NVHL160N120SC1 [ONSEMI]

Silicon Carbide (SiC) MOSFET, N‐Channel - EliteSiC, 160 mΩ, 1200 V, M1, TO247−3L;
NVHL160N120SC1
型号: NVHL160N120SC1
厂家: ONSEMI    ONSEMI
描述:

Silicon Carbide (SiC) MOSFET, N‐Channel - EliteSiC, 160 mΩ, 1200 V, M1, TO247−3L

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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
MOSFET – 160 mohm,  
1200ꢀV, M1, TO-247-3L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
1200 V  
224 m@ 20 V  
17 A  
NCHANNEL MOSFET  
NVHL160N120SC1  
Features  
D
Typ. R  
= 160 mꢀ  
Ultra Low Gate Charge (typ. Q  
DS(on)  
= 34 nC)  
G(tot)  
Low Effective Output Capacitance (typ. C = 50 pF)  
oss  
G
100% UIL Tested  
AECQ101 Qualified and PPAP Capable  
S
This Device is Halide Free and RoHS Compliant with exemption 7a,  
PbFree 2LI (on second level interconnection)  
Typical Applications  
Automotive On Board Charger  
Automotive DCDC Converter for EV/HEV  
G
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
S
J
TO2473LD  
CASE 340CX  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
Unit  
V
DSS  
1200  
15/+25  
5/+20  
V
V
V
GatetoSource Voltage  
V
GS  
MARKING DIAGRAM  
Recommended Opera-  
tion Values of Gateto−  
Source Voltage  
T
C
< 175°C  
V
GSop  
Continuous Drain  
Current  
Steady  
State  
T
= 25°C  
I
17  
A
C
D
&Z&3&K  
NVHL160  
N120SC1  
Power Dissipation  
P
119  
12  
W
A
D
Continuous Drain  
Current  
Steady  
State  
T
C
= 100°C  
I
D
Power Dissipation  
P
59  
69  
W
A
D
Pulsed Drain Current  
(Note 2)  
T = 25°C  
A
I
DM  
Single Pulse Surge Drain T = 25°C, t = 10 s,  
I
140  
A
A
p
DSC  
&Z  
&3  
&K  
= Assembly Plant Code  
= Date Code (Year & Week)  
= Lot  
Current Capability  
R
= 4.7  
G
Operating Junction and Storage Temperature  
Range  
T , T  
J
55 to  
+175  
°C  
stg  
NVHL160N120SC1 = Specific Device Code  
Source Current (Body Diode)  
I
S
11  
A
Single Pulse DraintoSource Avalanche  
E
AS  
128  
mJ  
ORDERING INFORMATION  
Energy (I  
= 23 A, L = 1 mH) (Note 3)  
L(pk)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Device  
Package  
Shipping  
30 Units /  
Tube  
TO2473L  
NVHL160N120SC1  
THERMAL CHARATERISTICS  
Parameter  
JunctiontoCase (Note 1)  
JunctiontoAmbient (Note 1)  
Symbol  
Value  
1.3  
Unit  
°C/W  
°C/W  
R
JC  
R
40  
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Repetitive rating, limited by max junction temperature.  
3. E of 128 mJ is based on starting T = 25°C; L = 1 mH, I = 16 A,  
AS  
DD  
J
AS  
V
= 120 V, V = 18 V.  
GS  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
May, 2022 Rev. 2  
NVHL160N120SC1/D  
 
