SMS15C [ONSEMI]

5-Line Transient Voltage Suppressor Array; 5 ,线路瞬态电压抑制器阵列
SMS15C
型号: SMS15C
厂家: ONSEMI    ONSEMI
描述:

5-Line Transient Voltage Suppressor Array
5 ,线路瞬态电压抑制器阵列

二极管 光电二极管 局域网
文件: 总6页 (文件大小:113K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SMS05C, SMS12C, SMS15C,  
SMS24C  
5−Line Transient Voltage  
Suppressor Array  
This 5−line voltage transient suppressor array is designed for  
application requiring transient voltage protection capability. It is  
intended for use in over−transient voltage and ESD sensitive  
equipment such as computers, printers, automotive electronics,  
networking communication and other applications. This device  
features a monolithic common anode design which protects five  
independent lines in a single SC−74 package.  
http://onsemi.com  
SC−74 FIVE TRANSIENT  
VOLTAGE SUPPRESSOR  
350 W PEAK POWER  
PIN ASSIGNMENT  
Features  
Protects up to 5 Lines in a Single SC−74 Package  
Peak Power Dissipation − 350 W (8   20 ms Waveform)  
ESD Rating of Class 3B (Exceeding 8.0 kV) per Human Body Model  
and Class C (Exceeding 400 V) per Machine Model  
Compliance with IEC 61000−4−2 (ESD) 15 kV (Air), 8.0 kV  
(Contact)  
1
2
3
6
5
4
6
1
SC−74  
CASE 318F  
STYLE 6  
PIN 1. CATHODE  
2. ANODE  
Flammability Rating of UL 94 V−0  
Pb−Free Package is Available  
3. CATHODE  
4. CATHODE  
5. CATHODE  
6. CATHODE  
Applications  
Hand−Held Portable Applications  
Networking and Telecom  
Automotive Electronics  
Serial and Parallel Ports  
Notebooks, Desktops, Servers  
MARKING DIAGRAM  
M
6x  
MAXIMUM RATINGS (T = 25°C unless otherwise specified)  
J
x
= SMS05C:J  
= SMS12C:K  
= SMS15C:L  
= SMS24C:M  
= Date Code  
Symbol  
Rating  
Value  
Unit  
P
PK  
1
Peak Power Dissipation  
350  
W
M
8   20 ms Double Exponential Waveform  
(Note 1)  
TJ  
Operating Junction Temperature Range  
Storage Temperature Range  
−40 to 125  
−55 to 150  
260  
°C  
°C  
°C  
V
ORDERING INFORMATION  
T
STG  
Device  
Package  
Shipping  
T
L
Lead Solder Temperature (10 s)  
SMS05CT1  
SMS12CT1  
SC−74  
SC−74  
3000/Tape & Reel  
3000/Tape & Reel  
ESD  
Human Body Model ( HBM)  
Machine Model (MM)  
IEC 61000−4−2 Air (ESD)  
IEC 61000−4−2 Contact (ESD)  
>8000  
>400  
>15000  
>8000  
SMS15CT1  
SC−74  
3000/Tape & Reel  
3000/Tape & Reel  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
SMS15CT1G  
SC−74  
(Pb−Free)  
SMS24CT1  
SC−74  
3000/Tape & Reel  
1. Non−repetitive current pulse per Figure 3.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
February, 2005 − Rev. 5  
SMS05C/D  
 
