RS7100 [ORISTER]
Low Power 300mA CMOS LDO; 低功耗300毫安CMOS LDO
| 型号： | RS7100 |
| 厂家： | 
ORISTER CORPORATION |
| 描述： | Low Power 300mA CMOS LDO |
| 文件： | 总12页 (文件大小：1480K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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RS7100
Low Power 300mA CMOS LDO
General Description
The RS7100 is a low‐dropout linear regulator that operations in the input voltage range from +2.5V to +9.0V and delivers
300mA output current. The high‐accuracy output voltage is preset at an internally trimmed voltage 2.5V or 3.3V. Other
output voltages can be mask‐optioned from 1.5V to 5.0V with 100mV increment.
The RS7100 consists of a 1.25V bandgap reference, an error amplifier, and a P‐channel pass transistor. Other features
include short‐circuit protection and thermal shutdown protection. The RS7100 devices are available in SOT‐23 and SOT‐89
packages.
Features
Applications
● Operating Voltages Range: +2.5V to +9.0V
● Output Voltages Range: +1.5V to +5.0V with 100mV
Increment
● Maximum Output Current: 300mA
● Low Dropout: 120mV@100mA (VOUT≥2.0V)
● ±2% Output Voltage Accuracy
● Battery‐powered equipment
● Voltage regulator for microprocessor
● Voltage regulator for LAN cards
● Wireless Communication equipment
● Audio/Video equipment
● Post Regulator for Switching Power
● High Ripple Rejection: 70dB
● Output Current Limit Protection (600mA)
● Short Circuit Protection (300mA)
● Thermal Overload Shutdown Protection
● Low ESR Capacitor Compatible
● RoHS Compliant and 100% Lead (Pb)‐Free and Green
(Halogen Free with Commercial Standard)
Application Circuits
This integrated circuit can be damaged by ESD. Orister Corporation recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
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Pin Assignments
SOT‐23
SOT‐89
PACKAGE
PIN
1
SYMBOL
GND
DESCRIPTION
Ground Pin
SOT‐23
2
3
VOUT
VIN
Regulator Output Pin
Regulator Input Pin
PACKAGE
PIN
1
SYMBOL
GND
DESCRIPTION
Ground Pin
SOT‐89
2
3
VOUT
VIN
Regulator Output Pin
Regulator Input Pin
Ordering Information
DEVICE
DEVICE CODE
XX is nominal output voltage (for example, 15 = 1.5V, 33 = 3.3V, 285 = 2.85V).
Y is package designator :
N: SOT‐23
RS7100‐XX Y Z
M: SOT‐89
Z is Lead Free designator :
P: Commercial Standard, Lead (Pb) Free and Phosphorous (P) Free Package
G: Green (Halogen Free with Commercial Standard)
Block Diagram
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Absolute Maximum Ratings
Parameter
Symbol
VIN
ILIMIT
TJ
Ratings
10
600
+155
280
180
350
550
‐40 ~ +85
‐55~+150
+260
Units
V
Input Voltage VIN to GND
Output Current Limit, I(LIMIT)
Junction Temperature
mA
oC
SOT‐23
SOT‐89
SOT‐23
SOT‐89
Thermal Resistance
oC/W
mW
θJA
Power Dissipation
PD
Operating Ambient Temperature
Storage Temperature
Lead Temperature (soldering, 10sec)
TOPR
TSTG
‐
oC
oC
oC
NOTE: Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute‐maximum–rated conditions for extended periods may affect device reliability.
Electrical Characteristics (TA=25°C, unless otherwise specified)
Symbol
VIN
Parameter
Input Voltage
Conditions
Min.
2.5
Typ.
‐
Max.
