STK621-070 [ONSEMI]
STK621-070;
| 型号： | STK621-070 |
| 厂家： | 
ONSEMI |
| 描述： | STK621-070 |
| 文件： | 总25页 (文件大小：2394K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Ordering number: EP35E
Combining Power and Control,
Sanyo Inverter Power IC
Enables Easy Realization of Power
Saving for Equipment
To what extent can electrical equipment become environ-
mentally friendly? One of the answers is power-saving and
low-consumption power technology. Inverter technology
realizes fine control of the revolving speed and power sav-
ing for motors widely used for applications ranging from
consumer appliances such as air conditioners, refrigera-
tors, and washing machines, to FA equipment, robots, and
other industrial equipment. The use of this technology
requires solving of a number of issues such as complica-
tion in circuit configuration, increases in mounting space
and noise.
Sanyo's inverter power ICs use an original insulated metal
substrate technology (IMST) that mounts on an aluminum
Washing
machine
substrate power output elements such as IGBTs, MOSFETs,
and bipolar transistors, ICs required for control, as well as
passive devices with high-density mounting. Since all kinds
of peripheral circuits such as protective circuits are also
incorporated, solving the issues mentioned above, more
compact design and higher reliability can also be achieved.
From small power applications (3A) to large power applica-
tions (50A), Sanyo's lineup of inverter power ICs,
whose product grade has been further
enhanced, realizes labor saving for system
design together with power saving.
Air conditioner
Energy Saving
and high performance
through inverter control
Refrigerators
CONTENTS
…………………………
……
…………………………………………………
…………………………
n
n
n
n
n
n
n
n
Proposal for inverter control systems
3
4
5
5
Series lineup
6
7
Three main technologies supporting Sanyo's inverter power ICs
IMST hybrid IC fabrication process
…………………………………………
Development history
………………
Sample Sanyo inverter power IC products
8--9
10--12
………………………………
Inverter circuit block diagram
…………………
Features of Sanyo inverter power ICs
General-purpose
inverter
NC machine
tool
FA
Robots
Cars
……………………………………
………………………………………
………………………………………
…………………………………
n
Main specifications
•STK762-000G Series
•STK623-000 Series
•STK630-000 Series
Packages dimensions
17
18
19
……………………
•STK621-000 / STK611-000 Series
•STK650-000 / STK651-000 Series
13--14
…………………………
…
15
16
n
•
Active filter circuit characteristics improvement examples
20--22
S ANYO In ve rt e r P o w e r IC
1. Proposal for Inverter Control Systems
Demands for inverter control systems, which are used
in various kinds of electrical equipment, are evolving
as time passes. Sanyo has from early on responded
to evolving market needs, proposing optimum sys-
tems. Sanyo offers the sophisticated-function, high-
performance hybrid IC that first integrates an active filt-
er and inverter in the industry realizing a high power
ratio through harmonic control in a single package.
Step 1
Inverter
Inverter
AC
NF
Motor
50/60Hz
100V
Rotation control
Buffer
Reg.
Microcontroller
Step 2
Active filter + inverter
Active filter
Inverter
AC
50/60Hz
85 to 240V Free
NF
Motor
Rotation control
Input voltage free
High power ratio
Buffer
Reg.
Buffer
Harmonic suppression
Microcontroller
Microcontroller
Step 3
Active filter inverter integration
Active filter inverter integration
AC
50/60Hz
85 to 240V Free
NF
Motor
Rotation control
Input voltage free
High power ratio
Harmonic suppression
Sophisticated function
Buffer
Reg.
Buffer
Microcontroller
3
S ANYO In ve rt e r P o w e r IC
2. Three Main Technologies Supporting Sanyo's Inverter Power ICs
Sanyo's inverter power ICs are supported by three
technologies: High-density substrate mounting technol-
ogy through insulated metal substrate technology
(IMST), design technology exploiting Sanyo's exten-
sive know-how acquired through the use of chips
developed in house, and small package technology
enabling easy embedding in equipment.
Sanyo IMST
power ICs
Package
Mounting
technology
technology
Full molding
Compact design
Fasten pins for connecting loads
On-board mounting pins
Bare chip mounting
Al wire bonding
Integrated mounting of power &
control elements
High reliability
Design
technology
Accumulated design know-how
Dedicated CAD system
Built-in protective circuits
Use of chips developed by Sanyo
4
S ANYO In ve rt e r P o w e r IC
3. Development History
Sanyo developed and commercialized the inverter
power IC STK65000 series in 1986, first proposing the
"intelligent power module" concept in the industry, and
in 1989, successfully released the active filter power
IC STK76000 Series.
