NTS1045EMFST3G [ONSEMI]

Exceptionally Low Leakage Trench-based Schottky Rectifier;
NTS1045EMFST3G
型号: NTS1045EMFST3G
厂家: ONSEMI    ONSEMI
描述:

Exceptionally Low Leakage Trench-based Schottky Rectifier

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NTS1045EMFS,  
NRVTS1045EMFS  
Exceptionally Low Leakage  
Trench-based Schottky  
Rectifier  
http://onsemi.com  
Features  
Fine Lithography Trench−based Schottky Technology for Very Low  
Leakage  
SCHOTTKY BARRIER  
RECTIFIERS  
Fast Switching with Exceptional Temperature Stability  
10 AMPERES  
45 VOLTS  
Low Power Loss and Lower Operating Temperature  
Higher Efficiency for Achieving Regulatory Compliance  
Low Thermal Resistance  
5,6  
1,2,3  
High Surge Capability  
NRV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
MARKING  
DIAGRAM  
These are Pb−Free and Halide−Free Devices  
A
C
C
1
TE1045  
AYWWZZ  
A
A
Typical Applications  
SO−8 FLAT LEAD  
CASE 488AA  
STYLE 2  
Switching Power Supplies including Wireless, Smartphone and  
Notebook Adapters  
Not Used  
High Frequency and DC−DC Converters  
Freewheeling and OR−ing diodes  
Reverse Battery Protection  
Instrumentation  
TE1045 = Specific Device Code  
A
Y
= Assembly Location  
= Year  
W
ZZ  
= Work Week  
= Lot Traceability  
Mechanical Characteristics:  
Case: Epoxy, Molded  
ORDERING INFORMATION  
Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.  
Lead Finish: 100% Matte Sn (Tin)  
Lead and Mounting SurfaceTemperature for Soldering Purposes:  
260°C Max. for 10 Seconds  
Device  
Package  
Shipping†  
NTS1045EMFST1G  
SO−8 FL  
(Pb−Free) Tape & Reel  
1500 /  
NTS1045EMFST3G  
SO−8 FL 5000 /  
Device Meets MSL 1 Requirements  
(Pb−Free) Tape & Reel  
SO−8 FL 1500 /  
NRVTS1045EMFST1G  
NRVTS1045EMFST3G  
(Pb−Free) Tape & Reel  
SO−8 FL 5000 /  
(Pb−Free) Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
July, 2014 − Rev. 0  
NTS1045EMFS/D  
NTS1045EMFS, NRVTS1045EMFS  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
V
RRM  
V
RWM  
V
45  
10  
R
Average Rectified Forward Current  
I
A
A
A
F(AV)  
(Rated V , T = 166°C)  
R
C
Peak Repetitive Forward Current,  
I
20  
FRM  
(Rated V , Square Wave, 20 kHz, T = 162°C)  
R
C
Non−Repetitive Peak Surge Current  
I
210  
FSM  
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)  
Storage Temperature Range  
T
−65 to +150  
−55 to +150  
100  
°C  
°C  
mJ  
stg  
Operating Junction Temperature  
T
J
Unclamped Inductive Switching Energy (10 mH Inductor, Non−repetitive)  
ESD Rating (Human Body Model)  
E
AS  
3B  
ESD Rating (Machine Model)  
M4  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Typ  
Max  
Unit  
Thermal Resistance, Junction−to−Case, Steady State  
(Assumes 600 mm 1 oz. copper bond pad, on a FR4 board)  
R
2.0  
°C/W  
θ
JC  
2
ELECTRICAL CHARACTERISTICS  
Instantaneous Forward Voltage (Note 1)  
v
V
F
(i = 5.0 Amps, T = 25°C)  
0.42  
0.48  
0.60  
F
J
(i = 10 Amps, T = 25°C)  
F
J
(i = 5.0 Amps, T = 125°C)  
0.34  
0.41  
0.53  
F
J
(i = 10 Amps, T = 125°C)  
F
J
Reverse Current (Note 1)  
i
R
(Rated dc Voltage, T = 25°C)  
20  
7.0  
50  
20  
mA  
mA  
J
(Rated dc Voltage, T = 125°C)  
J
Diode Capacitance  
C
pF  
d
(Rated dc Voltage, T = 25°C, f = 1 MHz)  
300  
J
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.  
http://onsemi.com  
2
 
