RURD660S9A-F085P [ONSEMI]

600 V、6 A、1.26 V、DPAK超快速整流器;
RURD660S9A-F085P
型号: RURD660S9A-F085P
厂家: ONSEMI    ONSEMI
描述:

600 V、6 A、1.26 V、DPAK超快速整流器

二极管
文件: 总6页 (文件大小:471K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Ultrafast Power Rectifier  
6 A, 600 V  
RURD660S9A-F085  
The RURD660S9AF085 is an ultrafast diode with soft recovery  
characteristics (trr < 83 ns). It has a low forward voltage drop and is of  
silicon nitride passivated ionimplanted epitaxial planar construction.  
This device is intended for use as a freewheeling/clamping diode and  
rectifier in a variety of switching power supplies and other power  
switching applications. Its low stored charge and ultrafast soft  
recovery minimize ringing and electrical noise in many power  
switching circuits, thus reducing powerloss in the switching  
transistors.  
www.onsemi.com  
1, 2, 4. Cathode  
3. Anode  
Features  
High Speed Switching (t = 63 ns (Typ.) @ I = 6 A)  
4
rr  
F
Low Forward Voltage (V = 1.26 V (Typ.) @ I = 6 A)  
F
F
Avalanche Energy Rated  
AECQ101 Qualified and PPAP Capable  
This is a PbFree Device  
2
3
1
DPAK3 (TO252 3 LD)  
Applications  
CASE 369AS  
General Purpose  
Switching Mode Power Supply  
Power Switching Circuits  
MARKING DIAGRAM  
$Y&Z&3&K  
RUR660  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Ratings  
600  
Unit  
V
V
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
RRM  
RWM  
RUR660 = Specific Device Code  
V
600  
V
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= 3Digit Date Code  
V
R
600  
V
I
Average Rectified Forward Current  
6
A
F(AV)  
@ T = 25°C  
= 2Digits Lot Run Traceability Code  
C
I
Nonrepetitive Peak Surge Current  
60  
A
FSM  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 4 of  
this data sheet.  
T , T  
Operating Junction and Storage  
Temperature  
55 to +175  
°C  
J
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Max  
Unit  
R
Maximum Thermal Resistance,  
Junction to Case  
3
°C/W  
q
JC  
R
Maximum Thermal Resistance,  
140  
50  
°C/W  
°C/W  
q
JA  
(Note 1) Junction to Ambient  
R
Maximum Thermal Resistance,  
(Note 2) Junction to Ambient  
q
JA  
1. Mounted on a minimum pad follow by JEDEC standard.  
2
2. Mounted on a 1 in pad of 2 oz copper follow by JEDEC standard.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
July, 2020 Rev. 4  
RURD660S9AF085/D  
 
RURD660S9AF085  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Condition  
Min  
Typ  
Max  
100  
500  
Unit  
mA  
I
R
Instantaneous Reverse  
Current  
V
R
= 600 V  
T
T
= 25°C  
= 175°  
C
mA  
C
V
Instantaneous Forward  
I = 6 A  
F
T
C
T
C
= 25°C  
= 175°  
1.26  
1.04  
1.5  
V
V
FM  
(Note 3) Voltage  
t
Reverse Recovery Time  
T
= 25°C  
25  
33  
ns  
I = 1 A, di/dt = 200 A/ms, V = 390 V  
rr  
C
F
CC  
(Note 4)  
I = 6 A, di/dt = 200 A/ms, V = 390 V  
T
C
T
C
= 25°C  
= 175°  
63  
119  
83  
ns  
ns  
F
CC  
t
t
Reverse Recovery Time  
I = 6 A, di/dt = 200 A/ms, V = 390 V  
T
C
= 25°C  
23  
40  
151  
ns  
ns  
nC  
a
b
F
CC  
Qrr  
Reverse Recovery Charge  
W
AVL  
Avalanche Energy (L = 20 mH)  
10  
mJ  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. Pulse: Test Pulse width = 300 ms, Duty Cycle = 2%  
4. Guaranteed by design  
TEST CIRCUIT AND WAVEFORMS  
V
AMPLITUDE AND  
GE  
G
R
CONTROL dI /dt  
F
L
t
t CONTROL I  
2 F  
1 AND  
DUT  
CURRENT  
SENSE  
dI  
F
t
rr  
R
I
G
F
dt  
t
t
b
+
a
0
V
V
DD  
GE  
IGBT  
t
1
0.25 I  
RM  
t
2
I
RM  
Figure 1. trr Test Circuit  
Figure 2. trr Waveforms and Definitions  
I = 1 A  
L = 20 Mh  
R < 0.1 W  
AVL  
2
V
E
= 1/2LI [VR(AVL) / (VR(AVL) VDD)]  
AVL  
Q
1
= IGBT (BV  
> DUT V  
)
CES  
R(AVL)  
L
R
+
V
CURRENT  
SENSE  
I
I
L
L
DD  
DD  
I
V
Q
1
V
DUT  
t
t
t
2
t
0
1
Figure 3. Avalanche Energy Test Circuit  
Figure 4. Avalanche Current and Voltage Waveforms  
www.onsemi.com  
2
 
