SZEMI8043MUTAG [ONSEMI]

带 ESD 保护的共模滤波器;


型号：	SZEMI8043MUTAG
厂家：	ONSEMI
描述：	带 ESD 保护的共模滤波器
文件：	总10页 (文件大小：628K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Common Mode Filter with

ESD Protection

> 900 MHz Common Mode Stop Band

Attenuation for HDMI Interfaces

EMI804x Series

www.onsemi.com

Functional Description

The EMI804x is a family of Common Mode Filters (CMF) with

integrated ESD protection, a first in the industry. Differential signaling

I/Os can now have both common mode filtering and ESD protection in

one package. The EMI804x protects against ESD pulses up to 15 kV

contact per the IEC61000−4−2 standard.

XDFN6

CASE 711AY

XDFN10

CASE 711AX

XDFN16

CASE 711AZ

The EMI804x is well−suited for protecting systems using

high−speed differential ports such as USB 3.0, HDMI 1.3/1.4/2.0;

corresponding ports in removable storage and other applications.

The EMI804x is available in a RoHS−compliant, XDFN6 for 1

Differential Pair, XDFN10 for 2 Differential Pair and XDFN16

package for 3 Differential Pair.

UDFN6

CASE 517DG

MARKING DIAGRAMS

Features

XX M

W2 M

W3 M

• Total Insertion Loss DM

• Large Differential Mode Cutoff Frequency f

< 2.5 dB at 2.5 GHz

LOSS

> 5 GHz

3dB

• High Common Mode Stop Band Attenuation:

15 dB at 700 MHz, 30 dB at 2.4 GHz

• Low Channel Resistance 6.0 W

XX = Specific Device Code

XXXMG

= Date Code

= Pb−Free Package

• Provides ESD Protection to IEC61000−4−2 Level 4, 15 kV Contact

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

ELECTRICAL SCHEMATICS

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Applications

• USB 3.0

• HDMI 1.3/1.4/2.0

• MHL 2.0

EMI8042

• ESATA

• Automotive Cameras

EMI8043

Figure 1. EMI8041 Electrical Schematic

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 6 of this data sheet.

Publication Order Number:

August, 2020 − Rev. 0

EMI8041/D

EMI804x Series

PIN FUNCTION DESCRIPTION

Device Pin

EMI8041

EMI8042

EMI8043

Pin Name

In_1+

Type

Description

I/O

GND

CMF Channel 1+ to Connector (External)

CMF Channel 1− to Connector (External)

CMF Channel 1+ to ASIC (Internal)

CMF Channel 1− to ASIC (Internal)

CMF Channel 2+ to Connector (External)

CMF Channel 2− to Connector (External)

CMF Channel 2+ to ASIC (Internal)

CMF Channel 2− to ASIC (Internal)

CMF Channel 3+ to Connector (External)

CMF Channel 3− to Connector (External)

CMF Channel 3+ to ASIC (Internal)

CMF Channel 3− to ASIC (Internal)

Ground

In_1−

Out_1+

Out_1−

In_2+

3,4

In_2−

Out_2+

Out_2−

In_3+

3, 8

In_3−

Out_3+

Out_3−

3,6,14,11

ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)

Parameter

Operating Temperature Range

Symbol

Value

−40 to +85

−65 to +150

260

Unit

°C

Storage Temperature Range

STG

°C

Maximum Lead Temperature for Soldering Purposes

(1/8” from Case for 10 seconds)

°C

DC Current per Line

100

LINE

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

www.onsemi.com

EMI804x Series

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)

Symbol

Parameter

Reverse Working Voltage

Test Conditions

Min

Typ

Max

Unit

RWM

(Note 3)

3.3

Breakdown Voltage

= 1 mA; (Note 4)