NTS1045EMFS, NRVTS1045EMFS  
TYPICAL CHARACTERISTICS  
100  
10  
100  
T = 175°C  
A
T = 175°C  
A
T = 150°C  
10  
T = 150°C  
A
A
T = 125°C  
A
T = 125°C  
A
T = 25°C  
A
T = 25°C  
A
1
1
T = −55°C  
A
T = −55°C  
A
0.1  
0.1  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0
0.1 0.2 0.3  
0.4 0.5 0.6 0.7 0.8 0.9  
V , INSTANTANEOUS FORWARD VOLTAGE (V)  
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)  
F
Figure 1. Typical Instantaneous Forward  
Characteristics  
Figure 2. Maximum Instantaneous Forward  
Characteristics  
1.E+00  
1.E−01  
1.E−02  
1.E−03  
1.E−04  
1.E+00  
1.E−01  
T = 175°C  
A
T = 150°C  
A
T = 175°C  
A
T = 125°C  
A
T = 150°C  
A
1.E−02  
1.E−03  
1.E−04  
T = 125°C  
A
T = 25°C  
A
1.E−05  
1.E−06  
1.E−05  
1.E−06  
T = 25°C  
A
0
5
10  
15  
20  
25  
30  
35  
40 45  
0
5
10  
15  
20  
25  
30  
35  
40 45  
V , INSTANTANEOUS REVERSE VOLTAGE (V)  
R
V , INSTANTANEOUS REVERSE VOLTAGE (V)  
R
Figure 3. Typical Reverse Characteristics  
Figure 4. Maximum Reverse Characteristics  
20  
15  
10  
10,000  
T = 25°C  
J
DC  
Square Wave  
1000  
5
0
R
= 2.1°C/W  
q
JC  
100  
1
10  
50  
100 110  
120  
130  
140  
150  
160  
170  
V , REVERSE VOLTAGE (V)  
R
T , CASE TEMPERATURE (°C)  
C
Figure 5. Typical Junction Capacitance  
Figure 6. Current Derating  
http://onsemi.com  
3
NTS1045EMFS, NRVTS1045EMFS  
TYPICAL CHARACTERISTICS  
22  
20  
18  
16  
14  
12  
10  
8
I
/I  
= 20  
PK AV  
I
/I = 5  
I /I = 10  
PK AV  
PK AV  
T = 175°C  
J
Square Wave  
dc  
6
4
2
0
0
2
4
6
8
10  
12  
14  
I , AVERAGE FORWARD CURRENT (A)  
F(AV)  
Figure 7. Forward Power Dissipation  
100  
10  
1
50% (DUTY CYCLE)  
20%  
10%  
5.0%  
2.0%  
1.0%  
Assumes 25°C ambient and soldered to  
2
a 600 mm − oz copper pad on PCB  
0.1  
SINGLE PULSE  
0.01  
0.000001 0.00001  
0.0001  
0.001  
0.01  
PULSE TIME (s)  
0.1  
1.0  
10  
100  
1000  
Figure 8. Typical Thermal Characteristics  
10  
1
50% (DUTY CYCLE)  
20%  
10%  
5.0%  
2.0%  
Assumes 25°C ambient and soldered to  
0.1  
2
a 600 mm − oz copper pad on PCB  
1.0%  
SINGLE PULSE  
0.000001  
0.00001  
0.01  
0.0001  
0.001  
0.01  
PULSE TIME (s)  
0.1  
1.0  
10  
100  
1000  
Figure 9. Typical Transient Thermal Response Characteristics, Junction−to−Case  
http://onsemi.com  
4
NTS1045EMFS, NRVTS1045EMFS  
PACKAGE DIMENSIONS  
DFN5 5x6, 1.27P  
(SO−8FL)  
CASE 488AA  
ISSUE H  
2 X  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
0.20  
C
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION D1 AND E1 DO NOT INCLUDE  
MOLD FLASH PROTRUSIONS OR GATE  
BURRS.  
D
A
2
B
E
2 X  
D1  
MILLIMETERS  
0.20  
C
DIM  
A
A1  
b
MIN  
0.90  
0.00  
0.33  
0.23  
NOM  
1.00  
−−−  
0.41  
0.28  
MAX  
1.10  
0.05  
0.51  
0.33  
4 X  
q
E1  
2
c
D
5.15 BSC  
4.90  
4.00  
6.15 BSC  
5.90  
3.65  
1.27 BSC  
0.61  
1.35  
0.61  
0.17  
D1  
D2  
E
E1  
E2  
e
G
K
L
L1  
M
4.70  
3.80  
5.10  
4.20  
c
A1  
5.70  
3.45  
6.10  
3.85  
1
2
3
4
0.51  
1.20  
0.51  
0.05  
3.00  
0
0.71  
1.50  
0.71  
0.20  
3.80  
TOP VIEW  
C
3 X  
e
SEATING  
PLANE  
0.10  
0.10  
C
C
3.40  
−−−  
DETAIL A  
q
12  
A
_
_
STYLE 2:  
SOLDERING FOOTPRINT*  
PIN 1. ANODE  
2. ANODE  
SIDE VIEW  
3X  
1.270  
4X  
0.750  
DETAIL A  
3. ANODE  
4. NO CONNECT  
5. CATHODE  
4X  
b
8X  
1.000  
0.10  
0.05  
C
c
A
B
e/2  
L
0.965  
1
4
0.29X05  
0.475  
1.330  
K
2X  
0.495  
4.530  
E2  
3.200  
PIN 5  
(EXPOSED PAD)  
M
L1  
2X  
1.530  
D2  
BOTTOM VIEW  
G
4.560  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and the  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed  
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation  
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and  
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets  
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each  
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,  
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which  
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or  
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim  
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable  
copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5817−1050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NTS1045EMFS/D  

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