RS7302-33NLFNEP [ORISTER]

600mA Adjustable & Fixed Voltage LDO Linear Regulator with Enable, Fast Discharge & Soft.Start; 600毫安可调及固定电压LDO线性稳压器,带有使能,快速放电和Soft.Start
RS7302-33NLFNEP
型号: RS7302-33NLFNEP
厂家: ORISTER CORPORATION    ORISTER CORPORATION
描述:

600mA Adjustable & Fixed Voltage LDO Linear Regulator with Enable, Fast Discharge & Soft.Start
600毫安可调及固定电压LDO线性稳压器,带有使能,快速放电和Soft.Start

稳压器
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RS7302  
600mA Adjustable & Fixed Voltage LDO Linear Regulator with Enable, Fast Discharge & SoftStart  
General Description  
The RS7302 series is a lowdropout linear regulator with ON/OFF control that operates in the input voltage range from  
+2.4V to +7.0V and delivers 600mA output current.  
The RS7302 is available fixed output voltage type is preset at an internally trimmed voltage 1.8V, 2.5V, or 3.3V. Other  
options 1.0V, 1.2V,1.5V, 2.85V, 3.0V and 3.6V are available by special order only.  
The RS7302 series consists of a 0.95V bandgap reference, an error amplifier, and a Pchannel pass transistor. Other  
features include softstart function, shortcircuit protection and thermal shutdown protection. The RS7302 series devices  
are available in SOT25, SC705 & SOP8 packages.  
Features  
Applications  
Operating Voltage Range+2.4V to +7.0V  
Output Voltages+1.0V to +5.0V (0.1V Step), +1.25V to  
+5.0V  
Dropout Voltage500mV@600mA (Fixed)  
Fast Response in Poweron35uS  
Low Current Consumption60μA (Typ.)  
Low ESR Capacitor Compatible  
High Ripple Rejection65dB (Typ.)  
Short Circuit Protection200mA (Typ.)  
Thermal Overload Shutdown Protection  
SOT25, SC705 and SOP8 packages  
RoHS Compliant and 100% Lead (Pb)Free and Green  
(Halogen Free with Commercial Standard)  
BatteryPowered Equipments  
Graphic Card, Peripheral Card  
PCMCIA & New Card  
Mini PCI & PCIExpress Cards  
Digital Still Camera  
CDMA/GSM Cellular Handsets  
Laptop, Palmtops, Notebook Computers  
Portable Information Application  
Application Circuits  
SoftStart Function  
This integrated circuit can be damaged by ESD. Orister Corporation recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
DSRS730202 September, 2009  
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Page No. : 2/11  
Pin Assignments  
SOT25  
SC705  
SOP8  
PACKAGE  
PIN  
1
2
SYMBOL  
VIN  
GND  
EN  
DESCRIPTION  
Regulator Input Pin  
Ground Pin or ADJ Pin  
Enable Pin  
SOT25  
3
4
SS  
SoftStart Pin  
5
VOUT  
Regulator Output Pin  
PACKAGE  
PIN  
1
2
SYMBOL  
VIN  
GND  
EN  
DESCRIPTION  
Regulator Input Pin  
Ground Pin or ADJ Pin  
Enable Pin  
SC705  
3
4
SS  
SoftStart Pin  
5
VOUT  
Regulator Output Pin  
PACKAGE  
PIN  
1
SYMBOL  
EN  
DESCRIPTION  
Enable Pin  
2
3
4
VIN  
VOUT  
SS  
Regulator Input Pin  
Regulator Output Pin  
SoftStart Pin  
SOP8  
5, 6, 7, 8  
GND  
Ground Pin or ADJ Pin  
Ordering Information  
DEVICE  
DEVICE CODE  
XX is nominal output voltage (for example, AD=ADJ, 18 = 1.8V, 33 = 3.3V, 285 = 2.85V).  
