SZHBL5006XV2T5G [ONSEMI]
LED Electronic Shunt;
| 型号： | SZHBL5006XV2T5G |
| 厂家： | 
ONSEMI |
| 描述： | LED Electronic Shunt |
| 文件： | 总7页 (文件大小：65K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HBL5006 Series
LED Shunt
The HBL5006 Series are electronic shunts which provide a current
bypass in the case of LEDs going into open circuit. LEDs are by nature
quite fragile when subjected to transients and surge conditions. There
are also many cases where high reliability of the LED lighting must be
maintained such as in headlights, lighthouses, bridges, aircraft, runways
and so forth. In these cases the low cost addition of the shunt device will
provide full assurance that an entire string of LEDs will not extinguish
should one LED fail open. The shunt device is also applicable to other
loads where circuit continuity is required. The devices are designed to
be used with LED string currents from 50 to 350 mA.
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MARKING
DIAGRAMS
1
2
SOD−323
CASE 477
HD
M
Features
• Protection for the Following IEC Standards:
IEC 61000−4−2 (Level 4)
ISO 10605
1
2
SOD−523
CASE 502
56
• Low ESD Clamping Voltage
• Automatically Resets Itself if the LED Heals Itself or is Replaced
• ON−State Voltage Typically 1.1 V
• OFF−State Current less than 1.0 mA
2
1
SOD−923
CASE 514AB
LD M
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
XX
M
= Specific Device Code
= Date Code
• These Devices are Pb−Free and are RoHS Compliant
Typical Applications
HBL5006
• LEDs where Preventive Maintenance is Impractical
• LED Headlights in Automobiles
• Automotive LED Applications
Control
Circuit
• LEDs with High Reliability Requirements
• Crowbar Protection for Open Circuit Conditions
• Overvoltage Protection for Sensitive Circuits
ESD
1
2
+
−
HBL5006
Apply heat sinking to pin 2
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
August, 2014 − Rev. 0
HBL5006/D
HBL5006 Series
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
On−State Current, (T = 25°C) (Note 2)
SOD−323 (Note 1)
SOD−323 (Note 2)
I
250
200
mA
A
T(AVG)
SOD−523 (Note 1)
SOD−523 (Note 2)
300
250
SOD−923 (Note 1)
SOD−923 (Note 2)
350
300
Thermal Resistance, Junction−to−Air (All Packages)
SOD−323 (Note 1)
SOD−323 (Note 2)
q
435
550
°C/W
JA
SOD−523 (Note 1)
SOD−523 (Note 2)
360
435
SOD−923 (Note 1)
SOD−923 (Note 2)
285
360
Operating Temperature Range
(Note 3)
T
−40 to 150
150
°C
°C
°C
kV
J
Non−Operating Temperature Range
Lead Temperature, Soldering (10 Sec)
T
J
T
L
260
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
ESD
ESD
15
15
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2
1. Mounted onto a 2−layer, 1000 mm per layer, 3 oz Cu, FR4 PCB with pin 2 connected to the heat sink and pin 1 only connected to a signal
trace. The heat sinking must be connected to pin 2, which is the LED cathode connection.
Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open, then the
HBL shunt would now dissipate the power using the same copper heat sink. Since the shunt has a voltage that is nominally 30% of the LED,
then the power dissipation would be much lower, and easily handled by the same heat sink as the LED.
2
2. Mounted onto a 2−layer, 50 mm per layer, 1 oz Cu, FR4 PCB.
3. Max operating temperature for DC conditions is 150°C, but not to exceed 175°C for pulsed conditions with low duty cycle or non−repetitive.
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2
HBL5006 Series
ELECTRICAL CHARACTERISTICS (Unless otherwise noted: T = 25°C)
A
Symbol
V
Characteristics
Package
SOD−323
SOD−523
SOD−923
SOD−323
SOD−523
SOD−923
SOD−323
SOD−523
SOD−923
SOD−323
SOD−523
SOD−923
SOD−323
SOD−523
SOD−923
SOD−323
SOD−523
SOD−923
SOD−323
Min
6.2
6.2
6.2
Typ
7.0
7.0
7.0
25
Max
Unit
Breakdown Voltage: The minimum voltage across the device in or
V
BR
at the breakdown region. Measured at I = 1 mA.
BR
I
H
Holding Current: The minimum current required to maintain the
device in the on-state.
40
40
40
mA
mA
V
25
25
I
L
Latching Current: The minimum current required to turn from the
off-state to the on-state.
9.0
9.0
9.0
7.2
7.2
7.2
V
BO
Breakover Voltage: The voltage across the device in the breakover
region.
