SMMBFJ177LT1G [ONSEMI]

P 沟道 JFET 晶体管;


型号：	SMMBFJ177LT1G
厂家：	ONSEMI
描述：	P 沟道 JFET 晶体管小信号场效应晶体管
文件：	总3页 (文件大小：45K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MMBFJ177LT1

JFET Chopper

P−Channel − Depletion

Features

• Pb−Free Package is Available

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2 SOURCE

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Vdc

GATE

Drain−Gate Voltage

Reverse Gate−Source Voltage

GS(r)

−25

1 DRAIN

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

SOT−23 (TO−236AB)

CASE 318−08

STYLE 10

THERMAL CHARACTERISTICS

Total Device Dissipation FR−5 Board

(Note 1)

225

1.8

T = 25°C

mW/°C

MARKING DIAGRAM

Derate above 25°C

Thermal Resistance,

Junction−to−Ambient

556

°C/W

°C

6Y MG

Junction and Storage Temperature

T , T

−55 to +150

stg

1. FR−5 = 1.0 ꢀ 0.75 ꢀ 0.062 in.

6Y = Specific Device Code

= Date Code

= Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

†

Device

Package

Shipping

MMBFJ177LT1

MMBFJ177LT1G

SOT−23

3000 Tape & Reel

SOT−23

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Publication Order Number:

November, 2005 − Rev. 3

MMBFJ177LT1/D

MMBFJ177LT1

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)

Characteristic

Symbol

Min

Max

Unit

OFF CHARACTERISTICS

Gate−Source Breakdown Voltage (V = 0, I = 1.0 mAdc)

(BR)GSS

−

Vdc

nAdc

Vdc

Gate Reverse Current (V = 0 Vdc, V = 20 Vdc)

GSS

1.0

2.5

Gate Source Cutoff Voltage (V = 15 Vdc, I = 10 nAdc)

GS(off)

0.8

ON CHARACTERISTICS

Zero−Gate−Voltage Drain Current (V = 0, V = 15 Vdc) (Note 2)

DSS

1.5

−

1.0

300

mAdc

nAdc

Drain Cutoff Current (V = 15 Vdc, V = 10 Vdc)

D(off)

Drain Source On Resistance (I = 500 mAdc)

−

DS(on)

Input Capacitance

−

iss

rss

= 0, V = 10 Vdc

f = 1.0 MHz

Reverse Transfer Capacitance

−

5.5

2. Pulse Test: Pulse Width < 300 ms, Duty Cycle ≤ 2%.

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MMBFJ177LT1

PACKAGE DIMENSIONS

SOT−23 (TO−236AB)

CASE 318−08

ISSUE AN

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

SEE VIEW C

4. 318−01 THRU −07 AND −09 OBSOLETE, NEW

STANDARD 318−08.

MILLIMETERS

INCHES

DIM

MIN

0.89

0.01

0.37

0.09

2.80

1.20

1.78

0.10

0.35

2.10

NOM

1.00

0.06

0.44

0.13

2.90

1.30

1.90

0.20

0.54

2.40

MAX

MIN

NOM

0.040

0.002

0.018

0.005

0.114

0.051

0.075

0.008

0.021

0.094

MAX

0.044

0.004

0.020

0.007

0.120

0.055

0.081

0.012

0.029

0.104

1.11

0.10

0.50

0.18

3.04

1.40

2.04

0.30

0.69

2.64

0.035

0.001

0.015

0.003

0.110

0.047

0.070

0.004

0.014

0.083

0.25

VIEW C

STYLE 10:

PIN 1. DRAIN

2. SOURCE

3. GATE

SOLDERING FOOTPRINT*

0.95

0.037

0.95

0.037

2.0

0.079

0.9

0.035

0.8

0.031

inches

SCALE 10:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

ON Semiconductor Website: http://onsemi.com

Order Literature: http://www.onsemi.com/litorder

Literature Distribution Center for ON Semiconductor

P.O. Box 61312, Phoenix, Arizona 85082−1312 USA

Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada

Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

Japan: ON Semiconductor, Japan Customer Focus Center

2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

Phone: 81−3−5773−3850

For additional information, please contact your

local Sales Representative.

MMBFJ177LT1/D

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