NTP5863NG [ONSEMI]

Power MOSFET 60V 97A 7.8 mOhm Single N-Channel TO-220;
NTP5863NG
型号: NTP5863NG
厂家: ONSEMI    ONSEMI
描述:

Power MOSFET 60V 97A 7.8 mOhm Single N-Channel TO-220

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NTP5863N  
N-Channel Power MOSFET  
60 V, 97 A, 7.8 mW  
Features  
Low R  
DS(on)  
High Current Capability  
http://onsemi.com  
100% Avalanche Tested  
These Devices are PbFree, Halogen Free and are RoHS Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
60 V  
7.8 mW @ 10 V  
97 A  
MAXIMUM RATINGS (T = 25°C Unless otherwise specified)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
D
V
DSS  
GatetoSource Voltage Continuous  
V
$20  
30  
V
GS  
GS  
GatetoSource Voltage Nonrepetitive  
(T < 10 ms)  
P
V
V
G
Continuous Drain  
Current  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
97  
68  
A
C
D
T
C
S
NCHANNEL MOSFET  
Power Dissipation  
Steady  
State  
T
C
P
150  
W
D
4
Pulsed Drain Current  
t = 10 ms  
p
I
383  
A
DM  
Operating and Storage Temperature Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
S
97  
A
Single Pulse DraintoSource Avalanche  
E
AS  
157  
mJ  
TO220AB  
Energy (L = 0.1 mH, I  
= 56 A)  
L(pk)  
CASE 221A  
STYLE 5  
1
Peak Diode Recovery (dV/dt)  
dV/dt  
4.1  
V/ns  
2
3
Lead Temperature for Soldering  
Purposes (1/8from Case for 10 Seconds)  
T
L
260  
°C  
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
THERMAL RESISTANCE RATINGS  
Parameter  
4
Drain  
Symbol  
Max  
1.0  
36  
Unit  
JunctiontoCase (Drain) Steady State  
JunctiontoAmbient Steady State (Note 1)  
R
°C/W  
q
JC  
R
q
JA  
NTP  
5863NG  
AYWW  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 sq in pad size,  
1
Gate  
3
Source  
(Cu Area 1.127 sq in [2 oz] including traces).  
2
Drain  
G
= PbFree Device  
A
Y
= Assembly Location  
= Year  
WW  
= Work Week  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
July, 2011 Rev. 2  
NTP5863N/D  
 
NTP5863N  
ELECTRICAL CHARACTERISTICS (T = 25°C Unless otherwise specified)  
J
Characteristics  
OFF CHARACTERISTICS  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
DraintoSource Breakdown Voltage  
V
V
DS  
= 0 V, I = 250 mA  
60  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/T  
J
47  
mV/°C  
(BR)DSS  
I
D
= 250 mA, ref to 25°C  
Zero Gate Voltage Drain Current  
I
T = 25°C  
1.0  
50  
mA  
DSS  
J
V
DS  
= 0 V  
= 60 V  
GS  
V
T = 125°C  
J
GateBody Leakage Current  
ON CHARACTERISTICS (Note 2)  
Gate Threshold Voltage  
I
V
= 0 V, V = $20 V  
$100  
nA  
GSS  
DS  
GS  
V
GS(th)  
V
= V , I = 250 mA  
2.0  
4.0  
7.8  
V
mV/°C  
mW  
S
GS  
DS  
D
Negative Threshold Temperature Coefficient  
DraintoSource OnResistance  
Forward Transconductance  
V
/T  
9.1  
6.5  
12  
GS(th)  
J
R
V
= 10 V, I = 20 A  
GS D  
DS(on)  
g
V
= 15 V, I = 30 A  
DS D  
FS  
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
3200  
350  
230  
55  
pF  
nC  
iss  
V
DS  
= 25 V, V = 0 V,  
GS  
Output Capacitance  
Transfer Capacitance  
Total Gate Charge  
C
oss  
f = 1 MHz  
C
rss  
Q
G(TOT)  
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Gate Resistance  
Q
3.4  
G(TH)  
V
GS  
= 10 V, V = 48 V,  
DS  
I
= 48 A  
D
Q
14.5  
19  
GS  
Q
GD  
R
0.4  
W
G
SWITCHING CHARACTERISTICS, V = 10 V (Note 3)  
GS  
TurnOn Delay Time  
Rise Time  
t
10  
34  
25  
9.0  
ns  
d(on)  
t
r
V
= 10 V, V = 48 V,  
DD  
GS  
D
I
= 48 A, R = 2.5 W  
G
TurnOff Delay Time  
Fall Time  
t
d(off)  
t
f
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
T = 25°C  
0.96  
0.85  
32  
1.5  
V
dc  
SD  
J
V
S
= 0 V  
GS  
I
= 48 A  
T = 150°C  
J
Reverse Recovery Time  
Charge Time  
t
ns  
rr  
t
20  
a
V
= 0 V , I = 48 A ,  
dc S dc  
dI /dt = 100 A/ms  
GS  
S
Discharge Time  
t
12  
b
Reverse Recovery Stored Charge  
Q
28  
nC  
RR  
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.  
3. Switching characteristics are independent of operating junction temperatures.  
http://onsemi.com  
2
 