EEE is CE Input Logic & Discharge Function Selection : (see CE & Discharge Function Selection  
Table)  
YY is package designator :  
NE : SOT25  
SC : SC705  
RS7302XX EEE YY Z  
S : SOP8  
Z is Lead Free designator :  
P: Commercial Standard, Lead (Pb) Free and Phosphorous (P) Free Package  
G: Green (Halogen Free with Commercial Standard)  
DSRS730202 September, 2009  
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Page No. : 3/11  
CE & Discharge Function Selection Table  
EEE  
CODE  
NHF  
NLF  
NHN  
NLN  
UHF  
ULF  
EN Type  
EEE  
CODE  
UHN  
ULN  
DHF  
DLF  
EN Type  
Discharge  
Discharge  
Type 1  
None  
None  
None  
None  
Type 2  
Type 1  
Pull High  
Pull High  
Pull Low  
Pull Low  
Pull Low  
Pull Low  
Type 2  
High Active  
Low Active  
High Active  
Low Active  
High Active  
Low Active  
Fast  
Fast  
Normal  
Normal  
Fast  
High Active  
Low Active  
High Active  
Low Active  
High Active  
Low Active  
Normal  
Normal  
Fast  
Fast  
Normal  
Normal  
Pull High  
Pull High  
DHN  
DLN  
Fast  
Block Diagram  
Absolute Maximum Ratings  
Parameter  
Symbol  
Ratings  
9.0  
1.0  
+155  
155  
333  
Units  
V
Input Voltage VIN to GND  
Output Current Limit, I(LIMIT)  
Junction Temperature  
VIN  
ILIMIT  
TJ  
A
oC  
SOT25  
SC705  
SOP8  
Thermal Resistance  
oC/W  
θJA  
60  
SOT25  
SC705  
SOP8  
350  
250  
1670  
40 ~ +85  
55~+150  
+260  
Power Dissipation  
PD  
mW  
Operating Ambient Temperature  
Storage Temperature  
Lead Temperature (soldering, 10sec)  
NOTES  
TOPR  
TSTG  
oC  
oC  
oC  
1
The power dissipation values are based on the condition that junction temperature TJ and ambient temperature TA difference is  
100°C.  
2
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress  
ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended  
operating conditions” is not implied. Exposure to absolutemaximum –rated conditions for extended periods may affect device  
reliability.  
DSRS730202 September, 2009  
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Electrical Characteristics (TA=25°C, VIN=5.0V unless otherwise specified)  
Symbol  
VIN  
Parameter  
Input Voltage  
Conditions  
Min. Typ. Max.  
Unit  
V
2.4  
7.0  
2%  
+2%  
V
VIN=VOUT+1.0V, IOUT=1mA, VOUT1.8V  
VIN=VOUT+1.0V, IOUT=1mA, VOUT1.8V, VIN  
2.4V  
VIN=VOUT+1.2V, IOUT=1mA, VOUT1.8V  
VIN=VOUT+1.2V, IOUT=1mA, VOUT1.8V, VIN  
2.4V  
Fixed  
Type  
35  
2%  
50  
+35  
+2%  
+50  
mV  
V
VOUT  
Output Voltage  
VOUT  
ADJ  
Type  
mV  
mA  
mV  
%/V  
IMAX  
Output Current (see NOTE)  
Dropout Voltage  
600  
100  
500  
0.2  
0.01  
60  
0.7  
250  
65  
40  
VOUT+1.0VVIN7.0V, VOUT2.4V  
IOUT=100mA, VOUT>3.0V  
IOUT=600mA, VOUT>3.0V  
VDROP  
ΔVLINE  
ΔVLOAD  
IQ  
ISD  
ISC  
Line Regulation  
Load Regulation  
Ground Pin Current  
Shutdown Current  
Short Circuit Current  
Ripple Rejection  
0.3  
VOUT+1.0VVIN7V, IOUT=1mA  
VIN=VOUT+1V, 1mAIOUT100mA  
ILOAD=0mA to 1.0A, VIN=VOUT+1.0V  
VIN=VOUT+1V, EN=0V, No Load  
IOUT=30mA, F=1KHz, COUT=3.3uF  
IOUT=100mA , F=1KHz, COUT=3.3uF  
VIN5.0V  
0.02 %/mA  
uA  
uA  
mA  
dB  
uV(rms)  
V
PSRR  
eN  
Output Noise  
VIH  
VIL  
RDIS  
TDIS  
TSS  
EN Pin Input Voltage “H”  
EN Pin Input Voltage “L”  
Discharge Resistor  
Discharge Time  
1.6  
VIN5.0V  
0.3  
100  
100  
V
Ω
us  
ms  
VEN=0V, For Fixed Voltage Type  
VOUT=3.3V to 0V, COUT=1uF, For Fixed Voltage Type  
VOUT=3.3V, CSS=47nF, CIN=COUT=1uF  
30  
70  
10  
SoftStart Time  
Thermal Shutdown  
Temperature  
Thermal Shutdown Hysteresis  
TSD  
150  
20  
oC  
oC  
THYS  
NOTEMeasured using a double sided board with 1” x 2” square inches of copper area connected to the GND pins for “heat spreading”.  
