SFH-4247_技术文档

2017-01-23

Infrared Emitter (940 nm)

Version 1.5 / acc. to OS-PCN-2016-018-A

SFH 4247

Features:

•

Wavelength 950nm

Short switching times

The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification

for Automotive Grade Discrete Semiconductors.

Applications

•

Infrared Illumination for cameras

IR data transmission

Sensor technology

Notes

Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which

can be hazardous to the human eye. Products which incorporate these devices have to follow the safety

precautions given in IEC 60825-1 and IEC 62471.

Ordering Information

Type:

Radiant Intensity

I_e[mW/sr]

Ordering Code

I_F= 70 mA, t_p= 20 ms

12 (≥ 6.3)

SFH 4247

Q65110A8091

Note:

Measured at a solid angle of Ω = 0.01 sr

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SFH 4247

Maximum Ratings (T_A= 25 °C)

Parameter

Symbol

Values

Unit

°C

V

Operation and storage temperature range

Reverse voltage

T_op; T_stg

V_R

-40 ... 100

5

70

1

Forward current

I_F

mA

A

Surge current

(t_p≤ 200 µs, D = 0)

I_FSM

Power consumption

P_tot

140

2

mW

kV

ESD withstand voltage

V_ESD

(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)

Thermal resistance junction - ambient ^{1) page 12}

R_thJA

R_thJS

390

220

K / W

Thermal resistance junction - soldering point

2) page 12

Characteristics (T_A= 25 °C)

Parameter

Symbol

Values

Unit

Peak wavelength

(typ)

λ_peak

λ_centroid

∆λ

950

nm

(I_F= 70 mA, t_p= 20 ms)

Centroid wavelength

(I_F= 70 mA, t_p= 20 ms)

940

42

nm

°

Spectral bandwidth at 50% of I_max

(I_F= 70 mA, t_p= 20 ms)

Half angle

(typ)

ϕ

± 65

Dimensions of active chip area

L x W

0.3 x 0.3

mm x

mm

Rise and fall time of I_e( 10% and 90% of I_{e max}

)

(typ)

t_r, t_f

12

ns

(I_F= 70 mA, R_L= 50 Ω)

Forward voltage

(typ (max)) V_F

I_R

1.5 (≤ 1.9)

3.6 (≤ 4.6)

V

(I_F= 70 mA, t_p= 20 ms)

Forward voltage

(I_F= 1 A, t_p= 100 µs)

V

Reverse current

(V_R= 5 V)

not designed for ꢀA

reverse operation

Total radiant flux

(I_F= 70 mA, t_p= 20 ms)

(typ)

Φ_e

40

mW

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SFH 4247

Parameter

Symbol

Values

Unit

Temperature coefficient of I_eor Φ_e

(I_F= 70 mA, t_p= 20 ms)

(typ)

TC_I

-0.3

% / K

Temperature coefficient of V_F

(I_F= 70 mA, t_p= 20 ms)

(typ)

TC_V

TC_λ

-0.8

0.3

mV / K

nm / K

Temperature coefficient of wavelength

(I_F= 70 mA, t_p= 20 ms)

Grouping (T_A= 25 °C)

Group

Min Radiant Intensity

Max Radiant Intensity Typ Radiant Intensity

I_F= 70 mA, t_p= 20 ms

I_F= 500 mA, t_p= 25 µs

I_{e, min}[mW / sr]

I_{e, max}[mW / sr]

I_{e, typ}[mW / sr]

SFH 4247-Q

SFH 4247-R

SFH 4247-S

6.3

10

16

12.5

20

47

75

32

120

Note:

measured at a solid angle of Ω = 0.01 sr

Only one group in one packing unit (variation lower 2:1).

