SM05T3 [ONSEMI]
300W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, TO-236AB, PLASTIC, CASE 318-08, TO-236, 3 PIN;
| 型号： | SM05T3 |
| 厂家： | 
ONSEMI |
| 描述： | 300W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, TO-236AB, PLASTIC, CASE 318-08, TO-236, 3 PIN 光电二极管 电视 |
| 文件： | 总5页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SM05T1 Series
Transient Voltage
Suppressor Diode Array
SOT−23 Dual Common Anode Diodes
for ESD Protection
http://onsemi.com
These dual monolithic silicon TVS diodes are designed for
applications requiring transient overvoltage protection capability. They
are intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment and other applications. Their dual junction common
anode design protects two separate lines using only one package. These
devices are ideal for situations where board space is at a premium.
1
2
PIN 1. CATHODE
2. CATHODE
3. ANODE
3
3
SOT−23
CASE 318
STYLE 12
Specification Features:
1
2
• SOT−23 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
• Working Peak Reverse Voltage Range − 5.0 V to 24 V
• Peak Power − 300 Watt (8 X 20 ms)
MARKING DIAGRAM
• Low Leakage
xxM MG
• Flammability Rating UL 94 V−0
G
• These are Pb−Free Devices
1
Mechanical Characteristics:
xxM = Device Code
xx = 05, 12, 15, 24, 36
CASE: Void-Free, Transfer-Molded, Thermosetting Plastic Case
FINISH: Corrosion Resistant Finish, Easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
Available in 8 mm Tape and Reel
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Use the Device Number to Order the 7 Inch/3,000 Unit Reel
Replace the “T1” with “T3” in the Device Number to Order the
13 Inch/10,000 Unit Reel
ORDERING INFORMATION
†
Device
Package
Shipping
SM05T1G
SOT−23
3000/Tape & Reel
(Pb−Free)
SM12T1G
SM15T1G
SOT−23
(Pb−Free)
3000/Tape & Reel
3000/Tape & Reel
SOT−23
(Pb−Free)
SM24T1G
SM36T1G
SOT−23
(Pb−Free)
3000/Tape & Reel
3000/Tape & Reel
SOT−23
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
July, 2011 − Rev. 4
SM05T1/D
SM05T1 Series
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 20 ms (Note 1) @ T ≤ 25°C
Symbol
Value
Unit
W
P
pk
300
L
IEC 61000−4−2 (ESD)
Air
Contact
15
8.0
kV
IEC 61000−4−4 (EFT)
40
12
A
A
IEC 61000−4−5 (Lightening)
Total Power Dissipation on FR−5 Board (Note 2) @ T = 25°C
°P °
225
1.8
556
°mW°
mW/°C
°C/W
A
D
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
R
q
JA
Total Power Dissipation on Alumina Substrate (Note 3) @ T = 25°C
°P
300
2.4
417
°mW
mW/°C
°C/W
A
D
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
R
q
JA
Junction and Storage Temperature Range
T , T
− 55 to +150
°C
°C
J
stg
Lead Solder Temperature − Maximum (10 Second Duration)
T
L
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Non−repetitive current pulse per Figure 3
2. FR−5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
NOTE: Other voltages may be available upon request
ELECTRICAL CHARACTERISTICS
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)
Symbol
Parameter
I
I
PP
Maximum Reverse Peak Pulse Current
I
F
V
C
Clamping Voltage @ I
PP
V
RWM
Working Peak Reverse Voltage
I
R
Maximum Reverse Leakage Current @ V
RWM
V
Breakdown Voltage @ I
BR
T
V
C
V
V
BR RWM
V
I
Test Current
T
I
V
F
R
T
I
QV
Maximum Temperature Coefficient of V
Forward Current
BR
BR
I
F
V
F
Forward Voltage @ I
F
I
PP
Z
Maximum Zener Impedance @ I
Reverse Current
ZT
ZT
I
ZK
Uni−Directional TVS
Z
ZK
Maximum Zener Impedance @ I
ZK
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Typical
Capacitance
V
I
@
=
C
V
BR
, Breakdown Voltage
(Volts)
Max I
PP
PP
I
T
(Note 4)
(pF)
1 Amp
V
RWM
I @ V
R RWM
Pin 1 to 3
@ 0 Volts
Device
Marking
mA
1.0
1.0
1.0
1.0
1.0
(Volts)
5
(mA)
Min
Max
7.3
(Volts)
9.8
19
(Amps)
17
Device
SM05T1G
05M
12M
15M
24M
36M
10
6.2
225
95
SM12T1G
SM15T1G
SM24T1G
SM36T1G
12
1.0
1.0
1.0
1.0
13.3
16.7
26.7
40.0
15.75
19.6
12
15
24
10
100
60
24
31.35
46.95
43
5.0
36
60
4.0
45
4. 8 × 20 ms pulse waveform per Figure 3
http://onsemi.com
2
SM05T1 Series
TYPICAL CHARACTERISTICS
10
1
300
250
200
150
100
ALUMINA SUBSTRATE
0.1
FR−5 BOARD
50
0
0.01
0.1
1
10
100
1000
0
25
50
75
100
125
150
175
t , PULSE DURATION (ms)
p
TEMPERATURE (°C)
Figure 1. Non−Repetitive Peak Pulse Power
Figure 2. Steady State Power Derating Curve
versus Pulse Time
100
90
80
70
60
50
40
30
20
250
210
170
PEAK VALUE I
@ 8 ms
RSM
t
r
PULSE WIDTH (t ) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
P
HALF VALUE I
/2 @ 20 ms
RSM
t
P
130
90
10
0
0
1
2
3
4
5
0
20
40
60
80
BIAS VOLTAGE (VOLTS)
t, TIME (ms)
Figure 3. 8 × 20 ms Pulse Waveform
Figure 4. Typical Diode Capacitance (SM05)
100
90
80
70
60
50
40
30
20
10
0
0
1
5
8
12
BIAS VOLTAGE (VOLTS)
Figure 5. Typical Diode Capacitance (SM12)
http://onsemi.com
3
SM05T1 Series
TYPICAL COMMON ANODE APPLICATIONS
A quad junction common anode design in a SOT−23
package protects four separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. Two simplified examples
of TVS applications are illustrated below.
Computer Interface Protection
A
B
C
D
KEYBOARD
FUNCTIONAL
DECODER
TERMINAL
I/O
PRINTER
ETC.
GND
SM05T1
Series
Microprocessor Protection
V
V
DD
GG
ADDRESS BUS
RAM
ROM
DATA BUS
CPU
SM05T1
Series
I/O
CLOCK
CONTROL BUS
GND
SM05T1
Series
http://onsemi.com
4
SM05T1 Series
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
SEE VIEW C
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
3
H
E
E
c
1
2
MILLIMETERS
INCHES
DIM
A
A1
b
c
D
E
e
L
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
MIN
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
b
0.25
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
e
q
A
L
L1
A1
L1
VIEW C
H
E
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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SM05T1/D
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