DSRS730202 September, 2009  
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Page No. : 5/11  
Detail Description  
The RS7302 is a lowdropout linear regulator. The device provides preset 1.8V, 2.5V and 3.3V output voltages for output  
current up to 600mA. Other mask options for special output voltages are also available. As illustrated in function block  
diagram, it consists of a 0.95V bandgap reference, an error amplifier, a Pchannel pass transistor and an internal feedback  
voltage divider.  
The 0.95V bandgap reference is connected to the error amplifier, which compares this reference with the feedback voltage  
and amplifies the voltage difference. If the feedback voltage is lower than the reference voltage, the passtransistor gate is  
pulled lower, which allows more current to pass to the output pin and increases the output voltage. If the feedback voltage is  
too high, the pass transistor gate is pulled up to decrease the output voltage.  
The output voltage is feedback through an internal resistive divider connected to VOUT pin. Additional blocks include an  
output current limiter, thermal sensor, and shutdown logic.  
Internal Pchannel Pass Transistor  
The RS7302 features a Pchannel MOSFET pass transistor. Unlike similar designs using PNP pass transistors, Pchannel  
MOSFETs require no base drive, which reduces quiescent current. PNPbased regulators also waste considerable current in  
dropout when the pass transistor saturates, and use high basedrive currents under large loads. The RS7302 does not suffer  
from these problems and consumes only 60μA (Typ.) of current consumption under heavy loads as well as in dropout  
conditions.  
Enable Function  
EN pin starts and stops the regulator. When the EN pin is switched to the power off level, the operation of all internal circuit  
stops, the buildin Pchannel MOSFET output transistor between pins VIN and VOUT is switched off, allowing current  
consumption to be drastically reduced. The VOUT pin enters the GND level through the internal discharge path between VOUT  
and GND pins.  
Soft Start Function  
The capacitor can be connected between the BYPASS pin and GND. This capacitor can be a low cost Polyester Film variety. A  
larger capacitor improves the AC ripple rejection, but also makes the output come up slowly. This "Soft" turnon is desirable  
in some applications to limit turnon surges.  
Fast Discharge Function  
The RS7302 fixed type has fast discharge Function on EN pin disable. When user turns off the device, its internal pulllow  
resistor will discharge output capacitor charge. It’ll avoid other device to arise wrong motions.  
Output Voltage Selection  
For fixed voltage type of RS7302, the output voltage is preset at an internally trimmed voltage. The first two digits of part  
number suffix identify the output voltage (see Ordering Information). For example, the RS730233 has a preset 3.3V output  
voltage.  
Current Limit  
The RS7302 also includes a fold back current limiter. It monitors and controls the pass transistor’s gate voltage, estimates the  
output current, and limits the output current within 1.0A (Typ.)  
Thermal Overload Protection  
Thermal overload protection limits total power dissipation in the RS7302. When the junction temperature exceeds TJ=+165°C,  
a thermal sensor turns off the pass transistor, allowing the IC to cool down. The thermal sensor turns the pass transistor on  
again after the junction temperature cools down by 20°C, resulting in a pulsed output during continuous thermal overload  
conditions.  
Thermal overload protection is designed to protect the RS7302 in the event of fault conditions. For continuous operation, the  
absolute maximum operating junction temperature rating of TJ=+125°C should not be exceeded.  
DSRS730202 September, 2009  
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Operating Region and Power Dissipation  
Maximum power dissipation of the RS7302 depends on the thermal resistance of the case and circuit board, the temperature  
difference between the die junction and ambient air, and the rate of airflow. The power dissipation across the devices is  
P=IOUT x (VINVOUT). The resulting maximum power dissipation is:  
(TJ TA) (TJ TA)  
PMAX =  
=
θJC + θCA  
θJA  
Where (TJTA) is the temperature difference between the RS7301 die junction and the surrounding air, θJC is the thermal  
resistance of the package chosen, and θCA is the thermal resistance through the printed circuit board, copper traces and  
other materials to the surrounding air. For better heatsinking, the copper area should be equally shared between the VIN,  
VOUT, and GND pins.  