Relative Spectral Emission ^{3) page 12}

Radiant Intensity ^{3) page 12}

I_rel= f(λ), T_A= 25°C

I_e/ I_e(70 mA) = f(I_F), single pulse, t_p= 100 µs,

T_A= 25°C

OHF04134

100

%

OHF05702

10¹

I_rel

Ι_e

Ι_e(70 mA)

80

60

40

20

0

10⁰

10^-1

10^-2

10^-3

800

850

900

950

nm 1025

λ

10⁰

10¹

10²mA 10³

I_F

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SFH 4247

Forward Current ^{3) page 12}

I_F= f(V_F), single pulse, t_p= 100 µs, T_A= 25°C

Max. Permissible Forward Current

IF = f (TA), RthJA = 390 K/W

OHF05642

10³

80

[ ]

mA

I_F

60

40

20

0

10²

10¹

10⁰

0

20

40

60

80

100

]

0

1

2

3

V 4

[

V_F

Permissible Pulse Handling Capability

I_F= f(t_p), T_A= 25 °C, duty cycle D = parameter

Permissible Pulse Handling Capability

I_F= f (τ), T_A= 85 °C, duty cycle D = parameter

[ ]

1,0

0,8

: D = 1

: D = 0,5

0,6

: D = 0,2

: D =0,2

: D = 0,1

: D = 0,05

: D = 0,02

: D =0,1

: D =0,05

: D =0,02

: D = 0,01

: D =0,01

0,4

: D = 0,005

: D =0,005

0,2

0,0

10^-510^-410^-30,01 0,1

1

10 100

[ ]

10^-510^-410^-30,01 0,1

1

10 100

[ ]

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SFH 4247

Radiation Characteristics ^{3) page 12}

I_rel= f(ϕ), T_A= 25°C

OHL00869

40˚

30˚

20˚

10˚

0˚

1.0

ϕ

50˚

0.8

0.6

0.4

0.2

0

60˚

70˚

80˚

90˚

100˚

1.0

0.8

0.6

0.4

0˚

20˚

40˚

60˚

80˚

100˚

120˚

Package Outline

1.4 (0.055)

1.2 (0.047)

1.0 (0.039)

0.8 (0.031)

0.15 (0.006)

0.05 (0.002)

Light emitting area

typ. 1.5 (0.059) x 1.0 (0.039)

0.8 (0.031) ^{+0.05 (0.002)}

1.0 (0.039)

Anode marking

Anode

marking

1.5 (0.059)

1.3 (0.051)

GPLY6070

Dimensions in mm (inch).

Package

Mini TOPLED

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SFH 4247

Approximate Weight:

7.3 mg

Recommended Solder Pad

Dimensions in mm (inch).

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SFH 4247

Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E

OHA04525

300

˚C

T

250

T

245 ˚C

p

240 ˚C

t_P

t_L

217 ˚C

200

150

t_S

100

50

25 ˚C

0

50

100

150

200

250

s

300

t

OHA04612

Pb-Free (SnAgCu) Assembly

Profile Feature

Profil-Charakteristik

Symbol

Unit

Einheit

Minimum

Recommendation

Maximum

Ramp-up rate to preheat*⁾

25 °C to 150 °C

2

3

K/s

Time t_S

T_Sminto T_Smax

t_S

60

100

2

120

3

s

Ramp-up rate to peak*⁾

K/s

T_Smaxto T_P

T_L

t_L

Liquidus temperature

217

80

°C

s

Time above liquidus temperature

Peak temperature

100

T_P

t_P

245

20

260

30

°C

s

Time within 5 °C of the specified peak

temperature T_P- 5 K

10

3

6

K/s

s

Ramp-down rate*

T_Pto 100 °C

480

Time

25 °C to T_P

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

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SFH 4247

Taping

4 (0.157)

Cathode/Collector Side

2 (0.079)

1.5 (0.059)

1.55 (0.061)

4 (0.157)

OHAY0225

Dimensions in mm (inch).

Tape and Reel

8 mm tape with 3000 pcs. on ∅ 180 mm reel, 12000 pcs. on ∅ 330 mm reel

W₁

D₀

P₀

P₂

Label

P₁

Direction of unreeling

W₂

Leader: min0 4±± mm *

Trailer: min0 16± mm *

*) Dimensions acc0 to IEC 6±.86-3; EIA 481-D

OHAY0324

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SFH 4247

Tape dimensions [mm]

Tape dimensions in mm

W

E

F

P₀

P₁

P₂

D₀

8 + 0.3 / -0.1 4 ± 0.1

2 ± 0.05

or

4 ± 0.1

2 ± 0.05

1.5 ± 0.1

1.75 ± 0.1

3.5 ± 0.05

Reel dimensions [mm]

