NUP4114HMR6T1G [ONSEMI]

Transient Voltage Suppressors Low Capacitance ESD Protection for High Speed Data Lines; 瞬态电压抑制器低电容ESD保护高速数据线路
NUP4114HMR6T1G
型号: NUP4114HMR6T1G
厂家: ONSEMI    ONSEMI
描述:

Transient Voltage Suppressors Low Capacitance ESD Protection for High Speed Data Lines
瞬态电压抑制器低电容ESD保护高速数据线路

瞬态抑制器 二极管 测试 光电二极管 局域网
文件: 总9页 (文件大小:189K)
中文:  中文翻译
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NUP4114HMR6  
Transient Voltage  
Suppressors  
Low Capacitance ESD Protection for  
High Speed Data Lines  
http://onsemi.com  
The NUP4114HMR6 transient voltage suppressor is designed to  
protect high speed data lines from ESD. Ultralow capacitance and  
high level of ESD protection makes this device well suited for use in  
HDMI and DVI applications.  
MARKING  
DIAGRAM  
6
TSOP6  
CASE 318G  
STYLE 12  
1
Features  
P4H MG  
1
G
Low Capacitance (0.8 pF Typical Between I/O Lines)  
Low Clamping Voltage  
Low Leakage  
P4H = Specific Device Code  
M
G
= Date Code  
= PbFree Package  
(Note: Microdot may be in either location)  
Stand Off Voltage: 5 V  
Protection for the Following IEC Standards:  
IEC 6100042 Level 4 ESD Protection  
UL Flammability Rating of 94 V0  
This is a PbFree Device  
PIN CONFIGURATION  
AND SCHEMATIC  
Typical Applications  
High Speed Communication Line Protection  
Digital Video Interface (DVI) and HDMI  
Monitors and Flat Panel Displays  
Gigabit Ethernet  
I/O 1  
6 I/O  
V
N
2
5 V  
P
Notebook Computers  
I/O 3  
4 I/O  
USB 2.0 High Speed Data Line and Power Line Protection  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
40 to +125  
55 to +150  
260  
Unit  
°C  
ORDERING INFORMATION  
Operating Junction Temperature Range  
Storage Temperature Range  
T
J
Device  
Package  
Shipping  
T
stg  
°C  
NUP4114HMR6T1G TSOP6 3000/Tape & Reel  
(PbFree)  
Lead Solder Temperature −  
Maximum (10 Seconds)  
T
L
°C  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Human Body Model (HBM)  
Machine Model (MM)  
IEC 6100042 Contact (ESD)  
ESD  
16000  
400  
13000  
V
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
See Application Note AND8308/D for further description of  
survivability specs.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
January, 2010 Rev. 3  
NUP4114HMR6/D  
NUP4114HMR6  
ELECTRICAL CHARACTERISTICS  
A
I
(T = 25°C unless otherwise noted)  
I
F
Symbol  
Parameter  
Maximum Reverse Peak Pulse Current  
Clamping Voltage @ I  
I
PP  
V
C
PP  
V
Working Peak Reverse Voltage  
RWM  
V
C
V
V
BR RWM  
V
I
R
Maximum Reverse Leakage Current @ V  
RWM  
I
V
F
R
T
I
V
Breakdown Voltage @ I  
Test Current  
BR  
T
I
T
F
I
Forward Current  
V
Forward Voltage @ I  
F
F
I
PP  
P
pk  
Peak Power Dissipation  
Max. Capacitance @ V = 0 and f = 1.0 MHz  
C
R
UniDirectional TVS  
*See Application Note AND8308/D for detailed explanations of  
datasheet parameters.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Reverse Working Voltage  
Breakdown Voltage  
Reverse Leakage Current  
Clamping Voltage  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
V
V
RWM  
(Note 1)  
I = 1 mA, (Note 2)  
5.0  
V
BR  
6.0  
7.5  
V
T
I
R
V
RWM  
= 5 V  
1.0  
9.0  
10  
mA  
V
V
I
= 5 A (Note 3)  
= 8 A (Note 3)  
C
C
PP  
PP  
Clamping Voltage  
V
I
V
Maximum Peak Pulse Current  
Junction Capacitance  
Junction Capacitance  
Clamping Voltage  
I
8x20 ms Waveform  
12  
A
PP  
C
C
V
= 0 V, f = 1 MHz between I/O Pins and GND  
= 0 V, f = 1 MHz between I/O Pins  
0.8  
1.0  
0.5  
12.1  
pF  
pF  
V
J
J
R
R
V
V
V
@ I = 1 A (Note 4)  
C
C
PP  
Clamping Voltage  
Per IEC 6100042 (Note 5)  
Figures 1 and 2  
V
1. TVS devices are normally selected according to the working peak reverse voltage (V  
or continuous peak operating voltage level.  
