SNSS35200MR6T1G [ONSEMI]
低饱和压晶体管,PNP,35 V,5.0 A;型号: | SNSS35200MR6T1G |
厂家: | ONSEMI |
描述: | 低饱和压晶体管,PNP,35 V,5.0 A 开关 光电二极管 小信号双极晶体管 |
文件: | 总6页 (文件大小:65K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NSS35200MR6T1G
35 V, 5 A, Low VCE(sat)
PNP Transistor
2
ON Semiconductor’s e PowerEdge family of low V
CE(sat)
transistors are miniature surface mount devices featuring ultra low
saturation voltage (V ) and high current gain capability. These
are designed for use in low voltage, high speed switching applications
where affordable efficient energy control is important.
CE(sat)
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35 VOLTS
5.0 AMPS
PNP LOW VCE(sat) TRANSISTOR
EQUIVALENT RDS(on) 100 mW
Typical application are DC−DC converters and power management
in portable and battery powered products such as cellular and cordless
phones, PDAs, computers, printers, digital cameras and MP3 players.
Other applications are low voltage motor controls in mass storage
products such as disc drives and tape drives. In the automotive
industry they can be used in air bag deployment and in the instrument
cluster. The high current gain allows e PowerEdge devices to be
driven directly from PMU’s control outputs, and the Linear Gain
(Beta) makes them ideal components in analog amplifiers.
2
COLLECTOR
1, 2, 5, 6
3
BASE
• This is a Pb−Free Device
MAXIMUM RATINGS (T = 25°C)
A
4
EMITTER
Rating
Symbol
Max
−35
Unit
Vdc
Vdc
Vdc
Adc
A
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
V
CEO
V
CBO
V
EBO
−55
4
5
6
−5.0
−2.0
−5.0
3
Collector Current − Continuous
Collector Current − Peak
Electrostatic Discharge
I
2
1
C
I
CM
TSOP−6
CASE 318G
STYLE 6
ESD
HBM Class 3
MM Class C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
DEVICE MARKING
M
VS8
VS8 = Specific Device Code
M
= Date Code
ORDERING INFORMATION
†
Device
Package
Shipping
NSS35200MR6T1G TSOP−6 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
June, 2005 − Rev. 0
NSS35200MR6/D
NSS35200MR6T1G
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation
P
R
(Note 1)
625
mW
D
T = 25°C
A
Derate above 25°C
5.0
mW/°C
°C/W
Thermal Resistance,
Junction−to−Ambient
(Note 1)
200
q
JA
Total Device Dissipation
P
(Note 2)
(Note 2)
1.0
W
D
T = 25°C
A
Derate above 25°C
8.0
mW/°C
°C/W
Thermal Resistance,
Junction−to−Ambient
R
q
120
JA
Thermal Resistance,
Junction−to−Lead #1
R
80
1.75
°C/W
W
q
JL
Total Device Dissipation
(Single Pulse < 10 sec.)
P
Dsingle
(Notes 2 & 3)
