PCFG50T65SQF [ONSEMI]

650V 50A FS4 IGBT Wafer Sales;
PCFG50T65SQF
型号: PCFG50T65SQF
厂家: ONSEMI    ONSEMI
描述:

650V 50A FS4 IGBT Wafer Sales

双极性晶体管
文件: 总3页 (文件大小:123K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DIE DATA SHEET  
www.onsemi.com  
IGBT Die  
VRCE = 650 V  
IC = Limited by Tj(max)  
PCFG50T65SQF  
Using novel field stop IGBT technology, onsemi’s new series of  
field stop 4 generation IGBTs offer the optimum performance for  
C
th  
solar inverter and UPS applications where low conduction and  
switching losses are essential.  
G
Features  
Maximum Junction Temperature: T = 175°C  
J
Positive Temperature Coefficient for Easy Parallel Operating  
High Current Capability  
E
Low Saturation Voltage: V  
High Input Impedance  
Fast Switching  
= 1.6 V (Typ.) @ I = 50 A  
C
CE(sat)  
Tighten Parameter Distribution  
Typical Applications  
Solar Inverters  
UPS Systems  
MECHANICAL DATA  
Parameter  
Mils  
mm  
Die Size  
153.94 × 153.94  
118.9 × 108.58  
14.05 × 17.68  
2.48  
3910 x 3910  
3020 x 2758  
357 x 449.2  
63  
Gate Pad Size  
Emitter Pad Size  
Die Thickness  
Scribe Width  
DIE Outline  
80 mm  
ORDERING INFORMATION  
Top Metal  
5 mm AlSiCu  
1.05 mm Al/NiV/Ag  
Silicon Nitride  
200 mm  
Back Metal  
Device  
Inking?  
Shipping Method  
Topside Passivation  
Wafer Diameter  
Max Possible Die Per Wafer  
PCFG50T65SQF  
No  
Sawn Wafer on Tape  
1743  
Recommended Storage  
Environment  
In original container, in dry nitrogen, < 3  
months at ambient temperature of 23°C  
MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
650  
Unit  
V
Collector to Emitter Voltage, T = 25°C  
V
CES  
V
GES  
J
Gate to Emitter Voltage  
20  
(Note 1)  
200  
V
Collector Current  
@T = 25°C  
I
C
A
C
Pulsed Collector Current  
I
A
CM  
Operating Junction Temperature  
Storage Temperature Range  
T
40 to +175  
17 to +25  
°C  
°C  
J
T
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Depending on the thermal properties of assembly.  
2. Not subject to production test verified by design/characterization.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
March, 2022 Rev. 1  
PCFG50T65SQF/D  
 
PCFG50T65SQF  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
CollectorEmitter Breakdown Voltage  
V
GE  
= 0 V, I = 1 mA  
BV  
CES  
650  
V
C
Temperature Coefficient of Breakdown  
Voltage  
I
C
= 1 mA, reference to 25°C  
DBV  
/DT  
J
0.6  
V/°C  
CES  
CollectorEmitter Cutoff Current  
Gate Leakage Current  
V
V
= 0 V, V = V  
I
DSS  
250  
400  
mA  
GE  
CE  
CES  
= 0 V, V = V  
I
nA  
CE  
GE  
GES  
GSS  
ON CHARACTERISTICS  
GE Threshold Voltage  
V
= V , I = 50 mA  
V
2.6  
4.5  
1.6  
6.4  
2.1  
V
V
V
GE  
CE  
C
GE(th)  
CollectorEmitter Saturation Voltage  
I
C
C
= 50 A, V = 15 V  
V
CE(sat)  
GE  
I
= 50 A, V = 15 V, T = 175°C  
1.92  
GE  
C
DYNAMIC CHARACTERISTICS  
Input Capacitance  
V
= 0 V, V = 30 V, f = 1 MHz  
C
ies  
3275  
84  
pF  
GE  
CE  
CE  
Output Capacitance  
Coes  
Reverse Transfer Capacitance  
GATE CHARGE CHARACTERISTICS  
Total Gate Charge  
C
12  
res  
V
= 400 V, I = 50 A, V = 15 V  
Q
99  
17  
23  
nC  
C
GE  
g
ge  
gc  
Gate to Emitter Charge  
Q
Q
Gate to Collector Charge  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. For ordering, technique and other information on onsemi automotive bare die products, please contact automotivebaredie@onsemi.com.  
(all dimensions in mm)  
Figure 1. Die Layout  
Further Electrical Characteristic  
Switching characteristics and thermal properties are depending strongly on module design and mounting technology and can  
therefore not be specified for a bare die.  
www.onsemi.com  
2
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
onsemi Website: www.onsemi.com  
ONLINE SUPPORT: www.onsemi.com/support  
For additional information, please contact your local Sales Representative at  
www.onsemi.com/support/sales  

相关型号:

PCFG60T120SQF

Ultra Field Stop IGBT 1200V 60A bare die
ONSEMI

PCFG75T120SQF

超场截止 IGBT 1200V 75A 裸片
ONSEMI

PCFG75T65SQF

650V 75A FS4 IGBT 晶片级
ONSEMI

PCFJZH-AC001

Ceramic BPF, 0.45MHz, ROHS COMPLIANT PACKAGE
TOKO

PCFMA-003

Ceramic BPF, 0.455MHz
TOKO

PCFMA-012

Ceramic BPF, 0.46MHz
TOKO

PCFMA-027

Ceramic BPF, 0.45MHz
TOKO

PCFMA-050

Ceramic BPF, 0.459MHz
TOKO

PCFMA-221

AM CERAMIC FILTERS WITH MATCHING COIL
TOKO

PCFMA3-020

Ceramic BPF
TOKO

PCFMA3-023

Ceramic BPF
TOKO

PCFMB100E6

IGBT Module-Chopper
NIEC