SFH-4258S [OSRAM]
High Power Infrared Emitter;
| 型号： | SFH-4258S |
| 厂家： | 
OSRAM GMBH |
| 描述： | High Power Infrared Emitter |
| 文件： | 总13页 (文件大小：448K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2016-03-07
High Power Infrared Emitter (850 nm)
Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Features:
•
•
•
•
•
High Power Infrared LED
Double Stack emitter
Half angle: ± 15°
High forward current allowed at high temperature
The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification
for Automotive Grade Discrete Semiconductors.
Applications
•
•
•
•
•
Industrial applications
Infrared Illumination for cameras
IR data transmission
Sensor technology
Automotive technology
Notes
Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which
can be hazardous to the human eye. Products which incorporate these devices have to follow the safety
precautions given in IEC 60825-1 and IEC 62471.
Ordering Information
Type:
Radiant Intensity
Ie [mW/sr]
Ordering Code
IF=100 mA, tp=20 ms
185 (≥ 80)
SFH 4258S
Q65111A1158
Note:
Measured at a solid angle of Ω = 0.01 sr
2016-03-07
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Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Maximum Ratings (TA = 25 °C)
Parameter
Symbol
Values
Unit
°C
V
Operation and storage temperature range
Reverse voltage
Top; Tstg
VR
-40 ... 100
5
Forward current
IF
100
0.7
mA
A
Surge current
(tp ≤ 300 µs, D = 0)
IFSM
Power consumption
Ptot
245
2
mW
kV
ESD withstand voltage
VESD
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
Thermal resistance junction - ambient 1) page 12
RthJA
RthJS
300
140
K / W
K / W
Thermal resistance junction - soldering point
2) page 12
Characteristics (TA = 25 °C)
Parameter
Symbol
Values
Unit
Peak wavelength
(typ)
(typ)
(typ)
λpeak
λcentroid
∆λ
860
nm
(IF = 100 mA, tp = 20 ms)
Centroid wavelength
(IF = 100 mA, tp = 20 ms)
850
30
nm
nm
°
Spectral bandwidth at 50% of Imax
(IF = 100 mA, tp = 20 ms)
Half angle
(typ)
(typ)
ϕ
± 15
Dimensions of active chip area
L x W
0.3 x 0.3
mm x
mm
Rise and fall time of Ie ( 10% and 90% of Ie max
)
(typ)
tr, tf
15
ns
(IF = 100 mA, RL = 50 Ω)
Forward voltage
(typ (max)) VF
(typ (max)) VF
IR
3.1 (≤ 3.6)
4 (≤ 5.2)
V
(IF = 100 mA, tp = 20 ms)
Forward voltage
(IF = 700 mA, tp = 100 µs)
V
Reverse current
(VR = 5 V)
not designed for ꢀA
reverse operation
Total radiant flux
(IF= 100 mA, tp=20 ms)
(typ)
Φe
115
mW
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Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Parameter
Symbol
Values
Unit
Temperature coefficient of Ie or Φe
(IF = 100 mA, tp = 20 ms)
(typ)
TCI
-0.5
% / K
Temperature coefficient of VF
(IF = 100 mA, tp = 20 ms)
(typ)
(typ)
TCV
TCλ
-2
mV / K
nm / K
Temperature coefficient of wavelength
(IF = 100 mA, tp = 20 ms)
0.3
Grouping (TA = 25 °C)
Group
Min Radiant Intensity
Max Radiant Intensity Typ Radiant Intensity
IF=100 mA, tp=20 ms
IF=100 mA, tp=20 ms
IF = 700 mA, tp = 25 µs
Ie, min [mW / sr]
Ie, max [mW / sr]
Ie, typ [mW / sr]
540
SFH 4258S-V2
SFH 4258S-AW
SFH 4258S-BW
SFH 4258S-CW1
80
125
200
320
400
100
160
250
795
1270
1720
Note:
measured at a solid angle of Ω = 0.01 sr
Only one group in one packing unit (variation lower 2:1).
2016-03-07
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Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Relative Spectral Emission 3) page 12
Radiant Intensity 3) page 12
Irel = f(λ), TA = 25°C
Ie / Ie(100 mA) = f(IF), single pulse, tp = 25 µs,
TA= 25°C
OHF04132
100
OHF05698
101
%
Irel
Ιe
Ιe (100 mA)
80
60
40
20
0
100
10-1
10-2
10-3
700
750
800
850
nm 950
λ
100
101
102 mA 103
IF
Forward Current 3) page 12
IF = f(VF), single pulse, tp = 100 µs, TA= 25°C
Max. Permissible Forward Current
IF, max = f(TA), RthJA = 300 K / W, RthJS = 140 K / W
OHF05696
OHF05562
103
120
mA
mA
IF
IF
100
80
102
101
100
RthJA
RthJS
60
40
20
0
0
20
40
60
80 ˚C 100
2
3
4
V
5
TA, TS
VF
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Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Permissible Pulse Handling Capability
IF = f(tp), TA = 25 °C, duty cycle D = parameter
Permissible Pulse Handling Capability
IF = f(tp), TA = 85 °C, duty cycle D = parameter
OHF04491
OHF05697
0.8
A
0.75
tP
tP
A
tP
tP
IF
IF
IF
IF
D
D
= T
= T
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
T
T
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
D
=
D
=
0.005
0.01
0.02
0.05
0.1
0.005
0.01
0.02
0.05
0.1
0.2
0.5
0.2
0.5
1
1
10-5 10-4 10-3 10-2 10-1 100 101 s 102
10-5 10-4 10-3 10-2 10-1 100 101 s 102
tp
tp
Radiation Characteristics 3) page 12
Irel = f(ϕ), TA= 25°C
OHL00021
40˚
30˚
20˚
10˚
0˚
1.0
ϕ
50˚
0.8
0.6
0.4
0.2
0
60˚
70˚
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0
20˚
40˚
60˚
80˚
100˚
120˚
2016-03-07
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Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Package Outline
3.0 (0.118)
2.6 (0.102)
2.3 (0.091)
3.8 (0.150) max.