SMS05C, SMS12C, SMS15C, SMS24C  
SMS05C ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Reverse Working Voltage  
Breakdown Voltage  
Symbol  
Conditions  
Min  
Typ  
Max  
5.0  
7.2  
5.0  
9.8  
14.5  
24  
Unit  
V
V
RWM  
(Note 2)  
I = 1.0 mA (Note 3)  
V
BR  
6.2  
V
T
Reverse Leakage Current  
Clamping Voltage  
I
R
V
RWM  
= 5.0 V  
mA  
V
V
I
PP  
I
PP  
= 5.0 A (8   20 ms Waveform)  
= 24 A (8   20 ms Waveform)  
C
C
Clamping Voltage  
V
V
Maximum Peak Pulse Current  
Capacitance  
I
PP  
8   20 ms Waveform  
= 0 V, f = 1.0 MHz (Line to GND)  
A
C
V
R
260  
Typ  
400  
pF  
J
SMS12C ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Reverse Working Voltage  
Breakdown Voltage  
Symbol  
Conditions  
Min  
Max  
12  
Unit  
V
V
RWM  
(Note 2)  
I = 1.0 mA (Note 3)  
V
BR  
13.3  
15  
V
T
Reverse Leakage Current  
Clamping Voltage  
I
V
= 12 V  
0.001  
1.0  
19  
mA  
V
R
RWM  
V
I
PP  
I
PP  
= 5.0 A (8   20 ms Waveform)  
= 15 A (8   20 ms Waveform)  
C
Clamping Voltage  
V
23  
V
C
Maximum Peak Pulse Current  
Capacitance  
I
8   20 ms Waveform  
= 0 V, f = 1.0 MHz (Line to GND)  
15  
A
PP  
C
V
R
120  
Typ  
0.05  
150  
pF  
J
SMS15C ELECTRICAL CHARACTERISTICS (T = 25°C, unless otherwise specified) (See Note 4)  
J
Parameter  
Reverse Working Voltage  
Breakdown Voltage  
Symbol  
Conditions  
Min  
Max  
15  
Unit  
V
V
RWM  
(Note 2)  
I = 1.0 mA (Note 3)  
V
17  
19  
V
BR  
T
Reverse Leakage Current  
Clamping Voltage  
I
V
RWM  
= 15 V  
1.0  
24  
mA  
V
R
V
I
PP  
I
PP  
= 5.0 A (8   20 ms Waveform)  
= 12 A (8   20 ms Waveform)  
C
C
Clamping Voltage  
V
29  
V
Maximum Peak Pulse Current  
Capacitance  
I
8   20 ms Waveform  
= 0 V, f = 1.0 MHz (Line to GND)  
12  
A
PP  
C
V
R
95  
125  
pF  
J
SMS24C ELECTRICAL CHARACTERISTICS (T = 25°C, unless otherwise specified)  
J
Parameter  
Reverse Working Voltage  
Breakdown Voltage  
Symbol  
Conditions  
Min  
Typ  
Max  
24  
Unit  
V
V
RWM  
(Note 2)  
I = 1.0 mA (Note 3)  
V
BR  
26.7  
32  
V
T
Reverse Leakage Current  
Clamping Voltage  
I
V
= 24 V  
0.001  
1.0  
40  
mA  
V
R
RWM  
V
I
= 5.0 A (8   20 ms Waveform)  
= 8 A (8   20 ms Waveform)  
C
C
PP  
PP  
Clamping Voltage  
V
I
44  
V
Maximum Peak Pulse Current  
Capacitance  
I
8   20 ms Waveform  
= 0 V, f = 1.0 MHz (Line to GND)  
8.0  
75  
A
PP  
C
V
R
60  
pF  
J
2. TVS devices are normally selected according to the working peak reverse voltage (V  
or continuous peak operating voltage level.  
), which should be equal or greater than the DC  
RWM  
3. V is measured at pulse test current I .  
BR  
T
4. Parametrics are the same for the Pb−Free packages, which are suffixed with a “G’’.  
http://onsemi.com  
2
 