Junction and Storage
Temperature Range
T , T
−55 to +150
°C
J
stg
1. FR−4 @ Minimum Pad.
2. FR−4 @ 1.0 X 1.0 inch Pad.
3. Refer to Figure 9.
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2
NSS35200MR6T1G
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Min
Typical
Max
Unit
OFF CHARACTERISTICS
Collector−Emitter Breakdown Voltage
(I = −10 mAdc, I = 0)
V
V
V
Vdc
Vdc
(BR)CEO
(BR)CBO
(BR)EBO
−35
−55
−5.0
−
−45
−65
−
−
C
B
Collector−Base Breakdown Voltage
(I = −0.1 mAdc, I = 0)
C
E
Emitter−Base Breakdown Voltage
(I = −0.1 mAdc, I = 0)
Vdc
−7.0
−
E
C
Collector Cutoff Current
(V = −35 Vdc, I = 0)
I
mAdc
mAdc
mAdc
CBO
−0.03
−0.03
−0.01
−0.1
−0.1
−0.1
CB
E
Collector−Emitter Cutoff Current
(V = −35 Vdc)
I
I
CES
EBO
−
CES
Emitter Cutoff Current
(V = −4.0 Vdc)
EB
−
ON CHARACTERISTICS
DC Current Gain (Note 4)
h
FE
(I = −1.0 A, V = −1.5 V)
100
100
100
200
200
200
−
400
−
C
CE
(I = −1.5 A, V = −1.5 V)
C
CE
(I = −2.0 A, V = −3.0 V)
C
CE
Collector−Emitter Saturation Voltage (Note 4)
(I = −0.8 A, I = −0.008 A)
V
V
CE(sat)
−
−
−
−0.125
−0.175
−0.260
−0.15
−0.20
−0.31
C
B
(I = −1.2 A, I = −0.012 A)
C
B
(I = −2.0 A, I = −0.02 A)
C
B
Base−Emitter Saturation Voltage (Note 4)
(I = −1.2 A, I = −0.012 A)
V
V
V
BE(sat)
−
−
−0.68
−0.81
−0.85
C
B
Base−Emitter Turn−on Voltage (Note 4)
(I = −2.0 A, V = −3.0 V)
V
BE(on)
−0.875
C
CE
Cutoff Frequency
(I = −100 mA, V = −5.0 V, f = 100 MHz)
f
MHz
T
100
−
−
−
650
100
−
C
CE
Input Capacitance (V = −0.5 V, f = 1.0 MHz)
Cibo
600
85
pF
pF
nS
nS
EB
Output Capacitance (V = −3.0 V, f = 1.0 MHz)
Cobo
−
CB
Turn−on Time (V = −10 V, I = −100 mA, I = −1 A, R = 3 W)
t
t
−
35
CC
B1
C
L
on
off
Turn−off Time (V = −10 V, I = I = −100 mA, I = 1 A, R = 3 W)
−
225
−
CC
B1
B2
C
L
4. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle ≤ 2%.
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3
NSS35200MR6T1G
0.25
I /I = 50
C B
0.1
0.20
0.15
0.10
I /I = 100
C B
100°C
50
25°C
−55°C
10
0.01
0.05
0
0.001
0.001
0.01
0.1
1.0
0.001
0.01
0.1
1.0
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 1. Collector Emitter Saturation Voltage
versus Collector Current
Figure 2. Collector Emitter Saturation Voltage
versus Collector Current
1.6
1.4
1.2
1.0
0.8
0.6
0.4
1.0
0.8
0.6
0.4
100°C
25°C
−55°C
25°C
100°C
−55°C
0.2
0
0.2
0
0.001
0.01
0.1
1.0
0.001
0.01
0.1
1.0
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 3. DC Current Gain versus
Collector Current
Figure 4. Base Emitter Saturation Voltage
versus Collector Current
1.1
1.0
0.9
0.8
0.7
0.6
0.5
750
700
650
600
550
500
450
400
100°C
25°C
−55°C
0.4
0.3
350
300
0.001
0.01
0.1
1.0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
I , COLLECTOR CURRENT (AMPS)
C
V
, EMITTER BASE VOLTAGE (VOLTS)
EB
Figure 5. Base Emitter Turn−On Voltage
versus Collector Current
Figure 6. Input Capacitance
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4
NSS35200MR6T1G
10
225
200
175
150
125
100
75
1 s 100 ms 10 ms
1 ms
100 ms
1.0
0.1
DC
50
25
0
SINGLE PULSE AT T = 25°C
amb
0.01
0.1
1.0
10
100
0
5.0
10
15
20
25
30
35
V
, COLLECTOR−EMITTER VOLTAGE (VOLTS)
CE
V
, COLLECTOR BASE VOLTAGE (VOLTS)
CB
Figure 7. Output Capacitance
Figure 8. Safe Operating Area
1.0
0.1
D = 0.5
0.2
0.1
0.05
0.02
0.01
0.01
SINGLE PULSE
0.001
0.00001
0.0001
0.001
0.01
0.1
t, TIME (sec)
1.0
10
100
1000
Figure 9. Normalized Thermal Response
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5
NSS35200MR6T1G
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE P
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
6
5
2
4
E
H
E
1
3
b
MILLIMETERS
INCHES
DIM
A
A1
b
c
D
E
e
L
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
NOM
1.00
0.06
0.38
0.18
3.00
1.50
0.95
0.40
2.75
−
MAX
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
NOM
0.039
0.002
0.014
0.007
0.118
0.059
0.037
0.016
0.108
−
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
e
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
q
c
A
0.05 (0.002)
L
A1
H
E
q
STYLE 6:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
SOLDERING FOOTPRINT*
2.4
0.094
0.95
0.037
1.9
0.075
0.95
0.037
0.7
0.028
1.0
mm
inches
0.039
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Order Literature: http://www.onsemi.com/litorder
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For additional information, please contact your
local Sales Representative.
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