SZ1.5SMC8.2AT3G [ONSEMI]
DIODE TVS DIODE, Transient Suppressor;
| 型号： | SZ1.5SMC8.2AT3G |
| 厂家： | 
ONSEMI |
| 描述： | DIODE TVS DIODE, Transient Suppressor 局域网 光电二极管 电视 瞬态抑制器 |
| 文件： | 总7页 (文件大小：123K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1.5SMC6.8AT3G Series,
SZ1.5SMC6.8AT3G Series
1500 Watt Peak Power
Zener Transient Voltage
Suppressors
http://onsemi.com
Unidirectional*
SURFACE MOUNT
ZENER OVERVOLTAGE
TRANSIENT SUPPRESSORS
5.8 − 78 VOLTS
The SMC series is designed to protect voltage sensitive
components from high voltage, high energy transients. They have
excellent clamping capability, high surge capability, low zener
impedance and fast response time. The SMC series is supplied in
ON Semiconductor’s exclusive, cost-effective, highly reliable
1500 WATT PEAK POWER
®
SURMETIC package and is ideally suited for use in
communication systems, automotive, numerical controls, process
controls, medical equipment, business machines, power supplies and
many other industrial/consumer applications.
SMC
CASE 403
Specification Features
• Working Peak Reverse Voltage Range − 5.8 to 77.8 V
• Standard Zener Breakdown Voltage Range − 6.8 to 91 V
• Peak Power − 1500 W @ 1.0 ms
Cathode
Anode
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• Maximum Clamp Voltage @ Peak Pulse Current
• Low Leakage < 5.0 mA Above 10 V
• UL 497B for Isolated Loop Circuit Protection
• Maximum Temperature Coefficient Specified
• Response Time is Typically < 1.0 ns
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These are Pb−Free Devices are Available**
MARKING DIAGRAM
AYWW
xxxAG
G
xxxA = Specific Device Code
(See Table on Page 3)
= Assembly Location
= Year
WW = Work Week
A
Y
G
= Pb−Free Package
(Note: Microdot may be in either location)
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
FINISH: All external surfaces are corrosion resistant and leads are
readily solderable
ORDERING INFORMATION
†
Device***
Package
Shipping
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
1.5SMCxxxAT3G
SMC
(Pb−Free)
2,500 /
Tape & Reel
260°C for 10 Seconds
LEADS: Modified L−Bend providing more contact area to bond pads
POLARITY: Cathode indicated by molded polarity notch
MOUNTING POSITION: Any
SZ1.5SMCxxxAT3G
SMC
(Pb−Free)
2,500 /
Tape & Reel
***The “T3” suffix refers to a 13 inch reel.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
**Bidirectional devices will not be available in this series.
**For additional information on our Pb−Free strategy and soldering details,
please download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Individual devices are listed on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
February, 2014 − Rev. 11
1.5SMC6.8AT3/D
1.5SMC6.8AT3G Series, SZ1.5SMC6.8AT3G Series
MAXIMUM RATINGS
Rating
Peak Power Dissipation (Note 1) @ T = 25°C, Pulse Width = 1 ms
Symbol
Value
1500
4.0
Unit
W
P
PK
L
DC Power Dissipation @ T = 75°C
P
D
W
L
Measured Zero Lead Length (Note 2)
Derate Above 75°C
54.6
18.3
mW/°C
°C/W
Thermal Resistance, Junction−to−Lead
R
q
JL
DC Power Dissipation (Note 3) @ T = 25°C
P
0.75
6.1
165
W
mW/°C
°C/W
A
D
Derate Above 25°C
Thermal Resistance from Junction−to−Ambient
R
q
JA
Forward Surge Current (Note 4) @ T = 25°C
I
200
A
A
FSM
Operating and Storage Temperature Range
T , T
−65 to +150
°C
J
stg
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. 10 X 1000 ms, non−repetitive
2. 1 in. square copper pad, FR−4 board
3. FR−4 board, using ON Semiconductor minimum recommended footprint, as shown in 403 case outline dimensions spec.
4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum.