STK65000MK2
STK65000MK3
BJT
STK650-000
SIT
STK651-000
IGBT & 4 power supplies
STK620-000
IGBT & single power supply
STK621-010
STK621-000
Single control circuit power supply
Small full molding package
STK611-000
IInnvveerrtteerr ppoowwer IC
STK76000
For PAM control
STK762-000
AAccttiivvee ffiilltteerr ppoowwer IC
1985
1990
1995
2000
4. Block Diagram of Inverter Circuit
Pre-drive
power supply
Temperature
detection
Temperature
detection
Motor
NF
Shunt resistor
Three-phase power
drive block
(for example IGBT)
Protective circuit block
Protective circuit block
• Excessive temperature
• Overvoltage
• Excessive temperature
• Excessive saturation voltage
• Overcurrent • Low supply voltage
• Overcurrent
High-voltage interface block
Position detection
Speed detection
Waveform generation / control block (CPU)
Control power
supply
Block
A
Function
Series Name
Inverter
STK650-000 Series/STK651-000 Series
STK611-000 Series/STK621-000 Series
STK762-000G Series
B
Inverter + high-voltage interface
Active Filter
C
B+C
Inverter + Active Filter
STK623-000 Series
5
S ANYO In ve rt e r P o w e r IC
5. Series Lineup
Function Table
Inverter power IC
Protection functions
Excessive
saturation
voltage
Page
Series Name
Circuit function
Features
Block
Excessive
temperature
Low supply
voltage
Overcurrent
IGBT
inverter power IC
Single power supply drive possible
Control signal insulation not required
STK621-000
STK611-000
STK650-000
STK651-000
B
B
A
A
13 to 14
13 to 14
15
MOSFET
inverter power IC
Single power supply drive possible
Control signal insulation not required
BJT
Low loss
inverter power IC
SIT
Super low loss
15
inverter power IC
Active filter power IC
Protection functions
Excessive
saturation
voltage
Page
17
Series Name
Circuit function
Features
Block
C
Excessive
temperature
Low supply
voltage
Overcurrent
Step-up voltage type average current control
PAM control enabled
Harmonic regulation supported
IGBT
active filter
power IC
STK762-000G
Active filter & Inverter integration power IC
Protection functions
Excessive
saturation
voltage
Page
18
Series Name
STK623-000
Circuit function
Features
Block
+
Excessive
temperature
Low supply
voltage
Overcurrent
Integrated
active filter &
inverter power IC
Compact and sophisticated
function
B
C
Triac power IC
Series Name
Circuit function
Triac power IC
Features
Page
19
Multichannel
STK630-000
Series Configuration
Inverter power IC
Rated output current
15A 20A
Series Name
3A
Page
5A
10A
25A
30A
50A
Under development Under development
STK621-000
full-molding small package
STK621-010 STK621-051 STK621-060 STK621-070
13 to 14
[
]
[
]
[
]
[ ]
No.4176
No.4176
No.4176
No.4176
STK621-220 STK621-320 STK621-400
STK621-601 STK621-722
No.4179
[
]
[
]
[
]
[
]
[
]
No.4184
STK621-000
current package
No.4177
No.4177
No.4177
STK621-401
13 to 14
13 to 14
15
[
]
No.4179
STK611-031
No.4173
STK611-000
STK650-000
STK651-000
[
]
STK650-310 STK650-410 STK650-510 STK650-610
[
]
[
]
[
]
[
]
No.4181
No.4178
No.4180
STK650-430
No.4180
No.4181
[
]
STK651-500
15
[
]
No.4183
Active filter power IC
Rated output current
Series Name
Page
17
40A
80A
Under development
STK762-921G
STK762-721G
No.4182
STK762-000G
[
]
[
]
No.4182
Active filter & Inverter integration power IC
Rated output current
Series Name
20A
Page
18
Under development
STK623-400
No.4183
STK623-000
[
]
Triac power IC
Rated output current & circuit configuration
x
x
x
x
x
8A 3 circuits 10A 2 circuits 8A 2 circuits 10A 2 circuits 3A 1 circuits
Series Name
STK630-000
Page
19
x
x
x
x
x
1A 3 circuits
1A 3 circuits
1A 3 circuits
1A 3 circuits
1A 4 circuits
Power supply block
Under development
STK630-252 STK630-255A STK630-260
No.4185
STK630-261 STK630-010
No.4174
[
]
[
]
[
]
[
]
[
]
No.4185
No.4174
No.4175
Numbers between brackets ( [ ] ) indicate the package No. Refer to p. 20 to 22.
6
S ANYO In ve rt e r P o w e r IC
6. IMST Hybrid IC Production Process
Substrate process
Substrate
Copper foil pressure bonding
Domino-shaped
substrate
A significant feature of the IMST hybrid IC
fabrication process is that multiple sub-
strates are linked together and
passed through the line in that
state.The substrates are separat-
ed and pressed at a later
Assembly process
Partial Ni plating
For bonding
Lot number printing
pads
Copper foil etching
stage. This results in a highly
Wiring pattern
formation
Chip component attachment
Capacity and resistor
efficient fabrication sys-
tem. This fabrication
technique is original
to Sanyo and is
Outer shape forming press
attachment
Small-signal device die bonding
made possible by
From output power
elements to control LSI
elements, semiconduc-
Small-signal device chip
attachment
Open/short inspection
theuniquechar-
acteristics of
IMST.
Fine-wire bonding
tors are mounted as bare
chips and connected using
aluminum wire ultrasonic bond-
ing. As a result, the number of
solder joints is reduced for higher
reliability, and the realization of small
hybrid ICs through high-density mount-
ing is enabled.
Small-signal device chip
wire bonding
Baking formation of printed resistors
Power device die bonding
Power device chip
attachment
Resistor adjustment
Thick-wire bonding
Power device chip
wire bonding
Solder cream printing
Circuit adjustment/operation check
Assembly
Visual inspection
Resin coating
Lead frame attachment
Inspection process
Output pin attachment
Small package
Current packages
Hot plate check 1
With case
Elevated temperature
operation check 1
Hot plate check 2
Full molding
Gel filling
Elevated temperature
operation check 2
Characteristics screening
Epoxy resin sealing
In the tests per-
formed to check
whether defects
exist in the bonding
performed during the
Label printing
Lead cutting
fabricationprocess,oper-
Visual inspection
ation checks are done with
the IMST substrate heated
up to 100˚C (for standard type
products).This allows the elimina-
tion of early failures that occur in
the assembly process.
Packing
Completion
Test
7
S ANYO In ve rt e r P o w e r IC
7. Sample Sanyo Inverter Power IC Products
Inverter power ICs (IGBT)
STK621-051 (Full molding package, IGBT, rated output: 10A)
External appearance
Internal mounting substrate
STK621-320 (IGBT, rated output: 15A)
External appearance
Internal mounting substrate
STK621-722 (IGBT, rated output: 50A)
External appearance
Internal mounting substrate
Inverter power IC (MOSFET)
STK611-031 (MOSFET, rated output: 3A)
Internal mounting substrate
External appearance
8
S ANYO In ve rt e r P o w e r IC
Sample Sanyo Inverter Power IC Products
Inverter power IC (BJT)
STK650-310 (BJT, rated output: 15A)
External appearance
Internal mounting substrate
Inverter power IC (SIT)
STK651-500 (SIT, rated output: 20A)
External appearance
Internal mounting substrate
Internal mounting substrate
Internal mounting substrate
Active filter power IC (IGBT)
STK762-921G (IGBT, rated output: 80A)
External appearance
Integrated active filter & inverter power IC (IGBT)
STK623-400 (IGBT, rated output: 20A)
External appearance
9
S ANYO In ve rt e r P o w e r IC
8. Features of Sanyo Inverter Power ICs
8.1 Hybrid IC obtained through the use of insulated metal substrate technology
Sanyo inverter power ICs utilize a metallic base sub-
strate made of aluminum (Al). Aluminum, which has
excellent thermal conductance characteristics, effi-
ciently dissipates the heat loss from power elements.
