NZ9F13VT5G [ONSEMI]

Zener Voltage Regulators 200 mW SOD−923 Surface Mount; 齐纳稳压器为200 ​​mW SOD- 923表面贴装
NZ9F13VT5G
型号: NZ9F13VT5G
厂家: ONSEMI    ONSEMI
描述:

Zener Voltage Regulators 200 mW SOD−923 Surface Mount
齐纳稳压器为200 ​​mW SOD- 923表面贴装

稳压器
文件: 总4页 (文件大小:93K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NZ9F2V4T5G SERIES  
Zener Voltage Regulators  
200 mW SOD923 Surface Mount  
This series of Zener diodes is packaged in a SOD923 surface  
mount package. They are designed to provide voltage regulation  
protection and are especially attractive in situations where space is at a  
premium. They are well suited for applications such as cellular  
phones, hand held portables, and high density PC boards.  
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Specification Features:  
1
2
Cathode  
Anode  
Standard Zener Breakdown Voltage Range 2.4 V to 24 V  
Steady State Power Rating of 200 mW  
Small Body Outline Dimensions:  
0.039x 0.024(1.00 mm x 0.60 mm)  
Low Body Height: 0.016(0.40 mm)  
MARKING  
DIAGRAM  
2
ESD Rating of Class 3 (>16 kV) per Human Body Model  
These are PbFree Devices  
1
X MG  
SOD923  
CASE 514AB  
G
1
2
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V0  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
X
M
G
= Specific Device Code  
= Month Code  
= PbFree Package  
(Note: Microdot may be in either location)  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
ORDERING INFORMATION  
Device  
Package  
Shipping†  
MAXIMUM RATINGS  
NZ9FxxxxT5G  
SOD923 8000/Tape & Reel  
(PbFree)  
Rating  
Symbol  
Max  
Unit  
Total Device Dissipation FR5 Board,  
P
D
200  
mW  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
@ T = 25°C  
A
Junction and Storage  
Temperature Range  
T , T  
65 to +150  
°C  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics tables starting on  
page 3 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
July, 2008 Rev. 1  
NZ9F2V4/D  
NZ9F2V4T5G SERIES  
ELECTRICAL CHARACTERISTICS  
I
(T = 25°C unless otherwise noted,  
A
I
F
V = 0.9 V Max. @ I = 10 mA for all types)  
F
F
Symbol  
Parameter  
V
Reverse Zener Voltage @ I  
Reverse Current  
Z
ZT  
I
ZT  
V
Z
V
R
V
I
V
F
Z
Maximum Zener Impedance @ I  
Reverse Current  
R
ZT  
ZT  
ZK  
ZT  
ZK  
I
I
Z
Maximum Zener Impedance @ I  
ZK  
I
Reverse Leakage Current @ V  
Reverse Voltage  
R
R
V
R
I
F
Forward Current  
Zener Voltage Regulator  
V
F
Forward Voltage @ I  
F
QV  
Maximum Temperature Coefficient of V  
Z
Z
C
Max. Capacitance @V = 0 and f = 1 MHz  
R
100  
80  
60  
40  
20  
0
0
25  
50  
75  
100  
125  
150  
TEMPERATURE (°C)  
Figure 1. Steady State Power Derating  
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2
NZ9F2V4T5G SERIES  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted, V = 0.9 V Max. @ I = 10 mA for all types)  
A
F
F
Zener Voltage (Note  
1)  
Zener Impedance  
Leakage Current  
C
Z
QV  
(mV/k) @ I  
@ V = 0  
ZT  
Z