ELECTRICAL CHARACTERISTICS (T = 25°C unless
A
I
otherwise noted, V = 3.5 V Max. @ I (Note 5) = 100 A)
F
F
I
F
Symbol
Parameter
I
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
PP
V
C
PP
V
C
V
V
V
Working Peak Reverse Voltage
BR RWM
RWM
V
I
V
F
R
T
I
R
Maximum Reverse Leakage Current @ V
I
RWM
V
Breakdown Voltage @ I
Test Current
BR
T
I
T
QV
Maximum Temperature Coefficient of V
BR
BR
I
PP
I
F
Forward Current
Uni−Directional TVS
V
F
Forward Voltage @ I
F
5. 1/2 sine wave or equivalent, PW = 8.3 ms non−repetitive duty
cycle
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2
1.5SMC6.8AT3G Series, SZ1.5SMC6.8AT3G Series
ELECTRICAL CHARACTERISTICS
Breakdown Voltage
V
C
@ I (Note 8)
PP
V
RWM
V
BR
V (Note 7)
@ I
V
C
I
PP
(Note 6)
I
R
@ V
QV
BR
T
RWM
Device
V
mA
Min
Nom
Max
mA
V
A
%/5C
0.057
0.061
0.065
Marking
Device*
1.5SMC6.8AT3G
1.5SMC7.5AT3G
1.5SMC8.2AT3G
6V8A
7V5A
8V2A
5.8
6.4
7.02
1000
500
200
6.45
7.13
7.79
6.8
7.5
8.2
7.14
7.88
8.61
10
10
10
10.5
11.3
12.1
143
132
124
1.5SMC10AT3G
1.5SMC12AT3G
1.5SMC13AT3G
10A
12A
13A
8.55
10.2
11.1
10
5
5
9.5
11.4
12.4
10
12
13
10.5
12.6
13.7
1
1
1
14.5
16.7
18.2
103
90
82
0.073
0.078
0.081
1.5SMC15AT3G
1.5SMC16AT3G
1.5SMC18AT3G
1.5SMC20AT3G
15A
16A
18A
20A
12.8
13.6
15.3
17.1
5
5
5
5
14.3
15.2
17.1
19
15
16
18
20
15.8
16.8
18.9
21
1
1
1
1
21.2
22.5
25.2
27.7
71
67
59.5
54
0.084
0.086
0.088
0.09
1.5SMC22AT3G
1.5SMC24AT3G
1.5SMC27AT3G
1.5SMC30AT3G
22A
24A
27A
30A
18.8
20.5
23.1
25.6
5
5
5
5
20.9
22.8
25.7
28.5
22
24
27
30
23.1
25.2
28.4
31.5
1
1
1
1
30.6
33.2
37.5
41.4
49
45
40
36
0.092
0.094
0.096
0.097
1.5SMC33AT3G
1.5SMC36AT3G
1.5SMC39AT3G
1.5SMC43AT3G
33A
36A
39A
43A
28.2
30.8
33.3
36.8
5
5
5
5
31.4
34.2
37.1
40.9
33
36
39
43
34.7
37.8
41
1
1
1
1
45.7
49.9
53.9
59.3
33
30
28
0.098
0.099
0.1
45.2
25.3
0.101
1.5SMC47AT3G
1.5SMC51AT3G
1.5SMC56AT3G
1.5SMC62AT3G
47A
51A
56A
62A
40.2
43.6
47.8
53
5
5
5
5
44.7
48.5
53.2
58.9
47
51
56
62
49.4
53.6
58.8
65.1
1
1
1
1
64.8
70.1
77
23.2
21.4
19.5
17.7
0.101
0.102
0.103
0.104
85
1.5SMC68AT3G
1.5SMC75AT3G
1.5SMC82AT3G
1.5SMC91AT3G
68A
75A
82A
91A
58.1
64.1
70.1
77.8
5
5
5
5
64.6
71.3
77.9
86.5
68
75
82
91
71.4
78.8
86.1
95.5
1
1
1
1
92
16.3
14.6
13.3
12
0.104
0.105
0.105
0.106
103
113
125
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. A transient suppressor is normally selected according to the working peak reverse voltage (V
the DC or continuous peak operating voltage level.
), which should be equal to or greater than
RWM
7. V measured at pulse test current I at an ambient temperature of 25°C.
BR
T
8. Surge current waveform per Figure 2 and derate per Figure 3 of the General Data − 1500 Watt at the beginning of this group.
* Include SZ-prefix devices where applicable.
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3
1.5SMC6.8AT3G Series, SZ1.5SMC6.8AT3G Series
100
10
PULSE WIDTH (t ) IS DEFINED
P
AS THAT POINT WHERE THE PEAK
NONREPETITIVE
PULSE WAVEFORM
SHOWN IN FIGURE 2
t ≤ 10 ms
rꢀ
CURRENT DECAYS TO 50%
OF I .
PP
100
50
0
PEAK VALUE - I
PP
I
PP
2
HALF VALUE -
1
t
P
0.1
0.1 ms
1 ms
10 ms
100 ms
1 ms
10 ms
0
1
2
3
4
t , PULSE WIDTH
P
t, TIME (ms)
Figure 1. Pulse Rating Curve
Figure 2. Pulse Waveform
160
140
120
1000
500
V
BR
ꢀ(NOM)ꢀ=ꢀ6.8ꢀTOꢀ13ꢀV
20ꢀV
T ꢀ=ꢀ25°C
L
t ꢀ=ꢀ10ꢀms
P
43ꢀV
24ꢀV
200
100
50
75ꢀV
120ꢀV
100
80
180ꢀV
20
10
60
40
20
0
5
2
1
0.3
0.5 0.7
1
2
3
5
7
10
20 30
0
25
50
75
100
125
150
T , AMBIENT TEMPERATURE (°C)
A
DV , INSTANTANEOUS INCREASE IN V ABOVE V (NOM) (VOLTS)
BR BR BR
Figure 4. Dynamic Impedance
Figure 3. Pulse Derating Curve
UL RECOGNITION
The entire series has Underwriters Laboratory
Recognition for the classification of protectors (QVGQ2)
under the UL standard for safety 497B and File #E210057.