), which should be equal or greater than the DC  
RWM  
2. V is measured at pulse test current I .  
BR  
T
3. Nonrepetitive current pulse (Pin 5 to Pin 2)  
4. Surge current waveform per Figure 5.  
5. Typical waveform. For test procedure see Figures 3 and 4 and Application Note AND8307/D.  
Figure 1. ESD Clamping Voltage Screenshot  
Positive 8 kV Contact per IEC6100042  
Figure 2. ESD Clamping Voltage Screenshot  
Negative 8 kV Contact per IEC6100042  
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2
 
NUP4114HMR6  
IEC6100042 Waveform  
IEC 6100042 Spec.  
I
peak  
Test  
Voltage  
(kV)  
First Peak  
Current  
(A)  
100%  
90%  
Current at  
30 ns (A)  
Current at  
60 ns (A)  
Level  
1
2
3
4
2
4
6
8
7.5  
15  
4
8
2
4
6
8
I @ 30 ns  
22.5  
30  
12  
16  
I @ 60 ns  
10%  
t
P
= 0.7 ns to 1 ns  
Figure 3. IEC6100042 Spec  
Oscilloscope  
ESD Gun  
TVS  
50 W  
Cable  
50 W  
Figure 4. Diagram of ESD Test Setup  
The following is taken from Application Note  
AND8308/D Interpretation of Datasheet Parameters  
for ESD Devices.  
systems such as cell phones or laptop computers it is not  
clearly defined in the spec how to specify a clamping voltage  
at the device level. ON Semiconductor has developed a way  
to examine the entire voltage waveform across the ESD  
protection diode over the time domain of an ESD pulse in the  
form of an oscilloscope screenshot, which can be found on  
the datasheets for all ESD protection diodes. For more  
information on how ON Semiconductor creates these  
screenshots and how to interpret them please refer to  
AND8307/D.  
ESD Voltage Clamping  
For sensitive circuit elements it is important to limit the  
voltage that an IC will be exposed to during an ESD event  
to as low a voltage as possible. The ESD clamping voltage  
is the voltage drop across the ESD protection diode during  
an ESD event per the IEC6100042 waveform. Since the  
IEC6100042 was written as a pass/fail spec for larger  
100  
t
r
PEAK VALUE I  
@ 8 ms  
RSM  
90  
80  
70  
60  
50  
40  
30  
20  
PULSE WIDTH (t ) IS DEFINED  
P
AS THAT POINT WHERE THE  
PEAK CURRENT DECAY = 8 ms  
HALF VALUE I /2 @ 20 ms  
RSM  
t
P
10  
0
0
20  
40  
t, TIME (ms)  
60  
80  
Figure 5. 8 X 20 ms Pulse Waveform  
http://onsemi.com  
3
NUP4114HMR6  
Figure 6. 500 MHz Data Pattern  
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4
NUP4114HMR6  
APPLICATIONS INFORMATION  
Option 2  
The new NUP4114HMR6 is a low capacitance TVS diode  
array designed to protect sensitive electronics such as  
communications systems, computers, and computer  
peripherals against damage due to ESD events or transient  
overvoltage conditions. Because of its low capacitance, it  
can be used in high speed I/O data lines. The integrated  
design of the NUP4114HMR6 offers low capacitance  
steering diodes and a TVS diode integrated in a single  
package (TSOP6). If a transient condition occurs, the  
steering diodes will drive the transient to the positive rail of  
the power supply or to ground. The TVS device protects the  
power line against overvoltage conditions to avoid damage  
to the power supply and any downstream components.  