9.0
Unit
V
‐
VIN=VOUT+0.48V, IOUT=1mA, VOUT≤7.0V
VIN=VOUT+0.48V, IOUT=1mA, 7.0V＜VIN≤9.0V
VOUT
Output Voltage
‐2%
VOUT
+2%
V
VIN＞VOUT +0.48V, VIN≤7.0V
VIN＞VOUT +0.48V, 7.0V<VIN≤9.0V
ΔVOUT
Output Voltage Accuracy
‐2%
VOUT
+2%
V
IMAX
ILIMIT
ISC
Output Current
Current Limit
Short Circuit Current
Ground Pin Current
‐
300
‐
‐
‐
‐
mA
A
mA
uA
‐
VOUT=0V, VIN=5V
ILOAD=0mA to 300mA, VIN=5.0V
IOUT=100mA
0.6
300
30
120
400
0.2
0.01
70
350
50
145
480
0.3
0.02
‐
‐
‐
‐
IQ
‐
‐
‐
‐
‐
‐
‐
‐
‐
VDROP
Dropout Voltage
mV
IOUT=300mA
ΔVLINE
ΔVLOAD
eN
PSRR
TSD
Line Regulation
Load Regulation
Output Noise
Ripple Rejection
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
VOUT+0.48V<VIN<9.0V, ILOAD=1mA
IOUT=0mA to 300mA
F=1Hz to 10KHz, COUT=1uF
F=1KHz, COUT=1uF
‐
%/V
%/mA
uV(rms)
dB
70
160
10
oC
THYS
‐
oC
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Typical Operating Characteristics
(CIN=1μF, COUT=3.3μF, TA=+25oC, unless otherwise noted.)
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Detail Description
The RS7100 is a low‐dropout linear regulator. The device provides preset 2.5V and 3.3V output voltages for output current up
to 300mA. Other mask options for special output voltages from 1.5V to 5.0V with 100mV increment are also available. As
illustrated in function block diagram, it consists of a 1.25V reference, error amplifier, a P‐channel pass transistor, and an
internal feedback voltage divider.
The 1.25V bandgap reference is connected to the error amplifier, which compares this reference with the feedback voltage
and amplifies the voltage difference. If the feedback voltage is lower than the reference voltage, the pass‐transistor gate is
pulled lower, which allows more current to pass to the output pin and increases the output voltage. If the feedback voltage is
too high, the pass‐transistor gate is pulled up to decrease the output voltage.
The output voltage is feedback through an internal resistive divider connected to VOUT pin. Additional blocks include with
output current limiter and shutdown logic.
Internal P‐channel Pass Transistor
The RS7100 features a P‐channel MOSFET pass transistor. Unlike similar designs using PNP pass transistors, P‐channel
MOSFETs require no base drive, which reduces quiescent current. PNP–based regulators also waste considerable current in
dropout conditions when the pass transistor saturates, and use high base‐drive currents under large loads. The RS7100 does
not suffer from these problems and consumes only 65μA (Typical) of ground pin current under heavy loads as well as in
dropout conditions.
Output Voltage Selection
The RS7100 output voltage is preset at an internally trimmed voltage 2.5V or 3.3V or can be mask optioned from 1.5V to 5.0V
with 100mV increment The first two digits of part number suffix identify the output voltage (see Ordering Information). For
example, RS7100‐33 has a preset 3.3V output voltage.
Current Limit
The RS7100 also includes a fold back current limiter. It monitors and controls the pass‐transistor’s gate voltage, estimates the
output current, and limits the output current within 600mA.
Thermal Overload Protection
Thermal overload protection limits total power dissipation in the RS7100. When the junction temperature exceeds TJ=+155°C,
a thermal sensor turns off the pass transistor, allowing the IC to cool down. The thermal sensor turns the pass transistor
active again after the junction temperature cools down by 20°C resulting in a pulsed output during continuous thermal
overload conditions.
Thermal overload protection is designed to protect the RS7100 in the event of fault conditions. For continuous operation, the
maximum operating junction temperature rating of TJ=+125°C should not be exceeded.