4.0

9.0

1.0

Channel Leakage Current

T = 25°C, V = 3.3 V, GND = 0 V

LEAK

Channel Resistance

(Pins 1−6, 2−5) − EMI8041

6.0

(Pins 1−10, 2−9, 4−7 and 5−6) − EMI8042

(Pins 1−16, 2−15, 4−13, 5−12, 7−10 and 8−9) − EMI8043

Differential Mode Insertion Loss

@ 2.5 GHz

2.5

5.0

LOSS

Differential Mode Cut-off Frequency

50 W Source and Load

GHz

3dB

Termination

Common Mode Stop Band Attenuation

@ 700 MHz

atten

In-system ESD Withstand Voltage

a) Contact discharge per IEC 61000-4-2 standard, Level 4

(External Pins)

b) Contact discharge per IEC 61000-4-2 standard, Level 1

(Internal Pins)

(Notes 1 and 2)

ESD

TLP Clamping Voltage

Forward I = 8 A

7.26

11.8

−3.5

−6.7

Forward I = 16 A

Forward I = −8 A

Forward I = −16 A

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

1. Standard IEC61000−4−2 with C

= 150 pF, R

= 330, GND grounded.

Discharge

2. These measurements performed with no external capacitor.

3. TVS devices are normally selected according to the working peak reverse voltage (V

or continuous peak operating voltage level.

), which should be equal to or greater than the DC

RWM

4. V is measured at pulse test current I .

www.onsemi.com

EMI804x Series

TYPICAL CHARACTERISTICS

−1

−2

−3

−4

−5

−6

−7

−8

−9

−10

−5

−10

−15

−20

−25

−30

−35

−40

−45

−50

1.E+06

1.E+07

1.E+08

1.E+09

1.E+10

1.E+06

1.E+07

1.E+08

1.E+09

1.E+10

FREQUENCY (Hz)

Figure 2. Typical Differential Mode Attenuation

vs. Frequency

Figure 3. Typical Common Mode Attenuation

vs. Frequency

Interface

Data Rate (Gb/s)

Fundamental Frequency (GHz)

EMI804x Insertion Loss (dB)

HDMI 1.3/1.4

USB 3.0

3.4

5.0

6.0

1.7 (m1)

2.5 (m2)

3.0 (m3)

m1 = 1.65

m2 = 2.13

m3 = 2.41

HDMI 2.0

www.onsemi.com

EMI804x Series

TRANSMISSION LINE PULSE (TLP) MEASUREMENTS

Transmission Line Pulse (TLP) provides current versus voltage (I−V) curves in which each data point is obtained from a

100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in

Figure 4. TLP I−V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10 s

of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 5 where an 8 kV

IEC61000−4−2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP curve shows the voltage at

which the device turns on as well as how well the device clamps voltage over a range of current levels. Typical TLP I−V curves

for the EMI804x are shown in Figure 4.

Attenuator

50 W Coax Cable

V_M

I_M

10 MQ

V_C

DUT

Oscilloscope

Figure 4. Simplified Schematic of a Typical TLP System

Figure 5. Comparison Between 8 kV IEC61000- 4- 2 and 8 A and 16 A TLP Waveforms

−18

−16

−14

−12

−10

−8

−6

−4

−2

−4

−6

−8 −10 −12 −14 −16 −18

V (V)

clamp

(V)

Figure 6. Positive and Negative TLP Waveforms

www.onsemi.com

EMI804x Series

Pattern Generator

(5 Gbps, PRBS31 Pattern)

50 GHz Sampling Oscilloscope

ONsemi high speed test board

(Rogers 4003 Material, Southwest

Microwave 2.4mm Connectors)

Figure 7. Eye Diagram Test Setup for 5Gbps Data Rate

Figure 8. Eye Diagram 5Gbps with and without EMI804x

Eye Height (mVppd)

Rise Time (ps)

Fall Time (ps)

29.6

Jrms (ps)

1.997

Jpp (ps)

9.6

Reference (No Device)-Left Figure

EMI804x Right Figure

724

405

30.4

60.8

3.484

ORDERING INFORMATION

Orderable Part Number

†

Marking

Package

Shipping

EMI8041MUTAG,

XDFN6

3000 / Tape & Reel

SZEMI8041MUTAG*

(Pb−Free)

EMI8042MUTAG,

SZEMI8042MUTAG*

XDFN10

(Pb−Free)

EMI8043MUTAG,

SZEMI8043MUTAG*

XDFN16

(Pb−Free)

EMI8041BMUTAG

UDFN6

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP

Capable.