Protection of four data lines with bias and power supply  
isolation resistor.  
I/O 1  
I/O 2  
V
CC  
1
2
3
6
5
4
10 k  
I/O 3  
I/O 4  
NUP4114HMR6 Configuration Options  
The NUP4114HMR6 is able to protect up to four data  
lines against transient overvoltage conditions by driving  
them to a fixed reference point for clamping purposes. The  
steering diodes will be forward biased whenever the voltage  
The NUP4114HMR6 can be isolated from the power  
supply by connecting a series resistor between pin 5 and  
V . A 10 kW resistor is recommended for this application.  
CC  
This will maintain a bias on the internal TVS and steering  
diodes, reducing their capacitance.  
on the protected line exceeds the reference voltage (V or  
f
V
CC  
+ V ). The diodes will force the transient current to  
f
bypass the sensitive circuit.  
Option 3  
Data lines are connected at pins 1, 3, 4 and 6. The negative  
reference is connected at pin 2. This pin must be connected  
directly to ground by using a ground plane to minimize the  
PCB’s ground inductance. It is very important to reduce the  
PCB trace lengths as much as possible to minimize parasitic  
inductances.  
Protection of four data lines using the internal TVS diode  
as reference.  
I/O 1  
I/O 2  
1
2
3
6
5
4
Option 1  
Protection of four data lines and the power supply using  
V
CC  
as reference.  
NC  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
1
2
3
6
5
4
In applications lacking a positive supply reference or  
those cases in which a fully isolated power supply is  
required, the internal TVS can be used as the reference. For  
these applications, pin 5 is not connected. In this  
configuration, the steering diodes will conduct whenever the  
voltage on the protected line exceeds the working voltage of  
V
CC  
I/O 3  
I/O 4  
the TVS plus one diode drop (V = V + VTVS).  
C
f
ESD Protection of Power Supply Lines  
For this configuration, connect pin 5 directly to the  
When using diodes for data line protection, referencing to  
a supply rail provides advantages. Biasing the diodes  
reduces their capacitance and minimizes signal distortion.  
positive supply rail (V ), the data lines are referenced to  
CC  
the supply voltage. The internal TVS diode prevents  
overvoltage on the supply rail. Biasing of the steering diodes  
reduces their capacitance.  
http://onsemi.com  
5
NUP4114HMR6  
Implementing this topology with discrete devices does have  
inductance will provide significant benefits in transient  
disadvantages. This configuration is shown below:  
immunity.  
Even with good board layout, some disadvantages are still  
present when discrete diodes are used to suppress ESD  
events across datalines and the supply rail. Discrete diodes  
with good transient power capability will have larger die and  
therefore higher capacitance. This capacitance becomes  
problematic as transmission frequencies increase. Reducing  
capacitance generally requires reducing die size. These  
small die will have higher forward voltage characteristics at  
typical ESD transient current levels. This voltage combined  
with the smaller die can result in device failure.  
Power  
Supply  
I
ESDpos  
V
CC  
I
ESDpos  
D1  
D2  
Protected  
Device  
I
Data Line  
ESDneg  
VF + V  
CC  
I
ESDneg  
The ON Semiconductor NUP4114HMR6 was developed  
to overcome the disadvantages encountered when using  
discrete diodes for ESD protection. This device integrates a  
TVS diode within a network of steering diodes.  
VF  
Looking at the figure above, it can be seen that when a  
positive ESD condition occurs, diode D1 will be forward  
biased while diode D2 will be forward biased when a  
negative ESD condition occurs. For slower transient  
conditions, this system may be approximated as follows:  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
For positive pulse conditions:  
V = V + V  
c
CC  
fD1  
For negative pulse conditions:  
V = V  
c
fD2  
ESD events can have rise times on the order of some  
number of nanoseconds. Under these conditions, the effect  
of parasitic inductance must be considered. A pictorial  
representation of this is shown below.  
