SFH4236 [OSRAM]
IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung; IR- Lumineszenzdiode ( 850纳米),麻省理工学院达赫Ausgangsleistung![SFH4236](http://pdffile.icpdf.com/pdf2/p00203/img/icpdf/SFH423_1149844_icpdf.jpg)
型号: | SFH4236 |
厂家: | ![]() |
描述: | IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung |
文件: | 总9页 (文件大小:151K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung
High Power Infrared Emitter (850 nm)
Lead (Pb) Free Product - RoHS Compliant
SFH 4236
Wesentliche Merkmale
Features
• max. Gleichstrom 1 A
• max. DC-current 1 A
• niedriger Wärmewiderstand (9 K/W)
• Schwerpunktswellenlänge 850 nm
• ESD-sicher bis 2 kV nach JESD22-A114-E
• Erweiterte Korrosionsfestigkeit
(s.a. Abschnitt Maßzeichnung)
• Low thermal resistance (9 K/W)
• Center of spectral emission at 850 nm
• ESD safe up to 2 kV acc. to JESD22-A114-E
• Superior Corrosion Robustness
(see chapter package outlines)
Anwendungen
Applications
• Infrarotbeleuchtung für Kameras
• Überwachungssysteme
• Infrared Illumination for cameras
• Surveillance systems
• Fahrer-Assistenz Systeme
• Beleuchtung für Bilderkennungssysteme
• Driver assistance systems
• Machine vision systems
Sicherheitshinweise
Safety Advices
Je nach Betriebsart emittieren diese Bauteile Depending on the mode of operation, these
hochkonzentrierte, nicht sichtbare Infrarot- devices emit highly concentrated non visible
Strahlung, die gefährlich für das menschliche infrared light which can be hazardous to the
Auge sein kann. Produkte, die diese Bauteile human eye. Products which incorporate these
enthalten, müssen gemäß den Sicherheits- devices have to follow the safety precautions
richtlinien der IEC-Normen 60825-1 und 62471 given in IEC 60825-1 and IEC 62471.
behandelt werden.
Typ
Type
Bestellnummer
Ordering Code
Strahlstärkegruppierung1) (IF = 1 A, tp = 10 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4236
Q65110A9564
> 250 (typ. 630)
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
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SFH 4236
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Top , Tstg
– 40 … + 125
°C
Operating and storage temperature range
Sperrschichttemperatur
Junction temperature
TJ
+ 145
°C
V
Sperrspannung
Reverse voltage
VR
1
Vorwärtsgleichstrom
Forward current
IF
1
A
Stoßstrom, tp < 200 µs, D = 0
Surge current
IFSM
Ptot
5
A
Leistungsaufnahme
Power consumption
1.8
9
W
K/W
Wärmewiderstand Sperrschicht - Lötstelle
Thermal resistance junction - soldering point
RthJS
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 1 A, tp = 10 ms
λpeak
λcentroid
Δλ
860
850
30
nm
nm
nm
Centroid-Wellenlänge der Strahlung
Centroid wavelength
IF = 1 A, tp = 10 ms
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 1 A, tp = 10 ms
Abstrahlwinkel
Half angle
ϕ
± 20
1
Grad
deg.