IMST is a mounting technology that is ideally suited
for the power electronics of inverter drive circuits.
For further information about Sanyo's insulated metal
substrate technology (IMST), refer to Pamphlet No.
EP50, "IMST High-Density Mounting Technology".
AA bbrrooaadd rraannggee ooff eelleemmeennttss
Ideal for high-
density
mounting
ffrroomm bbaarree cchhiippss aanndd cchhiipp
ccoommppoonneennttss ttoo ccoonnnneeccttoorrss
ccaann bbee mmoouunntteedd oonn tthhee
ssaammee ssuubbssttrraattee..
Insulated Metal Substrate
Technology
Bare chip
mounting
possible
Superior
thermal
radiation
Mounting of components
Bare chip mounting
Crossover line
of various types
Power transistors
Chip capacitors and resistors
Electrolytic capacitors
Oscillator elements
MOSFET
IGBT
ICs
Ni plating
Aluminum wires
Heat sink
Connectors
Solder
VVaarriioouuss kkiinnddss ooff sseemmiiccoonndduuccttoorr
ddeevviicceess iinncclluuddiinngg ppoowweerr
eelleemmeennttss ccaann bbee mmoouunntteedd aass
bbaarree cchhiippss..
TThhee ggoooodd tthheerrmmaall
Copper foil wiring
pattern
ccoonndduuccttaannccee ooff aalluummiinnuumm
rreessuullttss iinn ssuuppeerriioorr tthheerrmmaall
rraaddiiaattiioonn..
Ultrasonic joint
Insulating layer
Aluminum Plate
Role of the IMST substrate
Component mounting board
Shielding board
Part of the package itself
Noise
suppression
effect
High
reliability
HHiigghheerr rreelliiaabbiilliittyy iiss oobbttaaiinneedd bbyy
ccoonnssiiddeerraabbllyy rreedduucciinngg tthhee
nnuummbbeerr ooff ssoollddeerr jjooiinnttss..
TThhee wwhhoollee aalluummiinnuumm ppllaattee ccaann bbee
hheelldd aatt tthhee ggrroouunndd ppootteennttiiaall bbyy
ccoonnnneeccttiinngg iitt ttoo ggrroouunndd,, tthhuuss pprroovviiddiinngg
aa sshhiieellddiinngg eeffffeecctt..
The basic patent on IMST was selected as one
of 53 superlative patents for the commemorative
event by the Patent Office marking 100 years
of Japan's industrial(intellectual)rights.
10
S ANYO In ve rt e r P o w e r IC
8.2 Built-in protective circuits
Various protective circuits, including thermal, overcur-
rent, excessive saturation voltage, short, and low sup-
ply voltage protection, as well as detection elements
(shunt resistors, etc.) are mounted in a package with
high-density mounting, enabling the realization of high
accuracy, high stability, and high reliability.
8.3 Built-in pre-drive circuits of optimized design
Pre-drive circuits of optimized design are employed
for the power output elements that are used, eliminat-
ing the necessity of redesign based on consideration
of matching. As a result, the design period for embed-
ded systems is shortened.
8.4 Easy intertace
Output signals from photocouplers can be used as
input signals of hybrid ICs without modification. Fur-
thermore, the use of high-voltage elements has ena-
bled the lineup of a series (STK621-000 Series) that
does not require primary and secondary insulation
through photocouplers, etc., and direct input from the
microcontroller enables fast response and system min-
iaturization.
8.5 High reliability
Compared to PCB mounting of discrete components,
IMST hybrid ICs, which employ bare chip mounting
and aluminum wire bonding, have fewer solder joints
and therefore higher reliability.
8.6 Electromagnetic shielding
Since the base substrate is made of aluminum, the
hybrid IC itself is shielded. This structure is effective
for the control of self noise from inverter control cir-
cuits that perform large current switching. Further-
more, a cutoff effect for external noise is also
obtained.
8.7 Lineup of various power element mounting types
With regard to power elements for use in IMST hybrid
ICs such as Sanyo inverter power ICs, optimum series
lineups are provided to suit each application and pur-
pose.
11
S ANYO In ve rt e r P o w e r IC
8.8 Small packages
A new thin-type package series created through the
use of full molding has been added to current double
insulation structure IMST package. In addition to con-
tributing to the further miniaturization of equipment, it
has become possible to achieve embedding in equip-
ment, which had heretofore been difficult.
Merits of Full Molding Package
Capacity
40%
Small
Mounting
surface
Thickness
Package Structure Comparison
Epoxy coating
Full molding package
Output pin (power & signal systems)
Small full molding package (SIP)
IMST substrate
Double insulation type current package (DIP)
Output pin
(signal system)
Power transistor
(bare chip)
Chip capacitor/resistor
Output pin (power system)
ICs, small-signal devices
(bare chip)
Epoxy filler
Epoxy coating
Aluminum thick-wire
bonding
Solder
Gel
Aluminum fine-wire
Case
Ground
bonding
bonding
Copper foil pattern
Insulating layer
Aluminum plate
IMST substrate
IMST substrate (Insulator)
Ni plating
Conducting paste
Heat sink
Solder
8.9 External output pin
The external pins are devised to support various
mountings due to end products. For instance, for ele-
ments directly mounted on a PCB, pin leads are
employed, and fasten pins or screw pins are
employed for the direct connection of loads.
8.10 Reduced total parts count
The inverter control circuit block is designed in the
form of a hybrid IC as a single module, reducing the
total count of components required for the system.