SMS05C, SMS12C, SMS15C, SMS24C  
TYPICAL PERFORMANCE CURVES (T = 25°C unless otherwise specified)  
J
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
t
r
PEAK VALUE I  
@ 8 ms  
RSM  
90  
80  
70  
60  
50  
40  
30  
20  
PULSE WIDTH (t ) IS DEFINED  
AS THAT POINT WHERE THE  
PEAK CURRENT DECAY = 8 ms  
P
HALF VALUE I  
/2 @ 20 ms  
RSM  
t
P
10  
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
20  
40  
t, TIME (ms)  
60  
80  
T , AMBIENT TEMPERATURE (°C)  
A
Figure 1. Pulse Derating Curve  
Figure 2. 8 × 20 ms Pulse Waveform  
50  
300  
250  
SMS24C  
f = 1.0 MHz  
8 x 20 ms  
PULSE WAVEFORM  
45  
40  
35  
30  
25  
200  
150  
100  
SMS15C  
SMS05C  
SMS12C  
20  
15  
10  
5
SMS05C  
SMS12C  
SMS15C  
50  
0
SMS24C  
20 25  
0
0
5
10  
15  
20  
25  
0
5
10  
15  
I , PEAK PULSE CURRENT (A)  
PP  
V
BR  
, REVERSE VOLTAGE (V)  
Figure 3. Clamping Voltage vs. Peak Pulse Current  
Figure 4. Junction Capacitance vs. Reverse Voltage  
Figure 5. ESD Pulse IEC 61000−4−2  
(8.0 kV Contact)  
Figure 6. SMS15CT1 ESD Response for IEC  
61000−4−2 (+8.0 kV Contact)  
http://onsemi.com  
3
SMS05C, SMS12C, SMS15C, SMS24C  
TYPICAL COMMON ANODE APPLICATIONS  
A 5 TVS junction common anode design in a SC-74  
package protects four separate lines using only one package.  
This adds flexibility and creativity to PCB design especially  
when board space is at a premium. A simplified example of  
SMS05C Series Device applications is illustrated below.  
A
B
KEYBOARD  
FUNCTIONAL  
TERMINAL  
PRINTER  
ETC.  
C
I/O  
DECODER  
D
E
GND  
SMS05C SERIES DEVICE  
Figure 7. Computer Interface Protection  
V
V
DD  
GG  
ADDRESS BUS  
RAM  
ROM  
DATA BUS  
CPU  
I/O  
CLOCK  
CONTROL BUS  
GND  
SMS05C SERIES DEVICE  
Figure 8. Microprocessor Protection  
http://onsemi.com  
4
SMS05C, SMS12C, SMS15C, SMS24C  
PACKAGE DIMENSIONS  
SC−74  
CASE 318F−05  
ISSUE K  
NOTES:  
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
A
2. CONTROLLING DIMENSION: INCH.  
3. MAXIMUM LEAD THICKNESS INCLUDES  
LEAD FINISH THICKNESS. MINIMUM  
LEAD THICKNESS IS THE MINIMUM  
THICKNESS OF BASE MATERIAL.  
L
6
5
2
4
B
S
INCHES  
DIM MIN MAX  
MILLIMETERS  
1
3
MIN  
2.90  
1.30  
0.90  
0.25  
0.85  
MAX  
3.10  
1.70  
1.10  
0.50  
1.05  
0.100  
0.26  
0.60  
1.65  
10  
A
B
C
D
G
H
J
0.1142 0.1220  
0.0512 0.0669  
0.0354 0.0433  
0.0098 0.0197  
0.0335 0.0413  
D
G
0.0005 0.0040 0.013  
0.0040 0.0102  
0.0079 0.0236  
0.0493 0.0649  
0.10  
0.20  
1.25  
0
M
K
L
J
C
M
S
0
10  
0.0985 0.1181  
_
_
_
_
0.05 (0.002)  
2.50  
3.00  
K
STYLE 6:  
PIN 1. CATHODE  
2. ANODE  
H
3. CATHODE  
4. CATHODE  
5. CATHODE  
6. CATHODE  
SOLDERING FOOTPRINT*  
2.4  
0.094  
0.95  
0.037  
1.9  
0.074  
0.95  
0.037  
0.7  
0.028  
1.0  
0.039  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
5
SMS05C, SMS12C, SMS15C, SMS24C  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
SMS05C/D  

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