www.onsemi.com

EMI804x Series

PACKAGE DIMENSIONS

UDFN6 1.6x1.35, 0.5P

CASE 517DG

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

A B

PIN ONE

REFERENCE

0.10

MILLIMETERS

DIM MIN

0.45

A1 0.00

MAX

0.55

0.05

0.25

TOP VIEW

0.15

1.60 BSC

1.35 BSC

0.50 BSC

0.10

0.08

0.35

L2 0.65

0.55

0.85

DETAIL A

RECOMMENDED

MOUNTING FOOTPRINT

SEATING

PLANE

SIDE VIEW

0.50

PITCH

0.86

DETAIL A

1.55

6X b

0.32

0.56

0.10 C A B

NOTE 3

0.05

BOTTOM VIEW

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

EMI804x Series

PACKAGE DIMENSIONS

XDFN6, 1.50x1.35, 0.5P

CASE 711AY

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSIONS b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30 MM FROM TERMINAL TIP.

PIN 1

REFERENCE

0.10

DETAIL A

MILLIMETERS

ALTERNATE

DIM MIN

MAX

0.50

0.05

CONSTRUCTIONS

0.40

0.00

0.10 C

TOP VIEW

0.15 REF

0.15

0.25

EXPOSED Cu

MOLD CMPD

1.50 BSC

1.35 BSC

0.50 BSC

DETAIL B

(A3)

0.10

0.08

0.35

---

0.65

0.55

0.15

0.85

DETAIL B

ALTERNATE

0.15 REF

SEATING

PLANE

CONSTRUCTION

SIDE VIEW

RECOMMENDED

MOUNTING FOOTPRINT

DETAIL A

0.50

PITCH

0.86

0.56

1.55

_6Xb

C A B

0.10

0.51

0.32

NOTE 3

0.05

BOTTOM VIEW

DIMENSIONS: MILLIMETERS

www.onsemi.com

EMI804x Series

PACKAGE DIMENSIONS

XDFN10 2.50x1.35, 0.5P

CASE 711AX

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSIONS b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30 MM FROM THE TERMINAL TIP.

PIN ONE

REFERENCE

0.10

MILLIMETERS

DETAIL A

DIM MIN

MAX

0.50

0.05

ALTERNATE

0.40

0.00

CONSTRUCTIONS

0.10 C

TOP VIEW

0.15 REF

0.15

0.25

2.50 BSC

1.35 BSC

0.50 BSC

0.40 0.60

--- 0.15

EXPOSED Cu

MOLD CMPD

DETAIL B

(A3)

0.10

0.08

DETAIL B

ALTERNATE

SEATING

PLANE

CONSTRUCTION

SIDE VIEW

RECOMMENDED

MOUNTING FOOTPRINT

DETAIL A

10X L

PACKAGE

0.65

0.25

OUTLINE

1.55

10X

C A B

0.10

0.47

0.50 PITCH

NOTE 3

0.05

BOTTOM VIEW

DIMENSIONS: MILLIMETERS

www.onsemi.com

EMI804x Series

PACKAGE DIMENSIONS

XDFN16 4.0x1.35, 0.5P

CASE 711AZ

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

0.10

DETAIL A

PIN ONE

REFERENCE

ALTERNATE TERMINAL

CONSTRUCTIONS

MILLIMETERS

DIM MIN

MAX

0.50

0.05

0.40

0.00

0.15 REF

0.15

4.00 BSC

0.10

TOP VIEW

EXPOSED Cu

MOLD CMPD

0.25

DETAIL B

(A3)

1.35 BSC

0.50 BSC

0.10

0.40

−−−

0.20 REF

0.60

0.15

DETAIL B

ALTERNATE

16X

0.08

CONSTRUCTION

SEATING

PLANE

SIDE VIEW

e/2

RECOMMENDED

SOLDERING FOOTPRINT*

DETAIL A

16X

0.65

0.50

PITCH

16X L

1.55

16X b

15X

0.25

0.48

0.10 C A B

DIMENSIONS: MILLIMETERS

0.05

NOTE 3

BOTTOM VIEW

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

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Phone: 011 421 33 790 2910

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◊

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SZEMI8043MUTAG [ONSEMI]

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