Reel dimensions in mm

A

W

N_min

W₁

W_2max

180

8

60

8.4 + 2

14.4

Reel dimensions in mm

A

W

N_min

W₁

W_2max

330

8

60

8.4 + 2

14.4

Barcode-Product-Label (BPL)

OSRAM Opto

BIN1: XX-XX-X-XXX-X

LX XXXX

Semiconductors

RoHS Compliant

(6P) BATCH NO: 1234567890

(1T) LOT NO: 1234567890

ML Temp ST

XXX °C X

X

(9D) D/C: 1234

Pack: RXX

DEMY XXX

X_X123_1234.1234 X

(X) PROD NO: 123456789(Q)QTY: 9999 (G) GROUP: XX-XX-X-X

OHA04563

Dry Packing Process and Materials

Moisture-sensitive label or print

Barcode label

OSRAM

Humidity indicator

Barcode label

D o n o t e a t .

A v o i d m e t a l c o n t a c t .

D i s c a r d i f c i r c l e s o v e r r u n .

b a g o p e n i n g .

P l e a s e c h e c k t h e H I C i m m i d i a t e l y a f t e r

c h e c k d o t

C o m p a r a t o r

W E T

b a k e u n i t s

e x a m i n e u n i t s , i f n e c e s s a r y

1 5 %

I f w e t ,

b a k e u n i t s

e x a m i n e u n i t s , i f n e c e s s a r y

1 0 %

I f w e t ,

c h a n g e d e s i c c a n t

p a r t s s t i l l a d e q a t e l y d r y .

I f w e t ,

u

5 %

M I L - I - 8 8 3 5

H u m i d i t y I n d i c a t o r

OSRAM

Desiccant

OHA00539

Note:

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.

Regarding dry pack you will find further information in the internet. Here you will also find the normative

2017-01-23

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SFH 4247

references like JEDEC.

Transportation Packing and Materials

Barcode label

Bin1: P-1-20

Bin2: Q-1-20

Bin3:

Temp ST

220

240 C R

260

C

R

DEMY

R18

ML

2

C

RT

LSY T676

Multi TOPLED

2a

3

Additional TEXT

R077

PACKVAR:

P-1+Q-1

(G) GROUP:

0144

(9D) D/C:

210021998

2000

OSRAM Opto

Semiconductors

(Q)QTY:

123GH1234

(6P) BATCH NO:

5

2

4

1

0

1

(1T) LOT NO:

1

(X) PROD NO:

Bin1: P-1-20

Bin2: Q-1-20

Bin3:

Temp ST

220

240 C R

260

C

R

DEMY

R18

ML

2

C

RT

LSY T676

Multi TOPLED

2a

3

Additional TEXT

R077

PACKVAR:

P-1+Q-1

(G) GROUP:

0144

(9D) D/C:

210021998

2000

OSRAM Opto

Semiconductors

(Q)QTY:

123GH1234

(6P) BATCH NO:

5

2

4

1

0

1

(1T) LOT NO:

1

OSRAM

(X) PROD NO:

Packing

Sealing label

OHA02044

Dimensions of transportation box in mm

Width

Length

Height

200 ± 5

352 ± 5

195 ± 5

352 ± 5

30 ± 5

33 ± 5

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SFH 4247

Disclaimer

Language english will prevail in case of any discrepancies or deviations between the two language wordings.

Attention please!

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances.

For information on the types in question please contact our Sales Organization.

If printed or downloaded, please find the latest version in the Internet.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any

costs incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose!

Critical components* may only be used in life-support devices** or systems with the express written approval of

OSRAM OS.

*) A critical component is a component used in a life-support device or system whose failure can reasonably be

expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that

device or system.

**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or

maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be

endangered.

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SFH 4247

Glossary

1)

Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 16 mm²each

2)

Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block)

3)

Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or

calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily

correspond to the actual parameters of each single product, which could differ from the typical data and calculated

correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data

will be changed without any further notice.

2017-01-23

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SFH 4247

Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg

2017-01-23

13


型号：	SFH-4247
厂家：	OSRAM GMBH
描述：	Infrared Emitter
文件：	总13页 (文件大小：369K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SFH-4247 [OSRAM]

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