SFH4258S [OSRAM]
IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung; IR- Lumineszenzdiode （ 850纳米），麻省理工学院达赫Ausgangsleistung
| 型号： | SFH4258S |
| 厂家： | 
OSRAM GMBH |
| 描述： | IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung |
| 文件： | 总10页 (文件大小：218K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung
High Power Infrared Emitter (850 nm)
Lead (Pb) Free Product - RoHS Compliant
SFH 4258S
SFH 4259S
Wesentliche Merkmale
Features
• Infrarot LED mit hoher Ausgangsleistung
• Halbwinkel SFH 4258S: ± 15°
• Halbwinkel SFH 4259S: ± 25°
• Hohe Bestromung bei hohen Temperaturen
möglich
• High Power Infrared LED
• Half angle SFH 4258S: ± 15°
• Half angle SFH 4259S: ± 25°
• High forward current allowed at high
temperature
• Kurze Schaltzeiten
• Short switching times
Anwendungen
Applications
• Industrie Anwendungen
• Infrarotbeleuchtung für Kameras
• IR-Datenübertragung
• Sensorik
• industrial applications
• Infrared Illumination for cameras
• IR Data Transmission
• Optical sensors
Sicherheitshinweise
Safety Advices
Je nach Betriebsart emittieren diese Bauteile Depending on the mode of operation, these
hochkonzentrierte, nicht sichtbare Infrarot- devices emit highly concentrated non visible
Strahlung, die gefährlich für das menschliche infrared light which can be hazardous to the
Auge sein kann. Produkte, die diese Bauteile human eye. Products which incorporate these
enthalten, müssen gemäß den Sicherheits- devices have to follow the safety precautions
richtlinien der IEC-Normen 60825-1 und 62471 given in IEC 60825-1 and IEC 62471.
behandelt werden.
Typ
Type
Bestellnummer
Ordering Code
Strahlstärkegruppierung1) (IF = 70 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4258S
SFH 4259S
Q65111A1158
Q65111A1159
≥ 40 (typ. 100)
≥ 25 (typ. 60)
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
2011-10-20
1
SFH 4258S, SFH 4259S
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Top , Tstg
– 40 … + 85
°C
Operating and storage temperature range
Sperrspannung
Reverse voltage
VR
5
V
Vorwärtsgleichstrom
Forward current
IF
70
mA
mA
mW
K/W
Stoßstrom, tp = 300 μs, D = 0
Surge current
IFSM
Ptot
700
245
300
Verlustleistung
Power dissipation
Wärmewiderstand Sperrschicht - Umgebung bei RthJA
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
RthJS
140
K/W
Thermal resistance junction - soldering point,
mounted on metal block
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 70 mA
λpeak
λcentroid
Δλ
860
850
30
nm
nm
nm
Centroid-Wellenlänge der Strahlung
Centroid wavelength
IF = 70 mA
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 70 mA
Abstrahlwinkel
Half angle
SFH 4258S
SFH 4259S
ϕ
ϕ
± 15
± 25
Grad
deg.
2011-10-20
2
SFH 4258S, SFH 4259S
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Aktive Chipfläche
Active chip area
0.09
mm2
mm²
ns
A
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
0.3 × 0.3
Schaltzeiten, Ie von 10% auf 90% und von 90% tr, tf
auf 10%, bei IF = 70 mA, RL = 50 Ω
15
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 70 mA, RL = 50 Ω
Durchlassspannung
Forward voltage
IF = 70 mA, tp = 20 ms
IF = 700 mA, tp = 100 µs
VF
VF
3 (< 3.5)
4 (< 5.2)
V
V
Sperrstrom
Reverse current
IR
not designed for μA
reverse
operation
Gesamtstrahlungsfluss
Total radiant flux
IF = 70 mA, tp = 20 ms
Φe typ
TCI
80
mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 70 mA
– 0.5
%/K
Temperature coefficient of Ie or Φe,
IF = 70 mA
Temperaturkoeffizient von VF, IF = 70 mA
Temperature coefficient of VF, IF = 70 mA
TCV
TCλ
– 2
mV/K
nm/K
Temperaturkoeffizient von λ, IF = 70 mA
Temperature coefficient of λ, IF = 70 mA
+ 0.3
2011-10-20
3
SFH 4258S, SFH 4259S