Dropout Voltage  
A regulator’s minimum inputoutput voltage differential, or dropout voltage, determines the lowest usable supply voltage. In  
batterypowered systems, this will determine the useful endoflife battery voltage. The RS7302 use a Pchannel MOSFET  
pass transistor, its dropout voltage is a function of draintosource onresistance RDS(ON) multiplied by the load current.  
VDROPOUT =VIN VOUT = RDS (ON ) × IOUT  
DSRS730202 September, 2009  
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SOT25 Dimension  
NOTES:  
A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion.  
D. Falls within JEDEC MO193 variation AB (5 pin).  
DSRS730202 September, 2009  
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Page No. : 8/11  
SC705 Dimension  
NOTES:  
A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.  
D. Falls within JEDEC MO203 variation AA.  
DSRS730202 September, 2009  
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SOP8 Dimension  
NOTES:  
A. All linear dimensions are in millimeters (inches).  
B. This drawing is subject to change without notice.  
C. Body length does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not  
exceed 0.006 (0.15) per end.  
D. Body width does not include interlead flash. Interlead flash shall not exceed 0.017 (0.43) per side.  
E. Falls within JEDEC MS012 variation AA.  
DSRS730202 September, 2009  
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Page No. : 10/11  
Soldering Methods for Orister’s Products  
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%  
2. Reflow soldering of surfacemount devices  
Figure 1: Temperature profile  
t
P
Critical Zone  
to T  
TP  
T
L
P
Ramp-up  
TL  
t
L
Tsmax  
Tsmin  
t
S
Preheat  
Ramp-down  
25  
t 25oC to Peak  
Time  
Profile Feature  
Average rampup rate (TL to TP)  
Preheat  
SnPb Eutectic Assembly  
PbFree Assembly  
<3oC/sec  
<3oC/sec  
Temperature Min (Tsmin  
)
100oC  
150oC  
150oC  
200oC  
Temperature Max (Tsmax  
Time (min to max) (ts)  
Tsmax to TL  
)
60~120 sec  
60~180 sec  
Rampup Rate  
<3oC/sec  
<3oC/sec  
Time maintained above:  
Temperature (TL)  
Time (tL)  
183oC  
217oC  
60~150 sec  
240oC +0/5oC  
60~150 sec  
260oC +0/5oC  
Peak Temperature (TP)  
Time within 5oC of actual Peak  
10~30 sec  
20~40 sec  
Temperature (tP)  
Rampdown Rate  
Time 25oC to Peak Temperature  
<6oC/sec  
<6oC/sec  
<6 minutes  
<8 minutes  
3. Flow (wave) soldering (solder dipping)  
Products  
Pb devices.  
Peak temperature  
245oC ±5oC  
260oC +0/5oC  
Dipping time  
5sec ±1sec  
5sec ±1sec  
PbFree devices.  
DSRS730202 September, 2009  
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Page No. : 11/11  
Important Notice:  
© Orister Corporation  
Orister cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an Orister product.  
No circuit patent licenses, copyrights, mask work rights, or other intellectual property rights are implied.  
Orister reserves the right to make changes to their products or specifications or to discontinue any product or service  
without notice. Except as provided in Orister’s terms and conditions of sale, Orister assumes no liability whatsoever, and  
Orister disclaims any express or implied warranty relating to the sale and/or use of Orister products including liability or  
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other  
intellectual property right. In order to minimize risks associated with the customer’s applications, adequate design and  
operating safeguards must be provided by the customer to minimize inherent or procedural hazards. Testing and other  
quality control techniques are utilized to the extent Orister deems necessary to support this warranty. Specific testing of  
all parameters of each device is not necessarily performed.  
Orister and the Orister logo are trademarks of Orister Corporation. All other brand and product names appearing in this  
document are registered trademarks or trademarks of their respective holders.  
DSRS730202 September, 2009  
www.Orister.com  

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