12
S ANYO In ve rt e r P o w e r IC
9. Main Characteristics
9.1 Inverter power IC STK621-000/STK611-000 Series
n
[Features]
In addition to current packages, full molding packag-
n
Integrates power elements, pre-driver, and protec-
tive circuits
A single power supply drive is enabled through the
use of bootstrap circuits for upper power supplies
(externally set)
es are also available (STK621-010, STK621-051)
Direct input of CMOS level control signals without
an insulating circuit (photocoupler, etc.) is possible.
Built-in simultaneous upper/lower ON prevention cir-
cuit to prevent arm shorting through simultaneous
ON input for the upper and lower side transistors.
n
n
n
n
Protective circuits including overcurrent (bus line),
excessive temperature, and pre-drive low voltage
protection are built in.
ꢀ(Dead time is required for preventing shorting due to
switching delay.)
[Main Characteristics] Tc=25˚C
Type No.
Parameter
Symbol
Unit
STK621-010 STK621-051 STK621-220 STK621-320 STK621-400 STK621-401 STK621-601 STK621-722 STK611-031
Supply voltage
VCC
VCE
IO
500
600
450
450
±3
V
V
Collector-emitter voltage
Output current
±5
±10
±10
±15
±10
±20
±15
±30
±20
±40
20
±20
±40
±30
±60
±50
±100
A
Output peak current
Pre-driver voltage
IOP
VD
±9
A
V
Operating temperature
Storage temperature
TC
-20 to +100
-40 to +125
-20 to +115
˚C
˚C
Tstg
6.5
(Io=1.5A)
2.8
(Io=3.5A)
3.0
(Io=5A)
3.6
(Io=10A)
3.6
(Io=15A)
3.4
(Io=20A)
3.3
(Io=20A)
3.3
(Io=30A)
3.3
(Io=50A)
Transistor saturation
voltage
VCE(sat)
VF
V
V
2.0
(Io=-1.5A)
3.0
(Io=-3.5A)
2.5
(Io=-5A)
2.7
2.7
2.7
2.5
2.5
2.5
Diode forward voltage
(Io=-10A) (Io=-15A) (Io=-20A) (Io=-20A) (Io=-30A) (Io=-50A)
Input ON voltage
Input OFF voltage
VIH
VIL
1.5
3.5
V
V
1.0
(Io=1.5A)
1.0
(Io=3.5A)
1.0
(Io=5A)
1.0
(Io=10A)
1.0
(Io=10A)
1.0
(Io=20A)
1.0
(Io=20A)
1.0
(Io=30A)
1.0
(Io=50A)
ton
U
U
Switching time
1.0
(Io=1.5A)
1.0
(Io=3.5A)
1.0
(Io=5A)
1.0
(Io=10A)
1.0
(Io=10A)
1.0
(Io=20A)
1.0
(Io=20A)
1.0
(Io=30A)
1.0
(Io=50A)
toff
Excessive temperature protection temperature
TSD
100 to 120
32 to 44
9 to 12
115 to 135
˚C
A
_
Overcurrent protection current ISD
Low voltage protection voltage UVSD
Package dimensions
10 to 15
10 to 15
15 to 22
22 to 32
No.4177
32 to 44
48 to 62
70 to 90
No.4184
V
_
_
No.4173
No.4176
No.4179
Power element type
IGBT
MOSFET
The data in parentheses indicates the measurement condition.
[Comparison of application circuits of STK621-000 Series and STK650-000 Series]
STK621-000 Series
STK650-000 Series
System
Non-insulated system
Insulated system
Number of control power supplies
Number of photocouplers
1
0
4
6
Power
supply
Power
supply
5V
Power
supply
5V
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Application circuit example
Motor
Motor
13
S ANYO In ve rt e r P o w e r IC
[Equivalent Circuit Diagram]
STK612-000 Series
STK611-000 Series
VB1
U
VB1
U
VB2
V
VB2
V
VB3
W
VB3
W
+
+
VBS
U.V.
VBS
U.V.
VBS
U.V.
VBS
U.V.
VBS
U.V.
VBS
U.V.
Shunt-Resistor
-
-
Level
Level
Shifter
Level
Shifter
Level
Shifter
Level
Shifter
Level
Shifter
Shifter
HIN1
HIN2
HIN3
HIN1
HIN2
HIN3
Logic
Logic
Logic
Logic
Logic
Logic
LIN1
LIN2
LIN3
LIN1
LIN2
LIN3
FAULT
FAULT
ISO
VDD
VSS
Latch
Reset (All Input = High)
Over-Temp.
Latch
Over-Temp.
Reset (All Input = High)
VDD
VSS
Overcurrent
VDD-UnderVoltage
VDD-UnderVoltage
[Sample Application Circuit]
STK612-000 Series
STK611-000 Series
STK621-000 Series
STK611-000 Series
CB
DB
CB
DB
CB
CS
CB
DB
CB
DB
CB
CS
DB
DB
RB
RB
Motor
Motor
Control Logic
(+5V)
Control Logic
(+5V)
VD4
VD4
+
+
VCC
VCC
CI
CI
CD
CD
-
-
14
S ANYO In ve rt e r P o w e r IC
9.2 Inverter power IC STK650-000/STK651-000 Series
[Features]
excessive temperature, and excessive saturation
n
Integrates power elements, pre-driver, and protec-
voltage protection are built in.
n
n
n
tive circuits
Loads are easily connected thanks to the use of
fasten pins for the power system output pins.
Control signals can be supported at the logic level
through the use of photocouplers.
Series offering pin compatibility from 15A to 30A. The
power capacitance can be changed by simply replac-
ing hybrid ICs, enabling standardized set design.
n
Employs low-saturation bipolar transistors for the
power output stage to realize low loss (STK650-000
Series). Moreover, products further realizing ultra-
low loss are also available through the use of the
SIT process (STK651-000 Series).
n
Protective circuits including overcurrent (bus line),
[Main Characteristics] Tc=25˚C
Type No.