2.1 (0.083)
1.7 (0.067)
2.1 (0.083)
0.8 (0.031)
0.9 (0.035)
0.6 (0.024)
0.7 (0.028)
3
4
0.1 (0.004) typ
2
1
0.6 (0.024)
0.4 (0.016)
Package marking
0.18 (0.007)
0.13 (0.005)
GPLY6127
Dimensions in mm (inch).
Pinning
Pin
Description
Cathode
Anode
1
2
3
4
Anode
Anode
Package
Power TOPLED with Lens
Approximate Weight:
35 mg
2016-03-07
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Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Recommended Solder Pad
Dimensions in mm.
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
OHA04525
300
˚C
T
250
T
245 ˚C
p
240 ˚C
tP
tL
217 ˚C
200
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s
300
t
2016-03-07
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Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Pb-Free (SnAgCu) Assembly
Profil-Charakteristik
Profile Feature
Symbol
Symbol
Einheit
Unit
Minimum
Recommendation
Maximum
Ramp-up Rate to Preheat*)
25 °C to 150 °C
2
3
120
3
K/s
Time tS
TSmin to TSmax
tS
60
100
2
s
Ramp-up Rate to Peak*)
K/s
TSmax to TP
TL
tL
Liquidus Temperature
217
80
°C
s
Time above Liquidus temperature
100
TP
tP
Peak Temperature
245
20
250
30
°C
s
Time within 5 °C of the specified peak
temperature TP - 5 K
10
3
4
K/s
s
Ramp-down Rate*
TP to 100 °C
480
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Taping
Dimensions in mm.
2016-03-07
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Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Tape and Reel
12 mm tape with 2000 pcs. on ∅ 180 mm reel
W1
D0
P0
P2
Label
P1
Direction of unreeling
Direction of unreeling
W2
Leader: min. 400 mm *
Trailer: min. 160 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHAY0324
Tape dimensions [mm]
Tape dimensions in mm
W
E
F
P0
P1
P2
2 ± 0.05
D0
12 + 0.3 / - 0.1 4 ± 0.1
4 ± 0.1
or
8 ± 0.1
1.5 ± 0.1
1.75 ± 0.1
5.5 ± 0.05
Reel dimensions [mm]
Reel dimensions in mm
A
W
Nmin
60
W1
W2max
18.4
180
12
12.4 + 2
Barcode-Product-Label (BPL)
OSRAM Opto
BIN1: XX-XX-X-XXX-X
LX XXXX
Semiconductors
RoHS Compliant
(6P) BATCH NO: 1234567890
(1T) LOT NO: 1234567890
ML Temp ST
XXX °C X
X
(9D) D/C: 1234
Pack: RXX
DEMY XXX
X_X123_1234.1234 X
(X) PROD NO: 123456789(Q)QTY: 9999 (G) GROUP: XX-XX-X-X
OHA04563
2016-03-07
9
Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Dry Packing Process and Materials
Moisture-sensitive label or print
Barcode label
OSRAM
Humidity indicator
Barcode label
D
o
n
o
t
e
a
t
.
A v o i d m e t a l c o n t a c t .
D i s c a r d i f c i r c l e s o v e r r u n .
b a g o p e n i n g .
P l e a s e c h e c k t h e H I C i m m i d i a t e l y a f t e r
c h e c k d o t
C o m p a r a t o r
W E T
b a k e u n i t s
e x a m i n e u n i t s , i f n e c e s s a r y
1 5 %
I f w e t ,
b a k e u n i t s
e x a m i n e u n i t s , i f n e c e s s a r y
1 0 %
I f w e t ,
c h a n g e d e s i c c a n t
p a r t s s t i l l a d e q a t e l y d r y .
I f w e t ,
u
5 %
M I L - I - 8 8 3 5
H u m i d i t y I n d i c a t o r
OSRAM
Desiccant
OHA00539
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
Transportation Packing and Materials
Barcode label
Barcode label
Bin1: P-1-20
Bin2: Q-1-20
Bin3:
Temp ST
220
240 C R
260
C
R
DEMY
R18
ML
2
C
RT
LSY T676
Multi TOP
2a
3
Additional TEXT
R077
PACKVAR:
P-1+Q-1
(G) GROUP:
0144
(9D) D/C:
210021998
2000
OSRAM Opto
Semiconductors
(Q)QTY:
123GH1234
(6P) BATCH NO:
5
2
4
1
0
0
1
(1T) LOT NO:
1
(X) PROD NO:
Bin1: P-1-20
Bin2: Q-1-20
Bin3:
Temp ST
220
240 C R
260
C
R
DEMY
R18
ML
2
C
RT
LSY T676
Multi TO
2a
3
Additional TEXT
R077
PACKVAR:
P-1+Q-1
(G) GROUP:
0144
(9D) D/C:
210021998
2000
OSRAM Opto
Semiconductors
(Q)QTY:
123GH1234
(6P) BATCH NO:
5
2
4
1
0
0
1
(1T) LOT NO:
1
OSRAM
(X) PROD NO:
Packing
Sealing label
OHA02044
Dimensions of transportation box in mm
Width
Length
Height
195 ± 5
195 ± 5
30 ± 5
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Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2016-03-07
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Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Glossary
1)
Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 16 mm2 each
2)
Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block)
3)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2016-03-07
12
Version 1.7 / acc. to OS-PCN-2015-025-A
SFH 4258S
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
2016-03-07
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