NTP5863N  
TYPICAL PERFORMANCE CHARACTERISTICS  
200  
175  
150  
125  
100  
75  
200  
T = 25°C  
10 V  
J
V
DS  
10 V  
7.0 V  
175  
150  
125  
100  
75  
7.5 V  
V
= 6.5 V  
GS  
5.5 V  
5.0 V  
4.5 V  
T = 25°C  
J
50  
25  
0
50  
25  
0
T = 125°C  
J
T = 55°C  
J
0
1
2
3
4
5
2
3
4
5
6
7
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
0.030  
0.025  
0.020  
0.015  
0.010  
0.005  
0.000  
0.0080  
0.0075  
0.0070  
I
= 20 A  
T = 25°C  
D
J
T = 25°C  
J
V
= 10 V  
GS  
0.0065  
0.0060  
4
5
6
7
8
9
10  
10  
20  
30  
40  
50  
60  
70  
80  
90 100  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. OnResistance vs. Gate Voltage  
Figure 4. OnResistance vs. Drain Current and  
Gate Voltage  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
100,000  
10,000  
V = 0 V  
GS  
I
V
= 20 A  
D
= 10 V  
GS  
T = 150°C  
J
T = 25°C  
J
1000  
100  
50 25  
0
25  
50  
75  
100 125 150 175  
10  
20  
V , DRAINTOSOURCE VOLTAGE (V)  
DS  
30  
40  
50  
60  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 5. OnResistance Variation with  
Figure 6. DraintoSource Leakage Current  
Temperature  
vs. Voltage  
http://onsemi.com  
3
NTP5863N  
TYPICAL PERFORMANCE CHARACTERISTICS  
4000  
3500  
3000  
2500  
2000  
1500  
10  
75  
60  
45  
30  
QT  
C
V
= 0 V  
iss  
GS  
T = 25°C  
J
8
6
4
V
DS  
V
GS  
Q
Q
gd  
gs  
1000  
500  
0
2
0
15  
0
C
oss  
I
= 48 A  
D
T = 25°C  
J
C
rss  
0
10  
20  
30  
40  
50  
60  
0
10  
20  
30  
40  
50  
60  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Q , TOTAL GATE CHARGE (nC)  
g
Figure 7. Capacitance Variation  
Figure 8. GatetoSource and  
DraintoSource Voltage vs. Total Charge  
1000  
100  
10  
100  
V
= 0 V  
GS  
J
V
= 48 V  
= 10 V  
DD  
= 48 A  
T = 25°C  
I
D
80  
60  
40  
V
GS  
t
r
t
d(on)  
t
d(off)  
t
f
20  
0
1
1
10  
R , GATE RESISTANCE (W)  
100  
0.0  
0.2  
0.4  
, SOURCETODRAIN VOLTAGE (V)  
SD  
0.6  
0.8  
1.0  
1.2  
V
G
Figure 9. Resistive Switching Time Variation  
vs. Gate Resistance  
Figure 10. Diode Forward Voltage vs. Current  
1000  
100  
160  
10 ms  
100 ms  
1 ms  
10 ms  
dc  
I
D
= 56 A  
140  
120  
100  
80  
10  
1
V
= 10 V  
GS  
60  
Single Pulse  
T
C
= 25°C  
40  
R
Limit  
DS(on)  
20  
Thermal Limit  
Package Limit  
0.1  
0.1  
0
25  
1
10  
100  
50  
75  
100  
125  
150  
175  
T , STARTING JUNCTION TEMPERATURE (°C)  
J
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 11. Maximum Rated Forward Biased  
Safe Operating Area  
Figure 12. Maximum Avalanche Energy vs.  
Starting Junction Temperature  
http://onsemi.com  
4
NTP5863N  
TYPICAL PERFORMANCE CHARACTERISTICS  
10  
1
0.1  
D = 0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
Single Pulse  
0.01  
0.001  
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
t, PULSE TIME (s)  
Figure 13. Thermal Response  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NTP5863NG  
TO220AB  
(PbFree)  
50 Units / Rail  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
5
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TECHNICAL PUBLICATIONS:  
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