SBRD81035CTLG [ONSEMI]
RECTIFIER DIODE;
| 型号： | SBRD81035CTLG |
| 厂家： | 
ONSEMI |
| 描述： | RECTIFIER DIODE 测试 二极管 |
| 文件： | 总6页 (文件大小：74K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MBRD1035CTL,
NRVBD1035VCTL,
SBRD81035CTL Series
Switch-mode
Schottky Power Rectifier
www.onsemi.com
DPAK Power Surface Mount Package
SCHOTTKY BARRIER
RECTIFIER
The MBRD1035CTL employs the Schottky Barrier principle in a
large area metal−to−silicon power diode. State of the art geometry
features epitaxial construction with oxide passivation and metal
overlay contact. Ideally suited for low voltage, high frequency
switching power supplies, free wheeling diode and polarity protection
diodes.
10 AMPERES
35 VOLTS
Features
• Highly Stable Oxide Passivated Junction
• Guardring for Stress Protection
DPAK
CASE 369C
• Matched Dual Die Construction −
May be Paralleled for High Current Output
• High dv/dt Capability
1
4
• Short Heat Sink Tap Manufactured − Not Sheared
3
• Very Low Forward Voltage Drop
• Epoxy Meets UL 94 V−0 @ 0.125 in
MARKING DIAGRAM
• SBRD8 and NRVBD Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AEC−Q101 Qualified and PPAP Capable
YWW
B10
35CLG
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Y
WW
= Year
= Work Week
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 0.4 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
B1035CL = Device Code
G
= Pb−Free Package
ORDERING INFORMATION
• Lead and Mounting Surface Temperature for Soldering Purposes:
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
260°C Max. for 10 Seconds
• ESD Rating:
♦ Human Body Model = 3B (> 8 kV)
♦ Machine Model = C (> 400 V)
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
October, 2016 − Rev. 11
MBRD1035CTL/D
MBRD1035CTL, NRVBD1035VCTL, SBRD81035CTL Series
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
35
V
RRM
V
RWM
V
R
Average Rectified Forward Current
I
O
A
(At Rated V , T = 115°C)
R
C
Per Leg
5.0
10
Per Package
Peak Repetitive Forward Current
I
A
A
FRM
(At Rated V , Square Wave, 20 kHz, T = 115°C)
R
C
Per Leg
10
Non−Repetitive Peak Surge Current
I
FSM
(Surge applied at rated load conditions, halfwave, single phase, 60 Hz)
Per Package
50
Storage / Operating Case Temperature
Operating Junction Temperature (Note 1)
Voltage Rate of Change (Rated V , T = 25°C)
T
T
−55 to +150
−55 to +150
10,000
°C
°C
stg,
c
T
J
dv/dt
V/ms
R
J
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dP /dT < 1/R .
q
JA
D
J
THERMAL CHARACTERISTICS
Rating
Symbol
Value
3.0
Unit
Thermal Resistance, Junction−to−Case
Per Leg
R
°C/W
q
JC
Thermal Resistance, Junction−to−Ambient (Note 2)
Per Leg
R
°C/W
q
JA
137
2. Rating applies when using minimum pad size, FR4 PC Board
ELECTRICAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Maximum Instantaneous Forward Voltage (Note 3) (See Figure 2)
V
F
V
Per Leg
(I = 5 Amps, T = 25°C)
0.47
0.41
0.56
0.55
F
J
(I = 5 Amps, T = 100°C)
F
J
(I = 10 Amps, T = 25°C)
F
J
(I = 10 Amps, T = 100°C)
F
J
Maximum Instantaneous Reverse Current (Note 3) (See Figure 4)
I
R
mA
Per Leg
(V = 35 V, T = 25°C)
2.0
30
0.20
5.0
R
J
(V = 35 V, T = 100°C)
R
J
(V = 17.5 V, T = 25°C)
R
J
(V = 17.5 V, T = 100°C)
R
J
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%
www.onsemi.com
2
MBRD1035CTL, NRVBD1035VCTL, SBRD81035CTL Series
ORDERING INFORMATION
†
Device
MBRD1035CTLG
Package
Shipping
75 Units / Rail
SBRD81035CTLG*
MBRD1035CTLT4G
NRVBD1035VCTLT4G*
SBRD81035CTLT4G*
75 Units / Rail
DPAK
(Pb−Free)
2,500 Units / Tape & Reel
2,500 Units / Tape & Reel
2,500 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*SBRD8 and NRVBD Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable.