NVHL160N120SC1  
ELECTRICAL CHARACTERISTICS (T = 25_C unless otherwise stated)  
J
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
I
= 0 V, I = 1 mA  
1200  
V
(BR)DSS  
GS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/T  
= 1 mA, referenced to 25_C  
600  
mV/_C  
(BR)DSS  
J
D
Zero Gate Voltage Drain Current  
I
100  
250  
1
A
V
GS  
V
GS  
V
GS  
= 0 V, V = 1200 V, T = 25_C  
DSS  
DS  
J
= 0 V, V = 1200 V, T = 175_C  
DS  
J
GatetoSource Leakage Current  
ON CHARACTERISTICS  
I
= +25/15 V, V = 0 V  
DS  
A
GSS  
Gate Threshold Voltage  
V
R
V
= V , I = 2.5 mA  
1.8  
5  
3.1  
4.3  
+20  
224  
377  
V
V
GS(th)  
GS  
DS  
D
Recommended Gate Voltage  
DraintoSource On Resistance  
V
GOP  
V
GS  
V
GS  
V
DS  
= 20 V, I = 12 A, T = 25_C  
162  
271  
3
mꢀ  
DS(on)  
D
J
= 20 V, I = 12 A, T = 175_C  
D
J
Forward Transconductance  
g
FS  
= 10 V, I = 12 A  
S
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
C
V
= 0 V, f = 1 MHz, V = 800 V  
665  
50  
pF  
nC  
ISS  
GS  
GS  
DS  
C
OSS  
RSS  
C
5
Q
V
= 5/20 V, V = 600 V, I = 16 A  
34  
G(tot)  
DS  
D
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Gate Resistance  
Q
6
G(th)  
Q
12.5  
9.6  
1.4  
GS  
GD  
Q
R
f = 1 MHz  
G
SWITCHING CHARACTERISTICS  
Turn-On Delay Time  
Rise Time  
t
t
V
D
= 5/20 V, V = 800 V,  
11  
19  
ns  
d(on)  
GS  
DS  
I
= 16 A, R = 6 ,  
G
t
r
Inductive Load  
TurnOff Delay Time  
Fall Time  
15  
d(off)  
t
f
8
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
E
200  
34  
J
ON  
OFF  
TOT  
E
E
234  
DRAINSOURCE DIODE CHARACTERISTICS  
Continuous DraintoSource Diode  
I
V
V
= 5 V, T = 25_C  
11  
69  
A
A
SD  
GS  
J
Forward Current  
Pulsed DraintoSource Diode  
Forward Current (Note 2)  
I
= 5 V, T = 25_C  
SDM  
GS  
J
Forward Diode Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Charge Time  
V
V
V
= 5 V, I = 6 A, T = 25_C  
4
10  
V
ns  
nC  
J  
A
SD  
GS  
SD  
J
t
= 5/20 V, I = 16 A,  
15  
45  
3.9  
6.2  
7.4  
7
RR  
GS  
S
SD  
dI /dt = 1000 A/s  
Q
RR  
E
REC  
I
RRM  
Ta  
ns  
ns  
Discharge Time  
Tb  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
2
NVHL160N120SC1  
TYPICAL CHARACTERISTICS  
50  
40  
30  
20  
4.0  
10 V  
V
= 12 V  
GS  
19 V  
3.5  
V
= 20 V  
GS  
15 V  
18 V  
16 V  
3.0  
2.5  
2.0  
1.5  
17 V  
17 V  
18 V  
16 V  
19 V  
15 V  
12 V  
10 V  
V
GS  
= 20 V  
10  
0
1.0  
0.5  
0
2
4
6
8
10  
0
10  
20  
I , DRAIN CURRENT (A)  
30  
40  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
D
Figure 1. OnRegion Characteristics  
Figure 2. Normalized OnResistance vs. Drain  
Current and Gate Voltage  
700  
600  
500  
1.9  
1.7  
1.5  
1.3  
1.1  
I = 12 A  
D
I
V
= 12 A  
D
= 20 V  
GS  
400  
300  
200  
T = 150°C  
J
T = 25°C  
J
0.9  
0.7  
100  
0
75 50 25  
0
25 50 75 100 125 150 175  
9
10 11 12 13 14 15 16 17 18 19 20  
T , JUNCTION TEMPERATURE (°C)  
J
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 3. OnResistance Variation with  
Figure 4. OnResistance vs. GatetoSource  
Temperature  
Voltage  
25  
20  
15  
10  
100  
V
= 5 V  
V
DS  
= 20 V  
GS  
T = 25°C  
J
T = 175°C  
J
T = 25°C  
J
10  
5
0
T = 175°C  
J
T = 55°C  
T = 55°C  
J
J
1
2
4
6
8
10  
12  
14  
16  
2
3
4
5
6
7
8
9
V
GS  
, GATETOSOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Diode Forward Voltage vs. Current  
www.onsemi.com  
3
NVHL160N120SC1  
TYPICAL CHARACTERISTICS (continued)  
10K  
20  
V
DD  
= 400 V  
I
D
= 16 A  
15  
10  
5
V
= 800 V  
C
DD  
1K  
iss  
V
= 600 V  
DD  
100  
C
oss  
10  
1
C
0
rss  
f = 1 MHz  
= 0 V  
V
GS  
5  
0
10  
20  
Q , GATE CHARGE (nC)  
30  
40  
0.1  
1
10  
100  
800  
175  
0.1  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
g
Figure 7. GatetoSource Voltage vs. Total  
Figure 8. Capacitance vs. DraintoSource  
Charge  
Voltage  
20  
16  
12  
8
50  
10  
V
GS  
= 20 V  
T = 25°C  
J
T = 150°C  
J
4
0
R
= 1.3°C/W  
JC  
1
0.001  
0.01  
0.1  
1
10  
25  
50  
75  
100  
125  
150  
t , TIME IN AVALANCHE (ms)  
AV  
T , CASE TEMPERATURE (°C)  
C
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
100  
100K  
10K  
1K  
Single Pulse  
R
= 1.3°C/W  
JC  
= 25°C  
T
C
10 s  
10  
1
100 s  
This area is  
limited by R  
DS(on)  
1 ms  
10 ms  
100 ms  
Single Pulse  
T = Max Rated  
0.1  
100  
10  
J
R
= 1.3°C/W  
JC  
T
C
= 25°C  
0.01  
0.1  
1
10  
100  
1K  
5K  
0.00001 0.0001  
0.001  
0.01  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
t, PULSE WIDTH (sec)  
Figure 11. Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
www.onsemi.com  
4
NVHL160N120SC1  
TYPICAL CHARACTERISTICS (continued)  
2
1
50% Duty Cycle  
20%  
10%  
5%  
0.1  
2%  
Notes:  
(t) = r(t) x R  
1%  
P
DM  
Z
JC  
JC  
0.01  
Single Pulse  
R
= 1.3°C/W  
JC  
t
Peak T = P  
x Z  
(t) + T  
JC C  
1
J
DM  
Duty Cycle, D = t /t  
t
1
2
2
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t, RECTANGULAR PULSE DURATION (sec)  
Figure 13. JunctiontoAmbient Thermal Response  
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5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CX  
ISSUE A  
DATE 06 JUL 2020  
GENERIC  
MARKING DIAGRAM*  
XXXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW  
G
= Work Week  
= PbFree Package  
XXXXXXXXX  
AYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON93302G  
TO2473LD  
PAGE 1 OF 1  
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