SNSS35200MR6T1G [ONSEMI]

低饱和压晶体管,PNP,35 V,5.0 A;
SNSS35200MR6T1G
型号: SNSS35200MR6T1G
厂家: ONSEMI    ONSEMI
描述:

低饱和压晶体管,PNP,35 V,5.0 A

开关 光电二极管 小信号双极晶体管
文件: 总6页 (文件大小:65K)
中文:  中文翻译
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NSS35200MR6T1G  
35 V, 5 A, Low VCE(sat)  
PNP Transistor  
2
ON Semiconductor’s e PowerEdge family of low V  
CE(sat)  
transistors are miniature surface mount devices featuring ultra low  
saturation voltage (V ) and high current gain capability. These  
are designed for use in low voltage, high speed switching applications  
where affordable efficient energy control is important.  
CE(sat)  
http://onsemi.com  
35 VOLTS  
5.0 AMPS  
PNP LOW VCE(sat) TRANSISTOR  
EQUIVALENT RDS(on) 100 mW  
Typical application are DC−DC converters and power management  
in portable and battery powered products such as cellular and cordless  
phones, PDAs, computers, printers, digital cameras and MP3 players.  
Other applications are low voltage motor controls in mass storage  
products such as disc drives and tape drives. In the automotive  
industry they can be used in air bag deployment and in the instrument  
cluster. The high current gain allows e PowerEdge devices to be  
driven directly from PMU’s control outputs, and the Linear Gain  
(Beta) makes them ideal components in analog amplifiers.  
2
COLLECTOR  
1, 2, 5, 6  
3
BASE  
This is a Pb−Free Device  
MAXIMUM RATINGS (T = 25°C)  
A
4
EMITTER  
Rating  
Symbol  
Max  
−35  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
A
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
V
CEO  
V
CBO  
V
EBO  
−55  
4
5
6
−5.0  
−2.0  
−5.0  
3
Collector Current − Continuous  
Collector Current − Peak  
Electrostatic Discharge  
I
2
1
C
I
CM  
TSOP−6  
CASE 318G  
STYLE 6  
ESD  
HBM Class 3  
MM Class C  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
DEVICE MARKING  
M
VS8  
VS8 = Specific Device Code  
M
= Date Code  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NSS35200MR6T1G TSOP−6 3000/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
June, 2005 − Rev. 0  
NSS35200MR6/D  
NSS35200MR6T1G  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
Total Device Dissipation  
P
R
(Note 1)  
625  
mW  
D
T = 25°C  
A
Derate above 25°C  
5.0  
mW/°C  
°C/W  
Thermal Resistance,  
Junction−to−Ambient  
(Note 1)  
200  
q
JA  
Total Device Dissipation  
P
(Note 2)  
(Note 2)  
1.0  
W
D
T = 25°C  
A
Derate above 25°C  
8.0  
mW/°C  
°C/W  
Thermal Resistance,  
Junction−to−Ambient  
R
q
120  
JA  
Thermal Resistance,  
Junction−to−Lead #1  
R
80  
1.75  
°C/W  
W
q
JL  
Total Device Dissipation  
(Single Pulse < 10 sec.)  
P
Dsingle  
(Notes 2 & 3)  
Junction and Storage  
Temperature Range  
T , T  
−55 to +150  
°C  
J
stg  
1. FR4 @ Minimum Pad.  
2. FR4 @ 1.0 X 1.0 inch Pad.  
3. Refer to Figure 9.  
http://onsemi.com  
2
 
NSS35200MR6T1G  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Typical  
Max  
Unit  
OFF CHARACTERISTICS  
CollectorEmitter Breakdown Voltage  
(I = −10 mAdc, I = 0)  
V
V
V
Vdc  
Vdc  
(BR)CEO  
(BR)CBO  
(BR)EBO  
−35  
−55  
−5.0  
−45  
−65  
C
B
CollectorBase Breakdown Voltage  
(I = −0.1 mAdc, I = 0)  
C
E
EmitterBase Breakdown Voltage  
(I = −0.1 mAdc, I = 0)  
Vdc  
−7.0  
E
C
Collector Cutoff Current  
(V = −35 Vdc, I = 0)  
I
mAdc  
mAdc  
mAdc  
CBO  
−0.03  
−0.03  
−0.01  
−0.1  
−0.1  
−0.1  
CB  
E
Collector−Emitter Cutoff Current  
(V = −35 Vdc)  
I
I
CES  
EBO  
CES  
Emitter Cutoff Current  
(V = −4.0 Vdc)  
EB  
ON CHARACTERISTICS  
DC Current Gain (Note 4)  
h
FE  
(I = −1.0 A, V = −1.5 V)  
100  
100  
100  
200  
200  
200  
400  
C
CE  
(I = −1.5 A, V = −1.5 V)  
C
CE  
(I = −2.0 A, V = −3.0 V)  
C
CE  
CollectorEmitter Saturation Voltage (Note 4)  
(I = −0.8 A, I = −0.008 A)  
V
V
CE(sat)  
−0.125  
−0.175  
−0.260  
−0.15  
−0.20  
−0.31  
C
B
(I = −1.2 A, I = −0.012 A)  
C
B
(I = −2.0 A, I = −0.02 A)  
C
B
BaseEmitter Saturation Voltage (Note 4)  
(I = −1.2 A, I = −0.012 A)  
V
V
V
BE(sat)  
−0.68  
−0.81  
−0.85  
C
B
BaseEmitter Turn−on Voltage (Note 4)  
(I = −2.0 A, V = −3.0 V)  
V
BE(on)  
−0.875  
C
CE  
Cutoff Frequency  
(I = −100 mA, V = −5.0 V, f = 100 MHz)  
f
MHz  
T
100  
650  
100  
C
CE  
Input Capacitance (V = −0.5 V, f = 1.0 MHz)  
Cibo  
600  
85  
pF  
pF  
nS  
nS  
EB  
Output Capacitance (V = −3.0 V, f = 1.0 MHz)  
Cobo  
CB  
Turn−on Time (V = −10 V, I = −100 mA, I = −1 A, R = 3 W)  
t
t
35  
CC  
B1  
C
L
on  
off  
Turn−off Time (V = −10 V, I = I = −100 mA, I = 1 A, R = 3 W)  
225  
CC  
B1  
B2  
C
L
4. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle 2%.  
http://onsemi.com  
3
 