6.5
6.5
6.5
8.0
8.0
8.0
1.0
1.0
1.0
1.3
1.3
1.3
I
R
Off−State Current: The dc value of current that results from the
application of the off-state voltage. Measured at 3.3 V.
mA
V
V
T
On−State Voltage. Measured at 100 mA.
0.9
0.9
0.9
1.1
1.1
1.1
V
C
6.5
11.2
V
Clamping Voltage
TLP (Note 4)
IEC 6100−4−2 Level 2 equivalent
( 4 kV Contact, 4 kV Air)
SOD−523
SOD−923
6.5
11.2
I
I
= 8 A
}
}
PP
IEC 6100−4−2 Level 4 equivalent
( 8 kV Contact, 15 kV Air)
6.5
11.2
= 16 A
PP
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model TLP conditions: Z = 50 W,
0
t = 100 ns, t = 4 ns, averaging window; t = 30 ns to t = 60 ns.
p
r
1
2
Current
On−state
Current
Holding Current
Latching Current
Voltage
Off−state
Current
Breakdown
Voltage
Breakover
Voltage
Figure 1. I−V Characteristics
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3
HBL5006 Series
TYPICAL APPLICATION CIRCUIT
Typical Application Circuit for HBL5006
Current
Source
HBL5006
Control
Circuit
ESD
ESD
ESD
ESD
HBL5006
Control
Circuit
HBL5006
Control
Circuit
HBL5006
Control
Circuit
Figure 2. Typical Application Circuit
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4
HBL5006 Series
DEVICE ORDERING INFORMATION
Device
†
Marking
HD
Package
Shipping
HBL5006HT1G
SOD−323
(Pb−Free)
3000 / Tape & Reel
3000 / Tape & Reel
8000 / Tape & Reel
SZHBL5006HT1G*
HBL5006XV2T1G
HD
56
SOD−523
(Pb−Free)
SZHBL5006XV2T1G*
HBL5006P2T5G
56
LD
SOD−923
(Pb−Free)
SZHBL5006P2T5G*
LD
†For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
H
E
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
D
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF RADIUS.
1
E
b
2
MILLIMETERS
DIM MIN NOM MAX
0.80
INCHES
NOM MAX
1.00 0.031 0.035 0.040
0.10 0.000 0.002 0.004
0.006 REF
MIN
A
0.90
0.05
A1 0.00
A3
A
A3
0.15 REF
0.32
0.12 0.177 0.003 0.005 0.007
1.70
1.25
b
C
D
E
L
0.25
0.089
1.60
1.15
0.08
2.30
0.4 0.010 0.012 0.016
1.80 0.062 0.066 0.070
1.35 0.045 0.049 0.053
0.003
H
2.50
2.70 0.090 0.098 0.105
E
L
A1
C
NOTE 5
NOTE 3
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
HBL5006 Series
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
−X−
D
NOTES:
6. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
−Y−
7. CONTROLLING DIMENSION: MILLIMETERS.
8. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
E
9. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
1
2
2X b
MILLIMETERS
M
0.08
X Y
DIM
A
b
c
D
E
HE
L
MIN
0.50
0.25
0.07
1.10
0.70
1.50
NOM
0.60
0.30
0.14
1.20
MAX
0.70
0.35
0.20
1.30
0.90
1.70
TOP VIEW
0.80
1.60
A
0.30 REF
0.20
L2
0.15
0.25
c
HE
RECOMMENDED
SOLDERING FOOTPRINT*
SIDE VIEW
1.80
2X
0.48
2X
0.40
2X
L
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
2X
L2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
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6
HBL5006 Series
PACKAGE DIMENSIONS
SOD−923
CASE 514AB
ISSUE C
NOTES:
−X−
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
D
−Y−
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
E
1
2
MILLIMETERS
DIM MIN NOM MAX
INCHES
NOM MAX
2X b
MIN
0.08 X
Y
A
b
c
0.34
0.15
0.07
0.75
0.55
0.95
0.37
0.20
0.12
0.80
0.60
0.40
0.25
0.17
0.85
0.65
1.05
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
TOP VIEW
D
E
A
H
1.00
E
L
0.19 REF
0.10
L2 0.05
0.15
0.002 0.004 0.006
c
H
SOLDERING FOOTPRINT*
E
SIDE VIEW
1.20
2X
2X
0.25
0.36
2X
L
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
2X
L2
See Application Note AND8455/D for more mounting details
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
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SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
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or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
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PUBLICATION ORDERING INFORMATION
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USA/Canada
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Phone: 421 33 790 2910
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HBL5006/D
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