R
@ I  
V (Volts)  
@ I  
Z
@ I  
I @ V  
R R  
f = 1 MHz  
ZT  
Z
ZT  
ZK  
ZK  
ZT  
Device  
Marking  
Min  
Max  
mA  
W
100  
100  
100  
100  
100  
100  
100  
100  
80  
W
1000  
1000  
1000  
1000  
1000  
1000  
1000  
800  
500  
200  
100  
60  
mA  
mA  
50  
20  
10  
10  
10  
5
Volts  
Min  
Max  
pF  
Device  
NZ9F2V4T5G  
NZ9F2V7T5G  
NZ9F3V0T5G  
NZ9F3V3T5G  
NZ9F3V6T5G  
NZ9F3V9T5G  
NZ9F4V3T5G  
NZ9F4V7T5G  
NZ9F5V1T5G  
NZ9F5V6T5G  
NZ9F6V2T5G  
NZ9F6V8T5G  
NZ9F7V5T5G  
NZ9F8V2T5G  
NZ9F9V1T5G  
NZ9F10VT5G  
NZ9F11VT5G  
NZ9F12VT5G  
NZ9F13VT5G  
NZ9F15VT5G  
NZ9F16VT5G  
NZ9F18VT5G  
NZ9F20VT5G  
NZ9F22VT5G  
NZ9F24VT5G  
J
E**  
T**  
Q
2.28  
2.57  
2.85  
3.14  
3.42  
3.71  
4.09  
4.47  
4.85  
5.32  
5.89  
6.46  
7.13  
7.79  
8.65  
2.52  
2.84  
3.15  
3.47  
3.78  
4.10  
4.52  
4.94  
5.36  
5.88  
6.51  
7.14  
7.88  
8.61  
9.56  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
1
1
1
3.5  
3.5  
3.5  
3.5  
3.5  
3.5  
3.5  
3.5  
2.7  
2.0  
0.4  
0
0
210  
210  
210  
210  
210  
210  
210  
150  
130  
115  
110  
105  
100  
90  
1
1
1
0
1
1
0
3**  
V**  
Y**  
3
1
1
0
1
1
2.5  
0
1
5
1
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
2
1
0.2  
1.2  
2.5  
3.7  
4.5  
5.3  
6.2  
7
4
2
1.5  
2.5  
3
5
60  
1
6
60  
1
A*  
D*  
E*  
F*  
J*  
40  
0.5  
0.5  
0.5  
0.5  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
3.5  
4
1.2  
30  
60  
2.5  
30  
60  
5
3.2  
30  
60  
6
3.8  
80  
9.50 10.50  
10.45 11.55  
11.40 12.60  
12.35 13.65  
14.25 15.75  
15.20 16.80  
17.10 18.90  
19.00 21.00  
20.90 23.10  
22.80 25.20  
30  
60  
7
4.5  
8
80  
K*  
L*  
P*  
Q*  
R*  
T*  
V*  
Y*  
F
30  
60  
8
5.4  
9
80  
30  
80  
9
6
10  
11  
13  
14  
16  
18  
20  
22  
80  
37  
80  
10  
11  
12  
14  
15.4  
16.8  
18.9  
7
75  
42  
80  
9.2  
70  
50  
80  
10.4  
12.4  
14.4  
15.4  
16.8  
65  
50  
80  
60  
55  
100  
100  
120  
55  
55  
55  
70  
50  
*Rotated 90°.  
**Rotated 270°.  
1. Zener voltage is measured with a pulse test current I at an ambient temperature of 25°C.  
Z
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3
 
NZ9F2V4T5G SERIES  
PACKAGE DIMENSIONS  
SOD923  
CASE 514AB01  
ISSUE B  
X−  
D
NOTES:  
Y−  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH THICKNESS. MINIMUM LEAD  
THICKNESS IS THE MINIMUM THICKNESS OF  
BASE MATERIAL.  
E
1
2
b 2X  
0.08 (0.0032)  
X
Y
MILLIMETERS  
DIM MIN NOM MAX MIN  
INCHES  
NOM MAX  
A
A
b
c
0.34  
0.15  
0.07  
0.75  
0.55  
0.95  
0.05  
0.37  
0.20  
0.12  
0.80  
0.60  
1.00  
0.10  
0.40  
0.25  
0.17  
0.85  
0.65  
1.05  
0.15  
0.013 0.015 0.016  
0.006 0.008 0.010  
0.003 0.005 0.007  
0.030 0.031 0.033  
0.022 0.024 0.026  
0.037 0.039 0.041  
0.002 0.004 0.006  
D
E
H
E
L
c
L
H
E
SOLDERING FOOTPRINT*  
0.90  
0.40  
0.30  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NZ9F2V4/D  

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