Many competitors only have one or two devices recognized
or have recognition in a non-protective category. Some
competitors have no recognition at all. With the UL497B
recognition, our parts successfully passed several tests
including Strike Voltage Breakdown test, Endurance
Conditioning, Temperature test, Dielectric Voltage-Withstand
test, Discharge test and several more.
Whereas, some competitors have only passed a
flammability test for the package material, we have been
recognized for much more to be included in their Protector
category.
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4
1.5SMC6.8AT3G Series, SZ1.5SMC6.8AT3G Series
APPLICATION NOTES
Response Time
minimum lead lengths and placing the suppressor device as
close as possible to the equipment or components to be
protected will minimize this overshoot.
In most applications, the transient suppressor device is
placed in parallel with the equipment or component to be
protected. In this situation, there is a time delay associated
with the capacitance of the device and an overshoot
condition associated with the inductance of the device and
the inductance of the connection method. The capacitive
effect is of minor importance in the parallel protection
scheme because it only produces a time delay in the
transition from the operating voltage to the clamp voltage as
shown in Figure 5.
The inductive effects in the device are due to actual
turn-on time (time required for the device to go from zero
current to full current) and lead inductance. This inductive
effect produces an overshoot in the voltage across the
equipment or component being protected as shown in
Figure 6. Minimizing this overshoot is very important in the
application, since the main purpose for adding a transient
suppressor is to clamp voltage spikes. The SMC series have
a very good response time, typically < 1.0 ns and negligible
inductance. However, external inductive effects could
produce unacceptable overshoot. Proper circuit layout,
Some input impedance represented by Z is essential to
in
prevent overstress of the protection device. This impedance
should be as high as possible, without restricting the circuit
operation.
Duty Cycle Derating
The data of Figure 1 applies for non-repetitive conditions
and at a lead temperature of 25°C. If the duty cycle increases,
the peak power must be reduced as indicated by the curves
of Figure 7. Average power must be derated as the lead or
ambient temperature rises above 25°C. The average power
derating curve normally given on data sheets may be
normalized and used for this purpose.
At first glance the derating curves of Figure 7 appear to be
in error as the 10 ms pulse has a higher derating factor than
the 10 ms pulse. However, when the derating factor for a
given pulse of Figure 7 is multiplied by the peak power value
of Figure 1 for the same pulse, the results follow the
expected trend.
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5
1.5SMC6.8AT3G Series, SZ1.5SMC6.8AT3G Series
TYPICAL PROTECTION CIRCUIT
Z
in
LOAD
V
in
V
L
V
in
(TRANSIENT)
OVERSHOOT DUE TO
INDUCTIVE EFFECTS
V
V
V
in
(TRANSIENT)
V
L
V
L
V
in
t
d
t
D
= TIME DELAY DUE TO CAPACITIVE EFFECT
t
t
Figure 5.
Figure 6.
1
0.7
0.5
0.3
0.2
PULSE WIDTH
10 ms
0.1
0.07
0.05
1 ms
0.03
0.02
100 ms
10 ms
0.01
0.1 0.2
0.5
1
2
5
10 20
50 100
D, DUTY CYCLE (%)
Figure 7. Typical Derating Factor for Duty Cycle
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6
1.5SMC6.8AT3G Series, SZ1.5SMC6.8AT3G Series
PACKAGE DIMENSIONS
SMC
CASE 403−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
H
E
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.
E
MILLIMETERS
INCHES
DIM
A
A1
b
c
D
E
H
E
L
MIN
1.90
0.05
2.92
0.15
5.59
6.60
7.75
0.76
NOM
2.13
0.10
3.00
0.23
5.84
6.86
7.94
1.02
MAX
MIN
NOM
0.084
0.004
0.118
0.009
0.230
0.270
0.313
0.040
MAX
0.095
0.006
0.121
0.012
0.240
0.280
0.320
0.050
2.41
0.15
3.07
0.30
6.10
7.11
8.13
1.27
0.075
0.002
0.115
0.006
0.220
0.260
0.305
0.030
b
D
L1
0.51 REF
0.020 REF
A
c
A1
L
L1
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
mm
inches
ǒ
Ǔ
SCALE 4:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SURMETIC is a registered trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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1.5SMC6.8AT3/D
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