Operating Region and Power Dissipation
Maximum power dissipation of the RS7100 depends on the thermal resistance of the case and circuit board, the temperature
difference between the die junction and ambient air, and the rate of airflow. The power dissipation across the devices is P =
IOUT x (VIN‐VOUT). The resulting maximum power dissipation is:
(TJ − TA) (TJ − TA)
PMAX =
=
θJC + θCA
θJA
Where (TJ‐TA) is the temperature difference between the RS7100 die junction and the surrounding air, θJC is the thermal
resistance of the package chosen, and θCA is the thermal resistance through the printed circuit board, copper traces and
other materials to the surrounding air. For better heat‐sinking, the copper area should be equally shared between the VIN,
VOUT, and GND pins.
If the RS7100 uses a SOT‐89 package and this package is mounted on a double sided printed circuit board with two square
inches of copper allocated for “heat spreading”, the resulting θJA is 180°C/W.
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Based on a maximum operating junction temperature 125°C with an ambient of 25°C, the maximum power dissipation will be:
(TJ −TA) (125−25)
PMAX =
=
= 0.555W
θJC +θCA
180
Thermal characteristics were measured using a double‐side board with 1”x 2” square inches of copper area connected to the
GND pin for “heat spreading”.
Dropout Voltage
A regulator’s minimum input‐output voltage differential, or dropout voltage, determines the lowest usable supply voltage. In
battery‐powered systems, this will determine the useful end‐of‐life battery voltage. The RS7100 uses a P‐channel MOSFET
pass transistor, its dropout voltage is a function of drain‐to‐source on‐resistance (RDS(ON)) multiplied by the load current.
VDROPOUT = VIN − VOUT =RDS(ON)×IOUT
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SOT‐23 Dimension
NOTES:
A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
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SOT‐89 Dimension
NOTES:
A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. The center lead is in electrical contact with the tab.
D. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
E. Thermal pad contour optional within these dimensions.
F. Falls within JEDEC TO‐243 variation AA, except minimum lead length, pin 2 minimum lead width, minimum tab width.
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Soldering Methods for Orister’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface‐mount devices
Figure 1: Temperature profile
t
P
Critical Zone
to T
TP
T
L
P
Ramp-up
TL
t
L
Tsmax
Tsmin
t
S
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Average ramp‐up rate (TL to TP)
Preheat
Sn‐Pb Eutectic Assembly
Pb‐Free Assembly
<3oC/sec
<3oC/sec
‐ Temperature Min (Tsmin
)
100oC
150oC
150oC
200oC
‐ Temperature Max (Tsmax
‐ Time (min to max) (ts)
Tsmax to TL
)
60~120 sec
60~180 sec
‐ Ramp‐up Rate
<3oC/sec
<3oC/sec
Time maintained above:
‐ Temperature (TL)
‐ Time (tL)
183oC
217oC
60~150 sec
240oC +0/‐5oC
60~150 sec
260oC +0/‐5oC
Peak Temperature (TP)
Time within 5oC of actual Peak
10~30 sec
20~40 sec
Temperature (tP)
Ramp‐down Rate
Time 25oC to Peak Temperature
<6oC/sec
<6oC/sec
<6 minutes
<8 minutes
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Peak temperature
245oC ±5oC
260oC +0/‐5oC
Dipping time
5sec ±1sec
5sec ±1sec
Pb‐Free devices.
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Important Notice:
© Orister Corporation
Orister cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an Orister product.
No circuit patent licenses, copyrights, mask work rights, or other intellectual property rights are implied.
Orister reserves the right to make changes to their products or specifications or to discontinue any product or service
without notice. Except as provided in Orister’s terms and conditions of sale, Orister assumes no liability whatsoever, and
Orister disclaims any express or implied warranty relating to the sale and/or use of Orister products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. In order to minimize risks associated with the customer’s applications, adequate design and
operating safeguards must be provided by the customer to minimize inherent or procedural hazards. Testing and other
quality control techniques are utilized to the extent Orister deems necessary to support this warranty. Specific testing of
all parameters of each device is not necessarily performed.
Orister and the Orister logo are trademarks of Orister Corporation. All other brand and product names appearing in this
document are registered trademarks or trademarks of their respective holders.
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