RURD660S9AF085  
TYPICAL PERFORMANCE CHARACTERISTICS  
100  
10  
1
100  
10  
1
T
T
= 175°C  
= 125°C  
C
C
T
C
= 175°C  
T
C
= 125°C  
0.1  
T
C
= 25°C  
T
C
= 25°C  
0.1  
0.01  
0.1  
0.5  
1.0  
1.5  
2.0  
2.5  
100  
500  
100  
200  
300  
400  
500  
600  
500  
175  
V , Forward Voltage (V)  
F
V , Reverse Voltage (V)  
R
Figure 9. Typical Forward Voltage Drop vs.  
Forward Current  
Figure 10. Typical Reverse Current  
vs. Reverse Voltage  
90  
80  
180  
150  
120  
90  
I = 6 A  
Typical Capacitance  
at 10 V = 24 pF  
F
T
= 175°C  
C
60  
40  
T
= 125°C  
C
60  
T
= 25°C  
C
20  
10  
30  
100  
0.1  
1
10  
200  
300  
400  
V , Reverse Voltage (V)  
di/dt (A/ms)  
R
Figure 5. Typical Junction Capacitance  
Figure 6. Typical Reverse Recovery Time vs. di/dt  
15  
10  
5
35  
30  
T
C
= 175°C  
20  
10  
0
T
= 125°C  
C
T
C
= 25°C  
I = 6 A  
F
0
100  
200  
300  
400  
25  
50  
75  
100  
125  
150  
di/dt (A/ms)  
T , Case Temperature (°C)  
C
Figure 7. Typical Reverse Recovery Current vs. di/dt  
Figure 8. Forward Current Derating Curve  
www.onsemi.com  
3
RURD660S9AF085  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
800  
I = 6 A  
F
T
C
= 175°C  
600  
400  
200  
0
T
= 125°C  
= 25°C  
C
T
C
100  
200  
300  
di/dt [A/ms]  
400  
500  
Figure 12. Reverse Recovery Charge  
10  
1
D = 0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
PDM  
t1  
t2  
0.1  
0.01  
single pulse  
*NOTES:  
1. RthJC = 1.7°C/W Typ.  
2. Duty Factor, D = t1 / t2  
3. TJM TC = PDM x ZthJC (t)  
105  
104  
103  
102  
101  
100  
101  
102  
t , Square Wave Pulse Duration (sec)  
1
Figure 11. Transient Thermal Response Curve  
ORDERING INFORMATION  
Device  
Device Marking  
Package  
Shipping  
RURD660S9AF085  
RUR660  
TO252 3 LD  
(PbFree)  
2500 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
DPAK3 (TO252 3 LD)  
CASE 369AS  
ISSUE A  
DATE 28 SEP 2022  
GENERIC  
MARKING DIAGRAM*  
XXXXXX  
XXXXXX  
AYWWZZ  
XXXX = Specific Device Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ  
= Assembly Lot Code  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
98AON13810G  
DPAK3 (TO252 3 LD)  
PAGE 1 OF 1  
DESCRIPTION:  
onsemi and  
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves  
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation  
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
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ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
onsemi Website: www.onsemi.com  
ONLINE SUPPORT: www.onsemi.com/support  
For additional information, please contact your local Sales Representative at  
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