Parameter
Supply voltage
Symbol
VCC
Unit
STK650-310
STK650-410
STK650-430
STK650-510
STK650-610
STK651-500
400
450
V
A
Output current
IO
15
30
20
40
20
40
25
50
30
60
20
40
Output peak current
Pre-drive voltage
IOP
A
VD1 to VD4
TC
5.5 to 8.0
7.5 to 10.0
5.5 to 8.0
V
Operating temperature
Storage temperature
-30 to +100
-40 to +125
˚C
˚C
Tstg
500
(ICEX=6mA)
600
(ICEX=8mA)
Collector-to-emitter sustain voltage
Collector-to-emitter saturation voltage
Collector-to-emitter reverse voltage
VCEX(sus)
V
V
500
5
5
5
5
5
3
VCE(sat)
VF
(Io=15A)
(Io=20A)
(Io=20A)
(Io=25A)
(Io=30A)
(Io=20A)
2.5
(Io=-15A)
2.5
(Io=-20A)
2.5
(Io=-20A)
2.5
(Io=-25A)
2.5
(Io=-30A)
3.5
(Io=20A)
V
2
2
2
2
2
1
ton
U
U
U
(Io=15A)
(Io=20A)
(Io=20A)
(Io=25A)
(Io=30A)
(Io=20A)
5
5
5
5
8
tstg
tr
Switching time
4
1
(Io=-15A)
(Io=-20A)
(Io=-20A)
(Io=-25A)
(Io=-30A)
2
2
2
2
2
(Io=15A)
(Io=20A)
(Io=20A)
(Io=25A)
(Io=30A)
Excessive temperature protection temperature
Overcurrent protection current
Excessive saturation voltage protection level
Package drawing
TSD
ISD
100 to 120
˚C
A
18 to 23
No.4178
22 to 27
22 to 27
27 to 33
40 to 48
No.4181
25 to 31
VSD
15
V
_
_
No.4180
Power element type
BJT
SIT
The data in parentheses indicates the measurement condition.
[Equivalent Circuit Diagram]
[Sample Application Circuit]
+
VD1
UIN
+
Motor
VCC
RB1
-
GND1
VD2
VIN
STK650-000/STK651-000 Series
RB2
GND2
VD3
WIN
*
*
*
*
RB3
VD1
VD2
VD3
VD4
GND3
U
V
UIN
VIN
TRIP
W
V
U
W
V
U
W
*Only the STK650-610 require Zener diodes.
VD4
WIN
-
RB4
GND4
Overcurrent
protection (ISD)
Excessive temperature
protection (TSD)
TRIP
15
S ANYO In ve rt e r P o w e r IC
9.3 Active filter circuit characteristics improvement examples
Various electronic equipment is connected to commer-
cial power supply lines, and the harmonic distortion
generated from this equipment may cause interfer-
ence with power equipment and other electronic equip-
ment.
and power factor improvement.
Sanyo has succeeded in creating hybrid ICs by
employing insulated metal substrate technology
(IMST) for these complex active filter circuits.
Examples of improved characteristics of active filter cir-
cuits are shown below.
Active filter circuits are effective for harmonic control
Capacitor input type rectifier circuit
Active filter circuit
Active filter
Inverter
Inverter
AC
AC
50/60Hz
100V
50/60Hz
85 to 240V Free
NF
Motor
NF
Motor
Circuit
configuration
Buffer
Buffer
Buffer
Reg.
Reg.
Reg.
Microcontroller
Microcontroller
Microcontroller
V
I
Voltage
and current
waveforms
I
V
Current (A)
Current (A)
10
8
10
8
Harmonic
current
spectrum
6
6
4
4
2
2
0
0
1
10
20
Harmonic order
30
1
10
20
Harmonic order
30
16
S ANYO In ve rt e r P o w e r IC
9.4 Active filter power IC STK762-000G Series
[Features]
rent control system
n
n
n
Integrates the major circuits of active filters (power
elements, FRD, current detection resistors, control
IC, protective circuits)
Direct output voltage can be controlled over a wide
range (Approx. 160 to 385V during AC100V input)
Built-in overcurrent, excessive temperature, and
overvoltage protection circuits
n
Uses IGBT for power elements
n
High power factor through the use of average cur-
[Main Characteristics] Tc=25˚C
Type No.
Parameter
Symbol
VCE
Unit
STK762-721G
STK762-921G
Supply voltage
Output current
600
V
A
IC
40
80
80
Output peak current
ICP
160
A
FRD reverse voltage
VRM
IF
600
40
V
FRD forward current
A
=
FRD forward voltage
VF
3 (IF 40A)
V
VCC
ICC ON
TSD
ISD
20
V
Control supply voltage
25
30
mA
˚C
A
Control power supply current drain during operation
Excessive temperature protection temperature
Overcurrent protection current
Booster coil current
100 to 120
50
20
68
30
ICOIL
Vout
TC
Arms
VDC
˚C
160 to 385
-20 to +100
-40 to +125
No.4182
Direct current output voltage
Operating temperature
Tstg
˚C
_
Storage temperature
Package dimensions
The data in parentheses indicates the measurement condition.
[Equivalent Circuit Diagram]
[Sample Application Circuit]
(Application to inverter circuit)
Inductor
C
+
AC Input
Inverter
power IC
FRD
Current
detection
resistor
Motor
IGBT
CZ
Cf
STK621-000
Series, etc.
Ci
-
R
Excessive temperature
Overcurrent protection
Protection
operation output
Control power
supply
STK762-000G Series
(Vcc=17V)
PFC control IC
Soft start/Boost
operation enable
input
Soft start circuit
Control reference
voltage/oscillation
frequency
ROL
RPH
RPL
RML
CMM
RMM
CT
ENBL
TRIP
RVL
RVH
ROH
RT
fOSC
Operation setting signal
(output voltage, oscillation frequency,
reference waveform, overvoltage setting)
CSS Crf
OUT
RSI
RMH
CVC
VCC
17
S ANYO In ve rt e r P o w e r IC
9.5 Integrated active filter & inverter power IC STK623-000 Series
[Features]
Built-in overcurrent, excessive temperature, and low
n
Integrates an active filter (PFC) circuit for power fac-
tor improvement and a 3-phase inverter circuit that
can be driven with a single power supply.
