SS24FL [ONSEMI]
表面贴装肖特基势垒整流器;型号: | SS24FL |
厂家: | ONSEMI |
描述: | 表面贴装肖特基势垒整流器 整流二极管 |
文件: | 总4页 (文件大小:102K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SS26
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
. . . employing the Schottky Barrier principle in a metal−to−silicon
power rectifier. Features epitaxial construction with oxide passivation
and metal overlay contact. Ideally suited for low voltage, high
frequency switching power supplies; free wheeling diodes and
polarity protection diodes.
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SCHOTTKY BARRIER
RECTIFIER
Features
2.0 AMPERES
60 VOLTS
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guardring for Overvoltage Protection
• Low Forward Voltage Drop
• Pb−Free Package is Available
Mechanical Characteristics:
• Case: Molded Epoxy
• Epoxy Meets UL 94, V−O at 0.125 in
• Weight: 95 mg (approximately)
• Cathode Polarity Band
SMB
CASE 403A
PLASTIC
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
MARKING DIAGRAM
• Available in 12 mm Tape, 2500 Units per 13″ Reel, Add “T3” Suffix
to Part Number
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
SS26
• ESD Ratings: Human Body Model = 3B
Machine Model = C
SS26 = Device Code
• Marking: SS26
MAXIMUM RATINGS
ORDERING INFORMATION
Rating
Symbol
Value
Unit
†
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RWM
V
60
V
Device
SS26T3
Package
Shipping
RRM
V
R
SMB
2500 / Tape & Reel
2500 / Tape & Reel
SS26T3G
SMB
(Pb−Free)
Average Rectified Forward Current
I
2.0
40
A
A
O
(At Rated V , T = 95°C)
R
L
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Condi-
tions Halfwave, Single Phase, 60 Hz)
I
FSM
Storage/Operating Case Temperature
Operating Junction Temperature
Voltage Rate of Change
T
stg
, T
C
−55 to +150
−55 to +150
10,000
°C
°C
T
J
dv/dt
V/ms
(Rated V , T = 25°C)
R
J
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
February, 2005 − Rev. 2
SS26/D
SS26
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance − Junction−to−Lead (Note 1)
Thermal Resistance − Junction−to−Ambient (Note 2)
R
q
24
80
°C/W
q
JL
R
JA
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
ELECTRICAL CHARACTERISTICS
Value
T = 25°C
J
T = 125°C
J
Characteristic
Symbol
Unit
v
0.51
0.63
0.475
0.55
V
Maximum Instantaneous Forward Voltage (Note 3)
F
(i = 1.0 A)
F
F
(i = 2.0 A)
Maximum Instantaneous Reverse Current (Note 3)
I
0.2
10
mA
R
(V = 60 V)
R
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%.
10
10
75°C
75°C
25°C
125°C
25°C
125°C
1
1
0.1
100
0.1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.0E−02
125°C
75°C
25°C
f = 1 MHz
1.0E−03
1.0E−04
1.0E−05
25°C
1.0E−06
1.0E−07
10
0
10
20
30
40
50
60
0
10
20
30
40
50
60
V , REVERSE VOLTAGE (V)
R
V , REVERSE VOLTAGE (V)
R
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
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2
SS26
3.5
3
2
1.8
1.6
1.4
1.2
1
dc
dc
2.5
2
SQUARE WAVE
SQUARE WAVE
1.5
1
0.8
0.6
0.4
0.5
0
0.2
0
60
70
80
90
100
110
120
130
0
0.5
1
1.5
2
2.5
3
T , LEAD TEMPERATURE (°C)
L
I , AVERAGE FORWARD CURRENT (A)
O
Figure 5. Current Derating − Junction to Lead
Figure 6. Forward Power Dissipation
1.0E+00
1.0E−01
1.0E−02
50%
20%
10%
5.0%
2.0%
1.0%
1.0E−03
1.0E−04
R
= R
tjl*r(t)
tjl(t)
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 7. Thermal Response − Junction to Case
1.0E+00
1.0E−01
1.0E−02
50%
20%
10%
5.0%
2.0%
1.0%
1.0E−03
1.0E−04
R
tjl(t)
= R
tjl*r(t)
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 8. Thermal Response − Junction to Ambient
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3
SS26
PACKAGE DIMENSIONS
SMB
PLASTIC PACKAGE
CASE 403A−03
ISSUE D
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
D
B
INCHES
DIM MIN MAX
MILLIMETERS
MIN
4.06
3.30
1.90
1.96
MAX
4.57
3.81
2.41
2.11
0.152
0.30
1.27
A
B
C
D
H
J
0.160
0.130
0.075
0.077
0.180
0.150
0.095
0.083
0.0020 0.0060 0.051
0.006
0.030
0.012
0.050
0.15
0.76
K
P
S
C
0.020 REF
0.51 REF
0.205
0.220
5.21
5.59
H
J
K
P
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
mm
inches
ǒ
Ǔ
SCALE 8:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
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Order Literature: http://www.onsemi.com/litorder
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For additional information, please contact your
local Sales Representative.
SS26/D
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