TYPICAL CHARACTERISTICS
100
10
100
10
T = 125°C
J
T = 125°C
J
T = 100°C
J
T = 25°C
J
T = 25°C
T = - 40°C
J
J
1.0
0.1
1.0
0.1
T = 100°C
J
0.10
0.30
0.50
0.70
0.90
1.10
0.10
0.30
0.50
0.70
0.90
1.10
V , INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
F
V , MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
F
Figure 1. Typical Forward Voltage Per Leg
Figure 2. Maximum Forward Voltage Per Leg
1E+0
1E+0
100E-3
100E-3
T = 125°C
J
T = 125°C
J
10E-3
1E-3
10E-3
1E-3
T = 100°C
J
T = 100°C
J
T = 25°C
J
100E-6
10E-6
1E-6
100E-6
10E-6
1E-6
T = 25°C
J
0
10
20
30
35
0
10
20
30
35
V , REVERSE VOLTAGE (VOLTS)
R
V , REVERSE VOLTAGE (VOLTS)
R
Figure 3. Typical Reverse Current Per Leg
Figure 4. Maximum Reverse Current Per Leg
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3
MBRD1035CTL, NRVBD1035VCTL, SBRD81035CTL Series
8.0
7.0
6.0
5.0
4.0
3.0
2.0
4.0
dc
SQUARE WAVE
(50% DUTY CYCLE)
3.5
3.0
2.5
SQUARE WAVE
(50% DUTY CYCLE)
dc
I /I = p
o
pk
I /I = p
pk o
I /I = 5
o
pk
2.0
1.5
1.0
I /I = 10
o
pk
I /I = 5
pk o
I /I = 20
o
pk
I /I = 10
pk o
I /I = 20
pk o
1.0
0
0.5
0
freq = 20 kHz
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
0
20
40
60
80
100
120
140
I , AVERAGE FORWARD CURRENT (AMPS)
O
T , LEAD TEMPERATURE (°C)
L
Figure 5. Current Derating Per Leg
Figure 6. Forward Power Dissipation Per Leg
125
115
105
1000
100
10
R
= 2.43°C/W
T = 25°C
q
JA
J
R
= 25°C/W
q
JA
R
= 48°C/W
q
JA
95
85
75
65
R
= 67.5°C/W
q
JA
R
= 84°C/W
q
JA
0
5
10
15
20
25
30
35
0
5
10
15
20
25
V , DC REVERSE VOLTAGE (VOLTS)
R
V , REVERSE VOLTAGE (VOLTS)
R
Figure 7. Capacitance Per Leg
Figure 8. Typical Operating Temperature
Derating Per Leg *
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-
verse voltage conditions. Calculations of T therefore must include forward and reverse power effects. The allowable operating
J
T may be calculated from the equation:
J
T = T
− r(t)(Pf + Pr) where
J
Jmax
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable T due to reverse bias under DC conditions only and is calculated as T = T
− r(t)Pr,
J
J
Jmax
where r(t) = Rthja. For other power applications further calculations must be performed.
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4
MBRD1035CTL, NRVBD1035VCTL, SBRD81035CTL Series
1.0
50%(DUTY CYCLE)
20%
10%
5.0%
0.1
2.0%
1.0%
SINGLE PULSE
R
= R • r
tjl (t)
tjl(t)
0.01
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 9. Thermal Response Junction to Case (Per Leg)
1.0E+00
1.0E-01
1.0E-02
50% (DUTY CYCLE)
20%
10%
5.0%
2.0%
1.0%
1.0E-03
1.0E-04
SINGLE PULSE
R
= R • r
tjl (t)
tjl(t)
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
10000
Figure 10. Thermal Response Junction to Ambient (Per Leg)
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5
MBRD1035CTL, NRVBD1035VCTL, SBRD81035CTL Series
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
A
D
E
C
A
b3
B
c2
4
2
L3
L4
Z
DETAIL A
H
1
3
7. OPTIONAL MOLD FEATURE.
INCHES
DIM MIN MAX
0.086 0.094
A1 0.000 0.005
0.025 0.035
MILLIMETERS
NOTE 7
MIN
2.18
0.00
0.63
0.72
4.57
0.46
0.46
5.97
6.35
MAX
2.38
0.13
0.89
1.14
5.46
0.61
0.61
6.22
6.73
c
b2
e
BOTTOM VIEW
A
SIDE VIEW
b
b
b2 0.028 0.045
b3 0.180 0.215
M
0.005 (0.13)
C
TOP VIEW
c
0.018 0.024
c2 0.018 0.024
Z
Z
D
E
e
0.235 0.245
0.250 0.265
0.090 BSC
H
2.29 BSC
9.40 10.41
1.40 1.78
2.90 REF
0.51 BSC
0.89 1.27
GAUGE
PLANE
SEATING
PLANE
H
L
L1
L2
0.370 0.410
0.055 0.070
0.114 REF
L2
C
0.020 BSC
L3 0.035 0.050
L
BOTTOM VIEW
A1
L4
Z
−−− 0.040
0.155 −−−
−−−
3.93
1.01
−−−
L1
ALTERNATE
CONSTRUCTIONS
DETAIL A
ROTATED 905 CW
SOLDERING FOOTPRINT*
6.20
0.244
3.00
0.118
2.58
0.102
5.80
0.228
1.60
0.063
6.17
0.243
mm
inches
ǒ
Ǔ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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◊
MBRD1035CTL/D
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