0
Figure 7. NUP4114HMR6 Equivalent Circuit  
Power  
Supply  
I
ESDpos  
During an ESD condition, the ESD current will be driven  
to ground through the TVS diode as shown below.  
V
CC  
I
ESDpos  
D1  
D2  
I
Protected  
Device  
ESDneg  
Power  
Supply  
Data Line  
V
CC  
V
= V + Vf + (L diESD/dt)  
C
CC  
I
ESDneg  
I
ESDpos  
D1  
D2  
Protected  
Device  
Data Line  
V
C
= Vf (L diESD/dt)  
An approximation of the clamping voltage for these fast  
transients would be:  
For positive pulse conditions:  
V = V + Vf + (L diESD/dt)  
c
CC  
For negative pulse conditions:  
V = V – (L diESD/dt)  
As shown in the formulas, the clamping voltage (V ) not  
only depends on the Vf of the steering diodes but also on the  
L diESD/dt factor. A relatively small trace inductance can  
result in hundreds of volts appearing on the supply rail. This  
endangers both the power supply and anything attached to  
that rail. This highlights the importance of good board  
layout. Taking care to minimize the effects of parasitic  
c
f
The resulting clamping voltage on the protected IC will  
be:  
V = VF + V  
The clamping voltage of the TVS diode depends on the  
magnitude of the ESD current. The steering diodes are fast  
switching devices with unique forward voltage and low  
capacitance characteristics.  
c
.
TVS  
c
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6
NUP4114HMR6  
TYPICAL APPLICATIONS  
UPSTREAM  
USB PORT  
V
BUS  
V
BUS  
V
BUS  
D+  
D−  
V
D+  
BUS  
R
R
T
DOWNSTREAM  
USB PORT  
T
D−  
V
V
BUS  
BUS  
NUP4114HMR6  
USB  
Controller  
GND  
GND  
C
C
T
T
V
BUS  
V
BUS  
NUP2202W1  
R
R
T
DOWNSTREAM  
USB PORT  
D+  
T
D−  
GND  
C
C
T
T
Figure 8. ESD Protection for USB Port  
RJ45  
Connector  
TX+  
TX+  
TX−  
TX−  
Coupling  
PHY  
Ethernet  
(10/100)  
Transformers  
RX+  
RX+  
RX−  
RX−  
NUP4114HMR6  
V
CC  
GND  
N/C  
N/C  
Figure 9. Protection for Ethernet (Differential Mode)  
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7
NUP4114HMR6  
R1  
RTIP  
R3  
R2  
RRING  
T1  
V
CC  
T1/E1  
TRANCEIVER  
NUP4114HMR6  
R4  
R5  
TTIP  
TRING  
T2  
Figure 10. TI/E1 Interface Protection  
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8
NUP4114HMR6  
PACKAGE DIMENSIONS  
TSOP6  
CASE 318G02  
ISSUE U  
NOTES:  
D
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
H
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM  
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.  
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,  
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR  
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D  
AND E1 ARE DETERMINED AT DATUM H.  
6
1
5
4
L2  
GAUGE  
PLANE  
E1  
E
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.  
2
3
L
MILLIMETERS  
SEATING  
M
C
NOTE 5  
DIM  
A
A1  
b
c
D
E
E1  
e
MIN  
0.90  
0.01  
0.25  
0.10  
2.90  
2.50  
1.30  
0.85  
0.20  
NOM  
1.00  
MAX  
1.10  
0.10  
0.50  
0.26  
3.10  
3.00  
1.70  
1.05  
0.60  
PLANE  
b
DETAIL Z  
e
0.06  
0.38  
0.18  
3.00  
c
2.75  
A
0.05  
1.50  
0.95  
L
0.40  
A1  
L2  
M
0.25 BSC  
DETAIL Z  
0°  
10°  
RECOMMENDED  
SOLDERING FOOTPRINT*  
6X  
0.60  
6X  
0.95  
3.20  
0.95  
PITCH  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NUP4114HMR6/D  

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