SD05T3G [ONSEMI]
ESD 保护二极管，单向，SOD-323;
| 型号： | SD05T3G |
| 厂家： | 
ONSEMI |
| 描述： | ESD 保护二极管，单向，SOD-323 局域网 光电二极管 瞬态抑制器 |
| 文件： | 总4页 (文件大小：92K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SD05T1 Series
Preferred Device
Transient Voltage
Suppressor Diode
SOD−323 Zeners for ESD Protection
These Zener diodes are designed for applications requiring transient
overvoltage protection capability. They are intended for use in voltage
and ESD sensitive equipment such as computers, printers, business
machines, communication systems, medical equipment and other
applications. These devices are ideal for situations where board space is
at a premium.
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Specification Features:
• Steady State Power Routing of 200 mW
• Peak Power − 350 W (8 20 ms)
• Low Leakage
• Cathode Indicated by Polarity Band
• Package Weight: 4.507 mg/wmt
• Meets IEC61000−4−2 Level 4, 15 kV (Air), 8 kV (Contact)
• Meets IEC6100−4−4 Level 4, 40 A
• Meets IEC6100−4−5 (Lightning), 24 A
• Meets 16 kV Human Body Model ESD Requirements
• Pb−Free Packages are Available
SOD−323
CASE 477
STYLE 1
MARKING DIAGRAM
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V−0
xx M
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
xx = Specific Device Code
ZA = SD05T1
ZC = SD12T1
M = Date Code
Use the Device Number to order the 7 inch/3,000 unit reel.
Replace the “T1” with “T3” in the Device Number to order the
13 inch/10,000 unit reel.
ORDERING INFORMATION
†
Device
Package
Shipping
SD05T1
SOD−323
3000/Tape & Reel
3000/Tape & Reel
SD05T1G
SOD−323
(Pb−Free)
SD12T1
SOD−323
3000/Tape & Reel
3000/Tape & Reel
SD12T1G
SOD−323
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
January, 2005 − Rev. 1
SD05T1/D
SD05T1 Series
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Power Dissipation @ 20 ms (Note 1)
P
350
Watts
pk
@ T ≤ 25°C
L
IEC 61000−4−2 (ESD)
Air
Contact
15
8.0
kV
IEC 61000−4−4 (EFT)
40
30
A
ESD Voltage (Human Body Model (HBM) Waveform per IEC 61000−4−2)
V
kV
PP
Total Power Dissipation on FR−5 Board (Note 2) @ T = 25°C
°P °
D
200
1.6
°mW°
mW/°C
A
Derate above 25°C
Thermal Resistance Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum (10 Second Duration)
R
635
−55 to +150
260
°C/W
°C
q
JA
T , T
J
stg
T
°C
L
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
*Other voltages may be available upon request.
1. Nonrepetitive current pulse, per Figure 6.
2. FR−5 = 1.0 x 0.75 x 0.62 in.
ELECTRICAL CHARACTERISTICS
A
I
(T = 25°C unless otherwise noted)
I
F
Symbol
Parameter
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
I
PP
V
C
PP
V
V
V
BR RWM
V
I
Working Peak Reverse Voltage
C
RWM
V
I
V
R
T
F
Maximum Reverse Leakage Current @ V
I
R
RWM
V
Breakdown Voltage @ I
Test Current
BR
T
I
I
T
Forward Current
I
F
PP
V
Forward Voltage @ I
F
F
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS
V
Max
Capacitance
(pF)
, Breakdown Voltage
(V)
BR
V
@ I = 5 A
(Note 3)
(V)
Max I
(Note 3)
(A)
V
@ Max I
(Note 3)
(V)
C
PP
PP
C
PP
V
= 0 V
V
I
@ V
I
T
R
RWM
R
RWM
f = 1.0 MHz
(V)
(mA)
Min
Max
7.3
mA
1.0
1.0
Device
SD05T1, G
SD12T1, G
5.0
12
10
6.2
9.8
19
24
15
14.5
25
350
1.0
13.3
15.75
150
3. 8 × 20 ms pulse waveform.
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2
SD05T1 Series
TYPICAL CHARACTERISTICS
280
260
240
220
200
180
140
120
100
80
60
40
160
140
120
100
20
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
2
4
6
8
10
12
BIAS (V)
BIAS (V)
Figure 1. SD05 Typical Capacitance versus Bias
Voltage
Figure 2. SD12 Typical Capacitance versus
Bias Voltage
1000
100
10
100
10
1
0.1
−55 −30
−55 −35 −15
5
25 45 65 85 105 125 145
−5
20
45
70
95
120 145
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 3. SD05 Typical Leakage Current
versus Temperature
Figure 4. SD12 Typical Leakage Current
versus Temperature
100
100
90
80
70
60
50
40
30
20
t
r
PEAK VALUE I
@ 8 ms
RSM
90
80
70
60
50
40
30
20
10
0
PULSE WIDTH (t ) IS DEFINED
P
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
HALF VALUE I /2 @ 20 ms
RSM
t
P
10
0
0
25
50
75
100
125
150 175 200
0
20
40
t, TIME (ms)
60
80
T , AMBIENT TEMPERATURE (°C)
A
Figure 5. Pulse Derating Curve
Figure 6. 8 × 20 ms Pulse Waveform
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3
SD05T1 Series
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F
DRAWING WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS.
K
A
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
1
B
D
2
MILLIMETERS
INCHES
DIM
A
B
C
D
MIN
1.60
1.15
0.80
0.25
MAX
1.80
1.35
1.00
0.40
MIN
MAX
0.063
0.045
0.031
0.010
0.071
0.053
0.039
0.016
E
C
E
H
J
K
0.15 REF
0.006 REF
0.00
0.089
2.30
0.10
0.177
2.70
0.000
0.004
0.0035 0.0070
0.091
0.106
L
0.075
−−−
0.003
−−−
L
H
J
STYLE 1:
PIN 1. CATHODE
2. ANODE
NOTE 5
NOTE 3
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
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Order Literature: http://www.onsemi.com/litorder
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
SD05T1/D
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