NSS35200MR6T1G  
0.25  
I /I = 50  
C B  
0.1  
0.20  
0.15  
0.10  
I /I = 100  
C B  
100°C  
50  
25°C  
−55°C  
10  
0.01  
0.05  
0
0.001  
0.001  
0.01  
0.1  
1.0  
0.001  
0.01  
0.1  
1.0  
I , COLLECTOR CURRENT (AMPS)  
C
I , COLLECTOR CURRENT (AMPS)  
C
Figure 1. Collector Emitter Saturation Voltage  
versus Collector Current  
Figure 2. Collector Emitter Saturation Voltage  
versus Collector Current  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
1.0  
0.8  
0.6  
0.4  
100°C  
25°C  
−55°C  
25°C  
100°C  
−55°C  
0.2  
0
0.2  
0
0.001  
0.01  
0.1  
1.0  
0.001  
0.01  
0.1  
1.0  
I , COLLECTOR CURRENT (AMPS)  
C
I , COLLECTOR CURRENT (AMPS)  
C
Figure 3. DC Current Gain versus  
Collector Current  
Figure 4. Base Emitter Saturation Voltage  
versus Collector Current  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
750  
700  
650  
600  
550  
500  
450  
400  
100°C  
25°C  
−55°C  
0.4  
0.3  
350  
300  
0.001  
0.01  
0.1  
1.0  
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0  
I , COLLECTOR CURRENT (AMPS)  
C
V
, EMITTER BASE VOLTAGE (VOLTS)  
EB  
Figure 5. Base Emitter Turn−On Voltage  
versus Collector Current  
Figure 6. Input Capacitance  
http://onsemi.com  
4
NSS35200MR6T1G  
10  
225  
200  
175  
150  
125  
100  
75  
1 s 100 ms 10 ms  
1 ms  
100 ms  
1.0  
0.1  
DC  
50  
25  
0
SINGLE PULSE AT T = 25°C  
amb  
0.01  
0.1  
1.0  
10  
100  
0
5.0  
10  
15  
20  
25  
30  
35  
V
, COLLECTOR−EMITTER VOLTAGE (VOLTS)  
CE  
V
, COLLECTOR BASE VOLTAGE (VOLTS)  
CB  
Figure 7. Output Capacitance  
Figure 8. Safe Operating Area  
1.0  
0.1  
D = 0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.01  
SINGLE PULSE  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t, TIME (sec)  
1.0  
10  
100  
1000  
Figure 9. Normalized Thermal Response  
http://onsemi.com  
5
NSS35200MR6T1G  
PACKAGE DIMENSIONS  
TSOP−6  
CASE 318G−02  
ISSUE P  
NOTES:  
D
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH THICKNESS. MINIMUM LEAD  
THICKNESS IS THE MINIMUM THICKNESS OF  
BASE MATERIAL.  
4. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS, OR GATE  
BURRS.  
6
5
2
4
E
H
E
1
3
b
MILLIMETERS  
INCHES  
DIM  
A
A1  
b
c
D
E
e
L
MIN  
0.90  
0.01  
0.25  
0.10  
2.90  
1.30  
0.85  
0.20  
2.50  
0°  
NOM  
1.00  
0.06  
0.38  
0.18  
3.00  
1.50  
0.95  
0.40  
2.75  
MAX  
MIN  
0.035  
0.001  
0.010  
0.004  
0.114  
0.051  
0.034  
0.008  
0.099  
0°  
NOM  
0.039  
0.002  
0.014  
0.007  
0.118  
0.059  
0.037  
0.016  
0.108  
MAX  
0.043  
0.004  
0.020  
0.010  
0.122  
0.067  
0.041  
0.024  
0.118  
10°  
e
1.10  
0.10  
0.50  
0.26  
3.10  
1.70  
1.05  
0.60  
3.00  
10°  
q
c
A
0.05 (0.002)  
L
A1  
H
E
q
STYLE 6:  
PIN 1. COLLECTOR  
2. COLLECTOR  
3. BASE  
4. EMITTER  
5. COLLECTOR  
6. COLLECTOR  
SOLDERING FOOTPRINT*  
2.4  
0.094  
0.95  
0.037  
1.9  
0.075  
0.95  
0.037  
0.7  
0.028  
1.0  
mm  
inches  
0.039  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
NSS35200MR6/D  

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