SMMBT918LT1 [ONSEMI]

UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR, TO-236AF, CASE 318-08, 3 PIN;
SMMBT918LT1
型号: SMMBT918LT1
厂家: ONSEMI    ONSEMI
描述:

UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR, TO-236AF, CASE 318-08, 3 PIN

放大器 光电二极管 晶体管
文件: 总3页 (文件大小:48K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MMBT918LT1  
VHF/UHF Transistor  
NPN Silicon  
Features  
Pb−Free Package is Available  
http://onsemi.com  
COLLECTOR  
3
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
1
BASE  
CollectorEmitter Voltage  
V
CEO  
V
CBO  
V
EBO  
15  
Vdc  
CollectorBase Voltage  
30  
3.0  
50  
Vdc  
Vdc  
2
EMITTER  
EmitterBase Voltage  
Collector Current − Continuous  
THERMAL CHARACTERISTICS  
I
mAdc  
C
3
Characteristic  
Symbol  
Max  
Unit  
1
Total Device Dissipation FR5 Board,  
P
D
(Note 1) T = 25°C  
225  
1.8  
mW  
mW/°C  
A
2
Derate above 25°C  
Thermal Resistance, Junction−to−Ambient  
R
q
JA  
556  
°C/W  
SOT−23 (TO−236)  
CASE 318  
Total Device Dissipation Alumina  
P
D
Substrate, (Note 2) T = 25°C  
300  
2.4  
mW  
mW/°C  
A
STYLE 6  
Derate above 25°C  
Thermal Resistance, Junction−to−Ambient  
Junction and Storage Temperature  
R
417  
°C/W  
°C  
q
JA  
MARKING DIAGRAM  
T , T  
J
−55 to +150  
stg  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. FR−5 = 1.0 x 0.75 x 0.062 in.  
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.  
M3B M G  
G
1
M3B = Device Code  
M
= Date Code*  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MMBT918LT1  
MMBT918LT1G  
SOT−23  
3000 / Tape & Reel  
3000 / Tape & Reel  
SOT−23  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2006 − Rev. 5  
MMBT918LT1/D  
 
MMBT918LT1  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
OFF CHARACTERISTICS  
Symbol  
Min  
Max  
Unit  
CollectorEmitter Breakdown Voltage  
V
Vdc  
Vdc  
(BR)CEO  
(BR)CBO  
(BR)EBO  
(I = 3.0 mAdc, I = 0)  
15  
30  
3.0  
C
B
CollectorBase Breakdown Voltage  
(I = 1.0 mAdc, I = 0)  
V
V
C
E
EmitterBase Breakdown Voltage  
(I = 10 mAdc, I = 0)  
Vdc  
E
C
Collector Cutoff Current  
(V = 15 Vdc, I = 0)  
I
nAdc  
CBO  
50  
CB  
E
ON CHARACTERISTICS  
DC Current Gain  
h
FE  
(I = 3.0 mAdc, V = 1.0 Vdc)  
C
20  
CE  
CollectorEmitter Saturation Voltage  
(I = 10 mAdc, I = 1.0 mAdc)  
V
Vdc  
Vdc  
CE(sat)  
0.4  
1.0  
C
B
BaseEmitter Saturation Voltage  
(I = 10 mAdc, I = 1.0 mAdc)  
V
BE(sat)  
C
B
SMALLSIGNAL CHARACTERISTICS  
CurrentGain − Bandwidth Product  
f
MHz  
pF  
T
(I = 4.0 mAdc, V = 10 Vdc, f = 100 MHz)  
600  
C
CE  
Output Capacitance  
C
obo  
(V = 0 Vdc, I = 0, f = 1.0 MHz)  
3.0  
1.7  
CB  
E
(V = 10 Vdc, I = 0, f = 1.0 MHz)  
CB  
E
Input Capacitance  
C
pF  
dB  
ibo  
(V = 0.5 Vdc, I = 0, f = 1.0 MHz)  
EB  
2.0  
6.0  
C
Noise Figure  
NF  
(I = 1.0 mAdc, V = 6.0 Vdc, R = 50 W, f = 60 MHz) (Figure 1)  
C
CE  
S
Power Output  
P
mW  
dB  
out  
(I = 8.0 mAdc, V = 15 Vdc, f = 500 MHz)  
C
30  
11  
CB  
Common−Emitter Amplifier Power Gain  
(I = 6.0 mAdc, V = 12 Vdc, f = 200 MHz)  
G
pe  
C
CB  
V
BB  
V
CC  
EXTERNAL  
100 k  
1000 pF BYPASS  
0.018 mF  
0.018 mF  
50 W  
RF  
VM  
3
C
G
G
0.018 mF  
0.018 mF  
NF TEST CONDITIONS  
TEST CONDITIONS  
pe  
ꢀI = 1.0 mA  
C
ꢀV = 6.0 VOLTS  
ꢀI = 6.0 mA  
C
ꢀV = 12 VOLTS  
CE  
CE  
ꢀR = 50 W  
S
ꢀf = 60 MHz  
ꢀf = 200 MHz  
Figure 1. NF, Gpe Measurement Circuit 20−200  
http://onsemi.com  
2
 
MMBT918LT1  
PACKAGE DIMENSIONS  
SOT−23 (TO−236)  
CASE 318−08  
ISSUE AN  
NOTES:  
D
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
SEE VIEW C  
2. CONTROLLING DIMENSION: INCH.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH THICKNESS. MINIMUM LEAD  
THICKNESS IS THE MINIMUM THICKNESS OF  
BASE MATERIAL.  
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW  
STANDARD 318−08.  
3
H
E
E
c
1
2
MILLIMETERS  
INCHES  
b
DIM  
A
A1  
b
c
D
E
e
L
L1  
MIN  
0.89  
0.01  
0.37  
0.09  
2.80  
1.20  
1.78  
0.10  
0.35  
NOM  
1.00  
0.06  
0.44  
0.13  
2.90  
1.30  
1.90  
0.20  
0.54  
MAX  
1.11  
0.10  
0.50  
0.18  
3.04  
1.40  
2.04  
0.30  
0.69  
MIN  
NOM  
0.040  
0.002  
0.018  
0.005  
0.114  
0.051  
0.075  
0.008  
0.021  
MAX  
0.044  
0.004  
0.020  
0.007  
0.120  
0.055  
0.081  
0.012  
0.029  
0.25  
0.035  
0.001  
0.015  
0.003  
0.110  
0.047  
0.070  
0.004  
0.014  
e
q
A
L
A1  
L1  
VIEW C  
H
E
2.10  
2.40  
2.64  
0.083  
0.094  
0.104  
STYLE 6:  
PIN 1. BASE  
2. EMITTER  
3. COLLECTOR  
SOLDERING FOOTPRINT*  
0.95  
0.037  
0.95  
0.037  
2.0  
0.079  
0.9  
0.035  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
0.8  
0.031  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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USA/Canada  
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Order Literature: http://www.onsemi.com/litorder  
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
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2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MMBT918LT1/D  

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