SMSD602-RT1G [ONSEMI]

NPN 双极晶体管;
SMSD602-RT1G
型号: SMSD602-RT1G
厂家: ONSEMI    ONSEMI
描述:

NPN 双极晶体管

晶体管
文件: 总3页 (文件大小:89K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MSD602-RT1G,  
SMSD602-RT1G  
Preferred Device  
NPN General Purpose  
Amplifier Transistor  
Surface Mount  
http://onsemi.com  
Features  
AECQ101 Qualified and PPAP Capable  
S Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant*  
SC59  
CASE 318D  
STYLE 1  
COLLECTOR  
3
MAXIMUM RATINGS (T = 25°C)  
A
Rating  
Symbol  
Value  
60  
Unit  
Vdc  
CollectorBase Voltage  
V
(BR)CBO  
(BR)CEO  
(BR)EBO  
CollectorEmitter Voltage  
EmitterBase Voltage  
V
V
50  
Vdc  
7.0  
Vdc  
1
2
Collector Current Continuous  
Collector Current Peak  
THERMAL CHARACTERISTICS  
I
500  
1.0  
mAdc  
Adc  
C
BASE  
EMITTER  
I
C(P)  
MARKING DIAGRAM  
Characteristic  
Power Dissipation  
Symbol  
Max  
200  
Unit  
mW  
°C  
P
D
WR M G  
G
Junction Temperature  
Storage Temperature  
T
J
150  
T
stg  
55 ~ +150  
°C  
WR = Specific Device Code  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
M
= Date Code  
G
= PbFree Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MSD602RT1G  
SC59  
(PbFree)  
3,000 / Tape & Reel  
3,000 / Tape & Reel  
SMSD602RT1G  
SC59  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
July, 2012 Rev. 7  
MSD602RT1/D  
MSD602RT1G, SMSD602RT1G  
ELECTRICAL CHARACTERISTICS (T = 25°C)  
A
Characteristic  
Symbol  
Min  
50  
60  
7.0  
Max  
Unit  
CollectorEmitter Breakdown Voltage  
V
Vdc  
(BR)CEO  
(BR)CBO  
(BR)EBO  
(I = 10 mAdc, I = 0)  
C
B
CollectorBase Breakdown Voltage  
(I = 10 mAdc, I = 0)  
V
V
Vdc  
Vdc  
mAdc  
C
E
EmitterBase Breakdown Voltage  
(I = 10 mAdc, I = 0)  
E
C
CollectorBase Cutoff Current  
(V = 20 Vdc, I = 0)  
I
CBO  
0.1  
CB  
E
DC Current Gain (Note 1)  
(V = 10 Vdc, I = 150 mAdc)  
(V = 10 Vdc, I = 500 mAdc)  
h
FE1  
h
FE2  
120  
40  
240  
CE  
C
CE  
C
CollectorEmitter Saturation Voltage  
(I = 300 mAdc, I = 30 mAdc)  
V
Vdc  
pF  
CE(sat)  
0.6  
15  
C
B
Output Capacitance  
(V = 10 Vdc, I = 0, f = 1.0 MHz)  
C
ob  
CB  
E
1. Pulse Test: Pulse Width 300 ms, D.C. 2%.  
http://onsemi.com  
2
 
MSD602RT1G, SMSD602RT1G  
PACKAGE DIMENSIONS  
SC*59  
CASE 318D 04  
*
ISSUE H  
D
NOTES:  
1.ꢀꢁDIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.  
2.ꢀꢁCONTROLLING DIMENSION: MILLIMETER.  
MILLIMETERS  
INCHES  
NOM  
3
DIM  
A
A1  
b
c
D
E
e
L
MIN  
1.00  
0.01  
0.35  
0.09  
2.70  
1.30  
1.70  
0.20  
2.50  
NOM  
1.15  
0.06  
0.43  
0.14  
2.90  
1.50  
1.90  
0.40  
2.80  
MAX  
1.30  
0.10  
0.50  
0.18  
3.10  
1.70  
2.10  
0.60  
3.00  
MIN  
0.039  
0.001  
0.014  
0.003  
0.106  
0.051  
0.067  
0.008  
0.099  
MAX  
0.051  
0.004  
0.020  
0.007  
0.122  
0.067  
0.083  
0.024  
0.118  
E
0.045  
0.002  
0.017  
0.005  
0.114  
0.059  
0.075  
0.016  
0.110  
H
E
1
2
b
e
H
E
C
STYLE 1:  
PIN 1.ꢀBASE  
2.ꢀEMITTER  
3.ꢀCOLLECTOR  
A
L
A1  
SOLDERING FOOTPRINT*  
0.95  
0.037  
0.95  
0.037  
2.4  
0.094  
1.0  
0.039  
0.8  
0.031  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our Pb *Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,  
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC  
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any  
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without  
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications  
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC  
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for  
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where  
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and  
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,  
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture  
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81358171050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MSD602RT1/D  

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