 2412, CHIP
NICHICON

NTP476M10TRC(100)3KF

Tantalum Capacitor, Polarized, Tantalum (solid Polymer), 10V, 20% +Tol, 20% -Tol, 47uF, 2412
NICHICON

NTP476M10TRC(100)F

Tantalum Capacitor, Polarized, Tantalum (solid Polymer), 10V, 20% +Tol, 20% -Tol, 47uF, Surface Mount, 2412, CHIP, ROHS COMPLIANT
NICHICON

NTP476M10TRD(100)F

Tantalum Capacitor, Polarized, Tantalum (solid Polymer), 10V, 20% +Tol, 20% -Tol, 47uF, Surface Mount, 2917, CHIP, ROHS COMPLIANT
NICHICON

NTP476M4TRB2(80)

CAPACITOR, TANTALUM, SOLID POLYMER, POLARIZED, 4V, 47uF, SURFACE MOUNT, 1411, CHIP
NICHICON

NTP47M10TRC(100)F

Tantalum Capacitor, Polarized, Tantalum (solid Polymer), 10V, 20% +Tol, 20% -Tol, 47uF, Surface Mount, 2412, CHIP
NICHICON

NTP47M10TRD(100)F

CAPACITOR, TANTALUM, SOLID POLYMER, POLARIZED, 10V, 47uF, SURFACE MOUNT, 2917, CHIP
NICHICON

NTP4804N

Power MOSFET
ONSEMI

NTP4804NG

Power MOSFET
ONSEMI

NTP4813NL

Single N−Channel Power MOSFET
ONSEMI

NTP4813NLT4G

Single N−Channel Power MOSFET
ONSEMI

NTP52N10

Power MOSFET 52 Amps, 100 Volts
ONSEMI