mm2
Aktive Chipfläche
Active chip area
A
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
1 × 1
mm²
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SFH 4236
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Schaltzeiten, Ie von 10% auf 90% und von 90% tr / tf
auf 10%, IF = 5 A, RL = 50 Ω
7 / 14
ns
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 5 A, RL = 50 Ω
Durchlassspannung
Forward voltage
IF = 1 A, tp = 100 µs
IF = 5 A, tp = 100 µs
VF
VF
1.5 (< 1.8)
2.0 (< 2.9)
V
V
Gesamtstrahlungsfluss
Total radiant flux
Φe
530
mW
IF = 1 A, tp = 100 µs
Temperaturkoeffizient von Ie bzw. Φe
Temperature coefficient of Ie or Φe
IF = 1 A, tp = 10 ms
TCI
– 0.3
– 1
%/K
Temperaturkoeffizient von VF
Temperature coefficient of VF
IF = 1 A, tp = 10 ms
TCV
mV/K
nm/K
Temperaturkoeffizient von λ
Temperature coefficient of λ
IF = 1 A, tp = 10 ms
TCλ,centroid
+ 0.3
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SFH 4236
Strahlstärke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol
Werte
Values
Einheit
Unit
-CW
-DA
-DB
-EW
Strahlstärke
Radiant intensity
IF = 1 A, tp = 10 ms
Ιe min
Ιe max
250
500
400
630
500
800
630
1250
mW/sr
mW/sr
1)
Nur eine Gruppe in einer Verpackungseinheit/
Only one group in one packing unit
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
40˚
30˚
20˚
10˚
0˚
OHF04392
1.0
50˚
0.8
0.6
0.4
60˚
70˚
0.2
0
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
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SFH 4236
Relative spektrale Emission
Relative Spectral Emission
Durchlassstrom
Forward Current
IF = f (VF)
Relativer Gesamtstrahlungsfluss
Relative Total Radiant Flux
Φe/Φe(1000mA) = f (IF)
Irel = f (λ)
Single pulse, tp = 100 μs
Single pulse, tp = 100 μs
OHF04132
OHF03847
OHF03848
101
101
100
A
Φe
e (1 A)
%
IF
Irel
Φ
80
60
40
20
100
100
10-1
10-2
5
10-1
5
10-2
5
10-3
0
10-2
5
10-1
5
100
A
101
0
0.5
1
1.5
2 V 2.5
VF
700
750
800
850
nm 950
λ
IF
Max. zulässiger Durchlassstrom
Max. Permissible Forward Current
IF = f (TA), RthJS = 9 K/W
Zulässige Impulsbelastbarkeit
Permissible Pulse Handling
Capability IF = f (tp), TS = 85 °C,
Duty cycle D = parameter
OHF04177
OHF04369
5.5
A
1.1
tP
A
tP
IF
IF
IF
D
= T
T
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
D
=
0.005
0.01
0.02
0.05
0.1
0.2
0.33
0.5
1
10-5 10-4 10-3 10-2 10-1 100 101 s 102
0
20 40 60 80 100 ˚C 130
TS
tp
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SFH 4236
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch).
Korrosionsfestigkeit besser als EN 60068-2-60 (method 4):
mit erweitertem Korrosionstest: 40°C / 90%rh / 15ppm H2S / 336h
Corrosion robustness better than EN 60068-2-60 (method 4):
with enhanced corrosion test: 40°C / 90%rh / 15ppm H2S / 336h
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SFH 4236
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Achtung:
Anode und Heatsink sind
elektrisch verbunden
Attention:
Anode and Heatsink are
electrically connected
3 Lötstellen
3 solder points
Thermisch optimiertes PCB
Thermal enhanced PCB
11.6 (0.457)
1.6 (0.063)
ø4.0 (0.157)
Heatsink attach
Footprint
12.0 (0.472)
11.6 (0.457)
Empfohlene
Padgeometrie
Recommended Solder
Pad Design
Lötstopplack
Solder resist
Lötpasten Schablone
Solder paste stencil
ø2.5 (0.098)
ø4.0 (0.157)
1.6 (0.063)
1 (0.039)
Kupfer
Copper
Freies Kupfer
Bare Copper
OHPY3638
Maße in mm (inch) / Dimensions in mm (inch).
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SFH 4236
Lötbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions
Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
(nach J-STD-020C)
(acc. to J-STD-020C)
OHLA0687
300
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
˚C
+0 ˚C
-5 ˚C
260 ˚C
245 ˚C
235 ˚C
255 ˚C
240 ˚C
250
T
5 ˚C
+5 ˚C
-0 ˚C
217 ˚C
10 s min
200
150
100
50
30 s max
Ramp Down
6 K/s (max)
100 s max
120 s max
Ramp Up
3 K/s (max)
25 ˚C
0
0
50
100
150
200
250
s
300
t
Anm.: Das Gehäuse ist für Ultraschallreinigung nicht geeignet
Note: Package not suitable for ultra sonic cleaning
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2011-04-11
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Mouser Electronics
Related Product Links
720-SFH4236 - Osram Opto Semiconductor SFH 4236
相关型号:
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