NVD5890NLT4G [ONSEMI]

功率 MOSFET,40V,123A,3.7 mΩ,单 N 沟道,DPAK,逻辑电平。;
NVD5890NLT4G
型号: NVD5890NLT4G
厂家: ONSEMI    ONSEMI
描述:

功率 MOSFET,40V,123A,3.7 mΩ,单 N 沟道,DPAK,逻辑电平。

开关 脉冲 晶体管
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中文:  中文翻译
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NVD5890NL  
Power MOSFET  
40 V, 3.7 mW, 123 A, Single NChannel  
DPAK  
Features  
Low R  
to Minimize Conduction Losses  
MSL 1 @ 260°C  
DS(on)  
http://onsemi.com  
100% Avalanche Tested  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
AEC Q101 Qualified and PPAP Capable  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
3.7 mW @ 10 V  
5.5 mW @ 4.5 V  
40 V  
123 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
D
V
DSS  
GatetoSource Voltage  
V
"20  
123  
V
GS  
NChannel  
Continuous Drain Cur-  
rent (R ) (Notes 1 &  
T
T
T
= 25°C  
= 85°C  
= 25°C  
I
A
C
C
C
D
G
q
JC  
95  
3)  
S
Power Dissipation  
(R ) (Note 1)  
P
107  
W
A
D
q
JC  
Steady  
State  
4
Continuous Drain Cur-  
rent (R ) (Notes 1, 2,  
T = 25°C  
A
I
24  
18.5  
4.0  
D
q
JA  
T = 85°C  
A
3)  
2
1
Power Dissipation  
T = 25°C  
A
P
W
3
D
(R ) (Notes 1 & 2)  
q
JA  
CASE 369C  
DPAK  
(Bent Lead)  
STYLE 2  
Pulsed Drain Current  
t =10ms T = 25°C  
I
400  
100  
A
A
p
A
DM  
I
DmaxPkg  
Current Limited by Package  
(Note 3)  
T = 25°C  
A
Operating Junction and Storage Temperature  
T , T  
55 to  
°C  
J
stg  
MARKING DIAGRAMS  
& PIN ASSIGNMENT  
175  
Source Current (Body Diode)  
I
S
100  
320  
A
4
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Drain  
Energy (V = 10 V, L = 0.3 mH, I  
=
GS  
L(pk)  
46.2 A, R = 25 W)  
G
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
2
Drain  
1
3
Gate Source  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
Y
WW  
= Year  
= Work Week  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and suty cycle.  
5890NL = Device Code  
G
= PbFree Package  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
October, 2012 Rev. 0  
NVD5890NL/D  
 
NVD5890NL  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
Unit  
JunctiontoCase (Drain)  
R
1.4  
37  
°C/W  
q
JC  
JunctiontoAmbient Steady State (Note 2)  
R
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 250 mA  
40  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/T  
J
40  
mV/°C  
(BR)DSS  
Zero Gate Voltage Drain Current  
I
T = 25°C  
1.0  
100  
mA  
DSS  
J
V
= 0 V,  
= 40 V  
GS  
DS  
V
T = 150°C  
J
GatetoSource Leakage Current  
ON CHARACTERISTICS (Note 4)  
Gate Threshold Voltage  
I
V
= 0 V, V = "20 V  
"100  
nA  
GSS  
DS  
GS  
V
V
= V , I = 250 mA  
1.5  
2.5  
V
GS(TH)  
GS  
DS  
D
Negative Threshold Temperature  
Coefficient  
V
/T  
7.4  
mV/°C  
GS(TH)  
J
DraintoSource On Resistance  
R
V
= 10 V, I = 50 A  
2.9  
4.4  
3.7  
5.5  
mW  
S
DS(on)  
GS  
D
V
GS  
= 4.5 V, I = 50 A  
D
Forward Transconductance  
CHARGES AND CAPACITANCES  
Input Capacitance  
gFS  
V
= 15 V, I = 15 A  
16.3  
DS  
D
C
4760  
580  
385  
84  
pF  
iss  
V
GS  
= 0 V, f = 1.0 MHz,  
Output Capacitance  
C
oss  
V
DS  
= 25 V  
Reverse Transfer Capacitance  
Total Gate Charge  
C
rss  
Q
V
GS  
= 10 V, V = 15 V,  
nC  
nC  
G(TOT)  
DS  
= 50 A  
I
D
Total Gate Charge  
Q
42  
G(TOT)  
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Q
4.2  
G(TH)  
V
GS  
= 4.5 V, V = 15 V,  
DS  
I
= 50 A  
D
Q
13.7  
18.8  
GS  
Q
GD  
SWITCHING CHARACTERISTICS (Note 5)  
TurnOn Delay Time  
Rise Time  
t
12  
35  
38  
11  
ns  
d(on)  
t
r
V
= 10 V, V = 20 V,  
DS  
GS  
D
I
= 50 A, R = 2.0 W  
G
TurnOff Delay Time  
Fall Time  
t
d(off)  
t
f
4. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%.  
5. Switching characteristics are independent of operating junction temperatures.  
http://onsemi.com  
2
 
