SS25 [ONSEMI]

2.0 A 肖特基势垒整流器;


型号：	SS25
厂家：	ONSEMI
描述：	2.0 A 肖特基势垒整流器光电二极管
文件：	总6页 (文件大小：65K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SS22, SS24

Surface Mount

Schottky Power Rectifier

SMB Power Surface Mount Package

These devices employ the Schottky Barrier principle in a

metal−to−silicon power rectifier. Features epitaxial construction with

oxide passivation and metal overlay contact. Ideally suited for low

voltage, high frequency switching power supplies; free wheeling

diodes and polarity protection diodes.

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SCHOTTKY BARRIER

RECTIFIER

Features

2 AMPERES

20, 40 VOLTS

• Compact Package with J−Bend Leads Ideal for Automated Handling

• Highly Stable Oxide Passivated Junction

• Guardring for Over−Voltage Protection

• Low Forward Voltage Drop

• Pb−Free Package is Available

Mechanical Characteristics

• Case: Molded Epoxy

SMB

CASE 403A

PLASTIC

• Epoxy Meets UL 94 V−0 @ 0.125 in

• Weight: 95 mg (approximately)

• Cathode Polarity Band

• Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

MARKING DIAGRAM

• Available in 12 mm Tape, 2500 Units per 13 in Reel, Add “T3”

Suffix to Part Number

• Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

AYWW

SS2xG

• ESD Ratings: Machine Model = C

ESD Ratings: Human Body Model = 3B

SS2x

= Specific Device Code

= 2 or 4

= Assembly Location

= Year

= Work Week

= Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

†

Device

SS22T3

Package

SMB

Shipping

2500/Tape & Reel

SS24T3

SMB

SS24T3G

SMB

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Semiconductor Components Industries, LLC, 2005

Publication Order Number:

July, 2005 − Rev. 2

SS24/D

SS22, SS24

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

RRM

RWM

SS22

SS24

Average Rectified Forward Current

2.0

(At Rated V , T = 100°C)

Peak Repetitive Forward Current

FRM

3.0

(At Rated V , Square Wave,

100 kHz, T = 105°C)

Non−Repetitive Peak Surge Current

FSM

(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)

Storage/Operating Case Temperature

, T

−55 to +150

−55 to +125

10,000

°C

stg

Operating Junction Temperature

Voltage Rate of Change

dv/dt

V/ms

(Rated V , T = 25°C)

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

THERMAL CHARACTERISTICS

Characteristic

Symbol

Value

Unit

Thermal Resistance,

Junction−to−Lead (Note 1)

Thermal Resistance,

°C/W

Junction−to−Ambient (Note 2)

ELECTRICAL CHARACTERISTICS

T = 25°C

T = 125°C

Maximum Instantaneous Forward Voltage (Note 3)

see Figure 2

0.50

0.46

(i = 2.0 A)

T = 25°C

T = 100°C

Maximum Instantaneous Reverse Current (Note 3)

see Figure 4

0.4

5.7

(V = 40 V)

1. Mounted with minimum recommended pad size, PC Board FR4.

2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.

3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%.

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SS22, SS24

100

T = 125°C

25°C

1.0

0.1

1.0

0.1

100°C

−ꢀ40°C

25°C

0.1

0.3

0.5

0.7

0.9

0.1

0.3

0.5

0.7

0.9

v , INSTANTANEOUS FORWARD VOLTAGE (VOLTS)

V , MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)

Figure 1. Typical Forward Voltage

Figure 2. Maximum Forward Voltage

100E−3

10E−3

1.0E−3

100E−6

10E−6

1.0E−6

100E−3

10E−3

1.0E−3

100E−6

10E−6

1.0E−6

T = 125°C

100°C

25°C

100°C

25°C

V , REVERSE VOLTAGE (VOLTS)

Figure 3. Typical Reverse Current

Figure 4. Maximum Reverse Current

2.5

2.0

1.5

1.0

1.2

1.0

0.8

0.6

0.4

FREQ = 20 kHz

SQUARE WAVE

Ipk/Io = p

SQUARE WAVE

Ipk/Io = 5.0

Ipk/Io = 10

Ipk/Io = p

Ipk/Io = 5.0

Ipk/Io = 20

Ipk/Io = 10

Ipk/Io = 20

0.5

0.2

105

125

0.5

1.0

1.5

2.0

2.5

T , LEAD TEMPERATURE (°C)

I , AVERAGE FORWARD CURRENT (AMPS)

Figure 5. Current Derating

Figure 6. Forward Power Dissipation

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SS22, SS24

1000

125

115

105

= 24°C/W

tja

T = 25°C

43°C/W

63°C/W

100

80°C/W

93°C/W

5.0

V , REVERSE VOLTAGE (VOLTS)

V , DC REVERSE VOLTAGE (VOLTS)

Figure 7. Capacitance

Figure 8. Typical Operating Temperature Derating*

* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-

verse voltage conditions. Calculations of T therefore must include forward and reverse power effects. The allowable operating

T may be calculated from the equation:

T = T

− r(t)(Pf + Pr) where

Jmax

r(t) = thermal impedance under given conditions,

Pf = forward power dissipation, and

Pr = reverse power dissipation

This graph displays the derated allowable T due to reverse bias under DC conditions only and is calculated as T = T

− r(t)Pr,

Jmax

where r(t) = Rthja. For other power applications further calculations must be performed.

1.0E+00

1.0E−01

1.0E−02

50%

20%

10%

5.0%

2.0%

1.0%

1.0E−03

1.0E−04

= R

tjl*r(t)

tjl(t)

0.00001

0.0001

0.001

0.01

0.1

t, TIME (s)

1.0

100

1000

Figure 9. Thermal Response — Junction to Case

1.0E+00

1.0E−01

1.0E−02

50%

20%

10%

5.0%

2.0%

1.0%

1.0E−03

1.0E−04

= R

tjl*r(t)

tjl(t)

0.00001

0.0001

0.001

0.01

0.1

t, TIME (s)

1.0

100

1000

Figure 10. Thermal Response — Junction to Ambient

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SS22, SS24

PACKAGE DIMENSIONS

SMB

CASE 403A−03

ISSUE E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.

MILLIMETERS

INCHES

DIM

MIN

1.90

0.05

1.96

0.15

3.30

4.06

5.21

0.76

NOM

2.13

0.10

2.03

0.23

3.56

4.32

5.44

1.02

MAX

MIN

NOM

0.084

0.004

0.080

0.009

0.140

0.170

0.214

0.040

MAX

0.095

0.006

0.083

0.012

0.150

0.180

0.220

0.050

2.41

0.15

2.11

0.30

3.81

4.57

5.59

1.27

0.075

0.002

0.077

0.006

0.130

0.160

0.205

0.030

0.51 REF

0.020 REF

SOLDERING FOOTPRINT*

2.261

0.089

2.743

0.108

2.159

0.085

inches

SCALE 8:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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SS22, SS24

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

ON Semiconductor Website: http://onsemi.com

Order Literature: http://www.onsemi.com/litorder

Literature Distribution Center for ON Semiconductor

P.O. Box 61312, Phoenix, Arizona 85082−1312 USA

Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada

Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

Japan: ON Semiconductor, Japan Customer Focus Center

2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

Phone: 81−3−5773−3850

For additional information, please contact your

local Sales Representative.

SS24/D

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SS25 [ONSEMI]

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