Inverter block:
IGBT for power elements adopted.
Driving with a single power supply is made possible
through the bootstrap system using a level shift cir-
cuit in the high voltage pre-driver block.
control power supply voltage protection circuits
Active filter (PFC) block:
IGBT for power elements adopted
Built-in control IC (average current control type),
FRD, current detection resistors, soft start circuit,
overcurrent and overvoltage protection circuits
The direct current output voltage of the active filter
block can be set externally (PAM control supported)
n
n
n
[Main Characteristics] Tc=25˚C
Type No.
Parameter
Symbol
Unit
STK623-400
Inverter block
Supply voltage 1
VCE1
600
±20
±40
20
V
Output current
Io
A
Output peak current
IOP
A
Control supply voltage 1
Maximum loss (IGBT)
FWD forward voltage
Excessive temperature protection temperature
Overcurrent protection current
Low pre-drive supply voltage protection level
Active filter block
VD1 to VD4
Pd
V
36
W
=
VF1
Upper transistor 3.0 / Lower transistor 3.5 (Io -20A)
V
˚C
A
TSD
100 to 120
25
ISD
UVSD
9 to 12
V
Supply voltage 2
IC
40
A
Output current
FRD reverse voltage
20
Control supply voltage 2
FRD forward voltage
Vsupply
V
Control circuit current drain
Common block
Ion
15
mA
VCC
ICOIL
Vout
TC
450
V
Arms
VDC
˚C
Rectification output voltage
Booster coil current
15
160 to 385
-20 to +100
-40 to +125
No.4183
Direct current output voltage
Operating temperature
Storage temperature
Tstg
˚C
_
Package dimensions
The data in parentheses indicates the measurement condition.
[Equivalent Circuit Diagram]
[Sample Application Circuit]
(during drive with 1 power supply)
Inductor
C
+
U
V
W
-
AC Input
CL
Ci
Motor
CZ
R
STK623-000 Series
High voltage pre-driver +
low supply voltage protection
Temperature/
current protection
17V
power supply
(PFC block)
PFC control IC
Bootstrap input
(upper phase
power supply)
RO
RQ
RE
CB
DB
CB
DB
CB
DB
CS
CD4
RT
RU
Operation setting signal
(voltage, frequency, reference waveform)
FAULT signal PWM signal
15V power supply
(INV block)
RH RP RD
CT Cr
RB
Vsup
(17V) VD4
(15V)
Control Logic
(+5V)
18
S ANYO In ve rt e r P o w e r IC
9.6 Triac power IC STK630-000 Series
[Features]
an AC switch block (other than motor) for inverter
washing machine and a power supply block com-
bined into 1 package.
n
Multi-triac hybrid IC for AC power switch built in pre-
driver
n
n
n
Ideal for AC switches of washing machines, dryers,
heated toilet seats, etc.
The power output block can be configured as 1
package, so that the standardization of parts is pos-
sible. Moreover, more compact and thin sets can be
designed.
The use of a low thermal resistant IMST substrate
results in superior heat dissipation and enables the
elimination of heat sinks.
The use of hollow structure packages, which make
smoke emission and fires less likely, results in supe-
rior safety.
n
n
The STK630-010 (under development) consists of
[Main Characteristics] Tc=25˚C
Type No.
Under development
STK630-010
(
)
( )
STK630-252
STK630-255A
5 built-in circuits
STK630-260 D
STK630-261 D
Unit
Parameter
Signal
5 built-in circuits
6 built-in circuits
5 built-in circuits
5 built-in circuits
1 circuits 4 circuits 3 circuits 3 circuits 2 circuits 3 circuits 2 circuits 3 circuits 2 circuits 3 circuits
(
)
(
)
Repetitive peak off-state voltage VDRM
(
600
600
8
400
1
600
10
400
1
600 800
600 800
V
A
)
Effective ON current
IT RMS
3
1
8
1
10 1
Io1
200
50
[Power supply circuit not built in]
mA
Power supply output current
Io2
VIH
up to 0.4
up to 0.8
up to 0.4
V
V
Input ON voltage
Input OFF voltage
VIL
at least 4.0
No.4185
at least 0.8
at least 0.8
14.5 to 16.5
4.7 to 5.3
Vo1
[Power supply circuit not built in]
V
Power supply output voltage
Vo2
TC
Operating temperature
Storage temperature
Package dimensions
-20 to +100
-40 to +125
˚C
Tstg
˚C
_
No.4175
No.4174
[Equivalent Circuit and Sample Application Circuit]
(In case of use in inverter washing machine)
STK630-010
VB3 VB2 VB1
U
5V
15.5V
+
Inverter
AC Input
85 to 264V
power IC
V
Motor
-
STK621-000
Series, etc.
Reg.
DC-DC converter
W
U
V
W
U
V W
VDD
GND
Triac
output
block
Zero-cross
circuit
Pre-driver
Microcontroller
INT
Feed valve,
drain valve, etc.