NVD5890NL  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
SD  
V
S
= 0 V,  
T = 25°C  
0.86  
0.78  
1.2  
1.0  
V
GS  
J
I
= 50 A  
V
S
= 0 V,  
= 20 A  
T = 25°C  
J
GS  
I
Reverse Recovery Time  
Charge Time  
t
35  
19  
16  
34  
ns  
RR  
ta  
V
GS  
= 0 V, dIs/dt = 100 A/ms,  
I
= 50 A  
S
Discharge Time  
tb  
Reverse Recovery Charge  
Q
nC  
RR  
http://onsemi.com  
3
NVD5890NL  
TYPICAL PERFORMANCE CURVES  
250  
200  
150  
100  
50  
250  
T = 25°C  
J
4.8 V  
V
DS  
10 V  
10 V  
V
GS  
= 4.4 V  
4 V  
200  
150  
100  
50  
T = 125°C  
J
3.6 V  
T = 25°C  
J
3.2 V  
T = 55°C  
J
0
0
2.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
0.010  
0.008  
0.006  
0.004  
0.002  
0.001  
0.010  
0.008  
0.006  
0.004  
0.002  
0.000  
I
= 50 A  
T = 25°C  
D
J
T = 25°C  
J
V
= 4.5 V  
GS  
V
GS  
= 10 V  
0
40  
80  
120  
160  
200  
240  
280  
2
3
4
5
6
7
8
9
10  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. OnResistance vs. GatetoSource  
Figure 4. OnResistance vs. Drain Current and  
Voltage  
Gate Voltage  
2.0  
1.5  
1.0  
0.5  
100000  
10000  
1000  
V
GS  
= 0 V  
I
V
= 50 A  
D
= 10 V  
GS  
T = 150°C  
J
T = 125°C  
J
50 25  
0
25  
50  
75 100 125 150 175  
5
10  
15  
20  
25  
30  
35  
40  
T , JUNCTION TEMPERATURE (°C)  
J
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 5. OnResistance Variation with  
Figure 6. DraintoSource Leakage Current  
Temperature  
vs. Drain Voltage  
http://onsemi.com  
4
NVD5890NL  
TYPICAL PERFORMANCE CURVES  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
10  
Q
T
V
= 0 V  
GS  
T = 25°C  
J
8
6
4
2
0
C
iss  
Q
Q
gs  
gd  
V
I
= 15 V  
= 50 A  
DS  
C
D
oss  
T = 25°C  
J
C
rss  
0
10  
20  
30  
40  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
DRAINTOSOURCE VOLTAGE (V)  
Q , TOTAL GATE CHARGE (nC)  
G
Figure 7. Capacitance Variation  
Figure 8. GateToSource Voltage vs.  
Total Charge  
1000  
100  
10  
100  
75  
50  
25  
0
V
I
= 20 V  
= 50 A  
= 10 V  
V
= 0 V  
DD  
GS  
T = 25°C  
J
t
D
d(off)  
V
GS  
t
d(on)  
t
r
t
f
1
10  
R , GATE RESISTANCE (W)  
100  
0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00  
V
SD  
, SOURCETODRAIN VOLTAGE (V)  
G
Figure 9. Resistive Switching Time  
Variation vs. Gate Resistance  
Figure 10. Diode Forward Voltage vs. Current  
1000  
100  
10 ms  
100 ms  
V
20 V  
GS  
1 ms  
SINGLE PULSE  
10  
T
C
= 25°C  
10 ms  
dc  
R
LIMIT  
DS(on)  
THERMAL LIMIT  
PACKAGE LIMIT  
1
0.1  
1
10  
100  
V
DS  
, DRAINTOSOURCE VOLTAGE (VOLTS)  
Figure 11. Maximum Rated Forward Biased  
Safe Operating Area  
http://onsemi.com  
5
NVD5890NL  
TYPICAL PERFORMANCE CURVES  
10  
D = 0.5  
0.2  
1.0  
0.1  
0.05  
0.02  
0.1  
0.01  
0.01  
SINGLE PULSE  
R
= 1.4°C/W  
q
JC  
Steady State  
0.001  
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t, TIME (s)  
Figure 12. Thermal Response  
ORDERING INFORMATION  
Order Number  
Package  
Shipping  
NVD5890NLT4G  
DPAK  
(PbFree)  
2500/Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
4
DPAK (SINGLE GAUGE)  
CASE 369C  
ISSUE G  
2
1
DATE 31 MAY 2023  
3
SCALE 1:1  
GENERIC  
MARKING DIAGRAM*  
XXXXXXG  
ALYWW  
AYWW  
XXX  
XXXXXG  
IC  
Discrete  
XXXXXX = Device Code  
A
= Assembly Location  
L
= Wafer Lot  
STYLE 1:  
STYLE 2:  
PIN 1. GATE  
2. DRAIN  
STYLE 3:  
STYLE 4:  
STYLE 5:  
Y
WW  
G
= Year  
= Work Week  
= PbFree Package  
PIN 1. BASE  
PIN 1. ANODE  
2. CATHODE  
3. ANODE  
PIN 1. CATHODE  
2. ANODE  
3. GATE  
PIN 1. GATE  
2. ANODE  
3. CATHODE  
4. ANODE  
2. COLLECTOR  
3. EMITTER  
3. SOURCE  
4. DRAIN  
4. COLLECTOR  
4. CATHODE  
4. ANODE  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
STYLE 6:  
PIN 1. MT1  
2. MT2  
STYLE 7:  
PIN 1. GATE  
STYLE 8:  
PIN 1. N/C  
STYLE 9:  
PIN 1. ANODE  
2. CATHODE  
STYLE 10:  
PIN 1. CATHODE  
2. ANODE  
2. COLLECTOR  
2. CATHODE  
3. GATE  
4. MT2  
3. EMITTER  
4. COLLECTOR  
3. ANODE  
4. CATHODE  
3. RESISTOR ADJUST  
4. CATHODE  
3. CATHODE  
4. ANODE  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON10527D  
DPAK (SINGLE GAUGE)  
PAGE 1 OF 1  
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