SS13FL [ONSEMI]

表面贴装肖特基势垒整流器;
SS13FL
型号: SS13FL
厂家: ONSEMI    ONSEMI
描述:

表面贴装肖特基势垒整流器

文件: 总5页 (文件大小:205K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SS13FL, SS14FL  
Surface Mount Schottky  
Barrier Rectifier  
Features  
Ultra Thin Profile Maximum Height of 1.08 mm  
UL Flammability 94V0 Classification  
MSL 1  
www.onsemi.com  
Green Mold Compound  
1
2
These Devices are PbFree, Halogen Free Free and are RoHS  
Cathode  
Anode  
Compliant  
Schottky Barrier Rectifier  
Specifications  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Value  
SOD123F  
CASE 425AD  
SS13FL SS14FL  
Symbol  
Parameter  
Peak Reverse Voltage  
Reverse Voltage  
Unit  
V
V
RRM  
30  
30  
40  
40  
V
R
V
MARKING DIAGRAMS  
I
Average Rectified Current at  
T = 75°C  
A
1.0  
40  
A
F(AV)  
&Y  
&ZG3&G  
I
NonRepetitive Peak Forward  
Surge Current at t = 8.3 ms  
A
FSM  
Band Indicates Cathode  
T
Operating Junction Temperature  
Range  
55 to +125  
°C  
°C  
J
&Y  
&Z  
G3  
&G  
= Binary Calendar Year Coding Scheme  
= Assembly Plant Code  
= Specific Device Code  
T
Storage Temperature Range  
55 to +125  
STG  
= Single Digit Weekly Data Code  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
&Y  
&ZG4&G  
Band Indicates Cathode  
&Y  
&Z  
G4  
&G  
= Binary Calendar Year Coding Scheme  
= Assembly Plant Code  
= Specific Device Code  
= Single Digit Weekly Data Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
June, 2018 Rev. 2  
SS14FL/D  
SS13FL, SS14FL  
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted) (Note 1)  
A
Symbol  
Characteristic  
Typical Thermal Characteristics, JunctiontoLead (Note 2)  
Typical Thermal Resistance, JunctiontoAmbient  
Value  
25  
Unit  
°C/W  
°C/W  
Y
JL  
R
140  
q
JA  
1. Per JESD513 recommended thermal test board. Device mounted on FR4 PCB, board size = 76.2 mm x 114.3 mm.  
2. Thermocouple soldered at cathode lead.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Symbol  
BV  
Parameter  
Conditions  
SS13FL  
Min  
30  
40  
Typ  
Max  
Unit  
Reverse Breakdown Voltage  
I
= 500 mA  
V
R
R
SS14FL  
V
F
Forward Voltage  
I = 1.0 A  
F
0.55  
30  
V
I
R
Reverse Leakage Current  
Reverse Recovery Time  
V
= V  
RRM  
mA  
ns  
R
T
rr  
I = 0.5 A, I = 1 A,  
SS13FL  
SS14FL  
5.875  
5.695  
60  
F
R
I = 0.25 A  
rr  
C
Junction Capacitance  
V
= 0  
pF  
J
R
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
ORDERING INFORMATION  
Part Number  
Top Mark  
Package  
Shipping  
SS13FL  
G3  
SOD123F  
(PbFree/Halogen Free)  
3000 / Tape & Reel  
SS14FL  
G4  
SOD123F  
(PbFree/Halogen Free)  
3000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
2
 
SS13FL, SS14FL  
TYPICAL PERFORMANCE CHARACTERISTICS  
4
10  
1
125°C  
75°C  
3
10  
0.75  
2
10  
0.5  
0.25  
0
10  
1
25°C  
SINGLE PHASE HALF WAVE 60Hz  
RESTSTIVE OR INDUCTIVE LOAD  
P.C.B MOUNTED  
ON 0.2 x 0.2 (5.0 x 5.0 mm)  
COPPER PAD AREAS  
0.1  
0
25  
50  
75  
100 125 150 175  
0
20  
40  
60  
Lead Temperature (5C)  
V , Reverse Voltage (V)  
R
Figure 1. Forward Current Derating Curve  
Figure 2. Typical Reverse Characteristics  
1000  
100  
10  
20  
10  
20 40 V  
60 V  
60 V  
20 40 V  
100 V  
100 V  
1.0  
0.1  
T = 25°C  
J
Pulse Width = 300 ms  
1 % Duty Cycle  
T = 25°C  
J
0.1  
.5 .7 .8 .9 1.1 1.3 1.5 1.7 1.9  
0
10  
20  
30  
40  
V , Reverse Voltage (V)  
R
Instantaneous Forward Voltage (V)  
Figure 3. Typical Junction Characteristics  
Figure 4. Typical Instantaneous Forward  
Characteristics  
www.onsemi.com  
3
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOD123FL  
CASE 425AD  
ISSUE A  
DATE 04 AUG 2017  
SCALE 4:1  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13725G  
SOD123FL  
PAGE 1 OF 1  
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© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
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ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
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