3A output x 1
1A output x 4
19
10. Package Dimensions
Package dimensions 4173
Package dimensions 4176
53
9
70
5.5
1
22
2
0.4
5.2
1
22
1
0.5
0.5
2.54
3.9
2152=42
2.54521=53.34
78
Package dimensions 4174
67
60
9
Package dimensions 4177
1
23
2--3.6
0.4
5.2
0.5
2
22
1
(8)
2252=44
2.54
0.5
2152.54=53.34
4--ø2.7
4--ø1
8 deep
61
protrusion 0.5
Package dimensions 4175
+
-
U
V
W
2--ø4.4
hole
2--73
77.5
2--R3
78
70
8.5
1354=52
8
4
1
4--hollow 1
1
14
2--ø3.6
1
27
7
73
87
0.4
2.9
0.5
2
(9)
2652=5.2
20
Package dimensions 4178
Package dimensions 4180
22
1
22
1
2.54
0.5
2152.54=53.34
61
2.54
0.5
2152.54=53.34
4--ø1
4--ø2.7
8 deep
protrusion 0.5
4--ø1
4--ø2.7
8 deep
61
protrusion 0.5
+
-
U
V
W
2--ø4.4
hole
+
-
U
V
W
2--73
77.5
2--R3
2--ø4.4
hole
2--73
77.5
2--R3
7.5
7.5
48
C1
ø1.65
hole
6.35
A
48
P=12
6.35
C1
A
P=12
ø1.65 hole
hollow 1
4--
1
7
DETAILE A
5
73
87
DETAILE A
73
87
Package dimensions 4179
Package dimensions 4181
22
1
22
1
2.54
0.5
2.5
2152.54=53.34
852.5=20
1152.5=27.5
4--ø2.7
8 deep
61
4--ø1
52.5
8
protrusion 0.5
4.5
+
-
U
V
W
ø4.4
+
-
U
V
W
2--ø4.4
hole
2--R3
2--73
77.5
10
77.5
52
7.5
6.35
C1
1
4
4512=48
A
12
4--hollow 1
1
14
ø1.65 hole
5
73
87
DETAILE A
21
Package dimensions 4182
Package dimensions 4184
100
22
1
2.54
0.5
22
1
2152.54=53.34
61
2.54
0.5
4--ø2.7
8 deep
4--ø1
8
8
2152.54=53.34
protrusion 0.5
2
R
-
+
C
+
-
U
V
W
2--ø4.4
hole
2--R3
2--73
77.5
ø4.4
15
10
60
89
52
1
4
7.5
6.35
4--hollow 1
1
14
A
C1
ø1.65 hole
5
73
87
DETAILE A
Package dimensions 4183
Package dimensions 4185
87
64
55.6
28
1
8.5
2
0.5
54
73
61
2--ø3.6
1
18
0.5
2.54
1752.54=43.18
(6.21)
U
V
W + - R C
(R0.4 to 0.8)
(R0.4 to 0.8)
73
52
0.4
4
1
29
42
5.2
7
DETAILE
73
22
<Any and all SANYO products described or contained herein do not have specifications that can
handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to
result in serious physical and/or material damage. Consult with your SANYO representative
nearest you before using any SANYO products described or contained herein in such
applications.
<SANYO assumes no responsibility for equipment failures that result from using products at
values that exceed, even momentarily, rated values (such as maximum ratings, operating
condition ranges, or other parameters) listed in products specifications of any and all SANYO
products described or contained herein.
<Specifications of any and all SANYO products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state,
and are not guarantees of the performance, characteristics, and functions of the described
products as mounted in the customer's products or equipment. To verify symptoms and states
that cannot be evaluated in an independent device, the customer should always evaluate and
test devices mounted in the customer's products or equipment.
<SANYO Electric Co., Ltd. strives to supply high-quality high-reliability products. However any
and all semiconductor products fail with some probability. It is possible that these probabilistic
failures could give rise to accidents or events that could endanger human lives that could give
rise to smoke or fire or that could cause damage to other property. When designing equipment,
adopt safety measures so that these kinds of accidents or events cannot occur. Such measures
include but are not limited to protective circuits and error prevention circuits for safe design,
redundant design, and structural design.
<In the event that any or all SANYO products (including technical data, services) described or
contained herein are controlled under any of applicable local export control laws and regulations,
such products must not be exported without obtaining the export license from the authorities
concerned in accordance with the above law.
<No part of this publication may be reproduced or transmitted in any form or by any means,
electronic or mechanical, including photocopying and recording, or any information storage or
retrieval system, or otherwise, without the prior written permission of SANYO Electric Co., Ltd.
<Any and all information described or contained herein are subject to change without notice due
to product/technology improvement, etc. When designing equipment, refer to the "Delivery
Specification" for the SANYO product that you intend to use.
<Information (including circuit diagrams and circuit parameters) herein is for example only; it is not
guaranteed for volume production. SANYO believes information herein is accurate and reliable,
but no guarantees are made or implied regarding its use or any infringements of intellectual
property rights or other rights of third parties.
For technical information, please contact :
KOREA
JAPAN
<
<
SANYO SEMICONDUCTOR (H.K.) CO., LTD.
Seoul Branch : Room #1201 Samjung Bldg., 69-5, 2-Ka,
Taepyong-Ro, Chung-ku, Seoul, 100-102 Korea
SANYO ELECTRIC CO.,LTD. SEMICONDUCTOR
Tokyo Bldg., 1-10, 1-chome, Ueno, Taito-ku,
Tokyo 110-8534 Japan
Tel:82-2-774-0296, Fax:82-2-752-9790, Tlx:SILICON K22920
Tel:81(Country Code)-3-3837-6339,6340,6342, Fax:81-3-3837-6377
SHIN-NICHI ELECTRONICS CO., LTD.
Seoul Liaison Office : 3F Gohoun Bldg., 646-18
Yoksam-dong, Kangnam-gu, Seoul, Korea
Tel:82-2-508-2812, Fax:82-2-508-2814
HONGKONG
SANYO SEMICONDUCTOR (H.K.) CO., LTD.
Room 612, Harbour Crystal Centre, 100 Granville Road,
Tsimshatsui East, Kowloon, Hong Kong
<
Tel:852-2311-1198, Fax:852-2311-0900, Tlx:56370 SSCHK HX
PAIK YOUNG ELECTRONICS CO., LTD.
162-1, 2-Ka, Jangchung-Dong, Chung-ku,
Seoul, Korea 3F, Taekwang Bldg.,
SHIN-NICHI ELECTRONICS DEVICE (H.K.) LTD.
Room 2001, Park-in Commercial Center,
56 Dundas Street, Kowloon, Hong Kong
Tel:852-2388-3434, Fax:852-2780-2401
Tel:82-2-277-8431/279-7857,7858, Fax:82-2-268-1158
YANG WON ENTERPRISE CO., LTD.
700-5 Daelim-Dong Young Dongpo-ku, Seoul Korea
Tel:82-2-843-2888, Fax:82-2-846-6885
PROTECH PERENNIAL LTD.
Unit 4, 3/F., Wah Shing Center, 11 Shing Yip Street,
Kwun Tong, Kowloon, Hong Kong
TAIWAN
<
Tel:852-2950-2338, Fax:852-2950-2828
SANYO SEMICONDUCTOR TAIPEI CO., LTD.
Room #706, Chia Hsin Bldg., 96, Chung Shan Road,
N.SEC.2, Taipei, Taiwan, R.O.C. 104
OS ELECTRONICS (H.K.) LTD.
Room 2111, Peninsula Tower, 538 Castle Peak Road,
Cheung Sha Wan, Kowloon, Hong Kong
Tel:852-2741-2218, Fax:852-2786-5733
Tel:886-2-2551-5886, Fax:886-2-2541-7649
SANYO SEMICONDUCTOR TAIPEI CO., LTD.
Kaohsiung Office : Room 603, 61. Chung 3rd Road,
Kaohsiung, TAIWAN, R.O.C. 806
TONG SAN ELECTRONIC (H.K.) CO., LTD.
Room 01B12, 23/F., Nan Fung Centre,
264-298 Castle Peak Road, Tsuen Wan, N.T., Hong Kong
Tel:852-2415-3988, Fax:852-2415-8823
Tel:886-7-332-5703, Fax:886-7-332-6647
TONG SAN ELECTRIC CO., LTD.
Room 406, No.372 Lin Sen N.Road, Taipei, Taiwan, R.O.C. 104
Tel:886-2-2561-0381, Fax:886-2-2543-5431, Tlx:23588 TONSANCO
CHINA
<
<
SANYO SEMICONDUCTOR(H.K.)CO.,LTD.
Shanghai Liaison Office : Room 2407,
Ruijing Building, No.205 Maoming South Road,
Shanghai, 200020 P.R.C.
OS SEMICONDUCTOR CO., LTD.
3rd.Fl, No.145, Sec.2, Minsheng E.Road, Taipei, Taiwan, R.O.C. 104
Tel:886-2-2515-2286, Fax:886-2-2516-2388
Tel:86-21-6472-7674, Fax:86-21-6472-7556
UNITEDKINGDOM
<
<
SANYO SEMICONDUCTOR (H.K.) CO., LTD.
Guangzhou Liaison Office : Room 1351,
China Hotel Commercial Tower, Liuhua-Lu,
Guangzhou, 510015 P.R.C.
SANYO SEMICONDUCTOR (EUROPE) GmbH
UK Office : Unit1, Walton Lodge, Bridge Street,
Walton-on Thames, Surrey KT12 1BT, United Kingdom
Tel:44-1932-233-600, Fax:44-1932-230-104
Tel:86-20-8667-7450, Fax:86-20-8667-5072
GERMANY
SANYO SEMICONDUCTOR (EUROPE) GmbH
Office Center Schwalbach 1, Am Kronberger Hang 2a
65824 Schwalbach am Taunus, Germany
SINGAPORE
SANYO SEMICONDUCTOR (S) PTE., LTD.
750D Chai Chee Road #05-04 to 06 Chai Chee Industrial Park
Singapore 469004
Tel:49-6196-926-0, Fax:49-6196-926-266
Tel:65-442-1226, Fax:65-442-1280
SHIN-NICHI ELECTRONICS CO., LTD.
Europe Liaison Office : Carl-Zeiss-Ring 3
D-85737 Ismaning, München, Germany
Tel:49-89-420494-6, Fax:49-89-420494-74
SANYO SEMICON DEVICE CO., LTD.
Singapore Branch : 221 Henderson Road
#08-11 Henderson Industrial Park, Singapore 159557
Tel:65-275-4775/4776, Fax:65-275-4548
OS ELECTRONICS (S) PTE., LTD.
<
U.S.A.
33 Tannery Lane #05-00 Hoesteel Building, 347789 Singapore
Tel:65-746-7770, Fax:65-746-3500/1691
SANYO SEMICONDUCTOR CORPORATION
New Jersey Office : 80 Commerce Drive, Allendale, NJ 07401, U.S.A.
Tel:1-201-825-8080, Fax:1-201-825-0163, Tlx:135138 SANYOSEMI ALNJ
SHIN-NICHI ELECTRONICS (S) PTE., LTD.
25 Tagore Lane #02-07, Singapore Godown, Singapore 787602
Tel:65-552-8996, Fax:65-552-8830/8846
SANYO SEMICONDUCTOR CORPORATION
California Office : 2010 N.1st Street, Suite 500,
San Jose, CA 95131, U.S.A.
MALAYSIA
<
Tel:1-408-441-6567, Fax:1-408-441-6672
SANYO SEMICONDUCTOR (S) PTE., LTD.
KL Regional Office : 504, Block A, Level 5 Kelana business Centre,
Off subang Airport Highway 97 Jalan SS 7/2,
SANYO SEMICONDUCTOR CORPORATION
Illinois Office : 900 N. Arlington Heights Road,
Suite 360 Itasca, Illinois 60143, U.S.A.
47301 Petaling Jaya Selangor Darul Ehsan, Malaysia
Tel:60-3-5828822, Fax:60-3-5828823
Tel:1-630-775-0006, Fax:1-630-775-0060
SANYO SEMICONDUCTOR CORPORATION
San Diego Office : 2055 sanyo Avenue, San Diego, CA 92173, U.S.A.
Tel:1-619-661-4880, Fax:1-619-661-4881
SANYO SEMICONDUCTOR (S) PTE., LTD.
Penang Regional Office : Unit 15-C2, Menara BHL Bank 51,
Jalan Sultan Ahmad Shah 10050 Penang, Malaysia
Tel:60-4-226-6877, Fax:60-4-227-6877
SANYO SEMICONDUCTOR DISTRIBUTION (U.S.A.) CORPORATION
49 Walnut Street, Norwood, New Jersey 07648, U.S.A.
Tel:1-201-784-0303, Fax:1-201-784-8003
80100
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
Telephone:03-3837-6339, 6340, 6342, Facsimile:03-3837-6377
Printed in Japan / September 2000 3k AVJ
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