Strahlstärke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol
Werte
Values
Einheit
Unit
SFH 4258S SFH 4258S SFH 4258S
-U -V -AW
Strahlstärke
Radiant intensity
IF = 70 mA, tp = 20 ms
Ie min
Ie max
40
80
63
125
100
200
mW/sr
mW/sr
Strahlstärke
Ie typ
480
750
1200
mW/sr
Radiant intensity
IF = 700 mA, tp = 25 µs
SFH 4259S SFH 4259S SFH 4259S
-T -U -V
Strahlstärke
Radiant intensity
IF = 70 mA, tp = 20 ms
Ie min
Ie max
25
50
40
80
63
125
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 700 mA, tp = 25 µs
1)
Ie typ
300
480
750
mW/sr
Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /
Only one bin in one packing unit (variation lower 2:1)
2011-10-20
4
SFH 4258S, SFH 4259S
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
SFH 4258S
OHL00021
40˚
30˚
20˚
10˚
0˚
1.0
ϕ
50˚
0.8
0.6
0.4
0.2
0
60˚
70˚
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0
20˚
40˚
60˚
80˚
100˚
120˚
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
SFH 4259S
40˚
30˚
20˚
10˚
0˚
OHL00999
ϕ
1.0
50˚
0.8
0.6
60˚
70˚
0.4
0.2
0
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
2011-10-20
5
SFH 4258S, SFH 4259S
Ie
= f (IF)
Relative Spectral Emission
Irel = f (λ)
Radiant Intensity
Max. Permissible Forward Current
IF = f (TA), RthJA = 300 K/W
Ie 70 mA
Single pulse, tp = 25 μs
100
%
80
70
60
50
40
30
20
10
0
1.E+01
90
80
70
60
50
40
30
20
10
0
1.E+00
1.E-01
1.E-02
1.E-03
1.E+00
1.E+01
1.E+02
1.E+03
0
20
40
60
A [°C]
80
100
nm
IF [mA]
T
Lambda
Forward Current IF = f (VF)
Single pulse, tp = 100 μs
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °,
duty cycle D = parameter
Permissible Pulse Handling
Capability IF = f (τ), TA = 85 °C,
duty cycle D = parameter
OHF04490
OHF04491
1000
100
10
0.75
A
0.75
A
tP
tP
tP
tP
IF
IF
IF
IF
D
= T
D
= T
T
T
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
D
=
D
=
0.005
0.01
0.02
0.05
0.1
0.005
0.01
0.02
0.05
0.1
0.2
0.2
0.5
0.5
1
1
1
2
3
4
5
10-5 10-4 10-3 10-2 10-1 100 101 s 102
10-5 10-4 10-3 10-2 10-1 100 101 s 102
V
F [V]
tp
tp
2011-10-20
6
SFH 4258S, SFH 4259S
Maßzeichnung
Package Outlines
3.0 (0.118)
2.6 (0.102)
2.3 (0.091)
3.8 (0.150) max.
SFH 4258S
2.1 (0.083)
1.7 (0.067)
2.1 (0.083)
0.9 (0.035)
0.7 (0.028)
0.8 (0.031)
0.6 (0.024)
3
4
0.1 (0.004) typ
2
1
0.6 (0.024)
0.4 (0.016)
Package marking
0.18 (0.007)
0.13 (0.005)
GPLY6127
3.5 (0.138) max.
SFH 4259S
2.1 (0.083)
1.7 (0.067)
3.0 (0.118)
2.6 (0.102)
2.3 (0.091)
0.9 (0.035)
0.7 (0.028)
2.1 (0.083)
3
4
0.1 (0.004) typ
2
1
0.6 (0.024)
0.4 (0.016)
Package marking
0.18 (0.007)
0.13 (0.005)
GPLY6128
Maße in mm (inch) / Dimensions in mm (inch).
Gehäuse / Package
Power TOPLED® mit Linse, klarer Verguss / Power TOPLED® with lens, clear
resin
Anschlussbelegung
pin configuration
1 = Kathode / cathode
2/3/4 = Anode / anode
2011-10-20
7
SFH 4258S, SFH 4259S
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Reflow Löten
Reflow Soldering
Padgeometrie für
verbesserte Wärmeableitung
3.3 (0.130)
3.3 (0.130)
Paddesign for
improved heat dissipation
2.3 (0.091)
0.8 (0.031)
0.7 (0.028)
2
_
<
Cu Fläche / 16 mm per pad
Cu-area
Lötstoplack
Solder resist
OHFP3021
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Wellenlöten TTW
TTW Soldering
6.1 (0.240)
2.8 (0.110)
2.8 (0.110)
0.5 (0.020)
Cu Fläche / > 16 mm2 per pad
Cu-area
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Lötstoplack
Solder resist
OHPY3040
2011-10-20
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SFH 4258S, SFH 4259S
Lötbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020D.01)
(acc. to J-STD-020D.01)
OHA04525
300
˚C
T
250
T
245 ˚C
p
240 ˚C
tP
tL
217 ˚C
200
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s
300
t
Bleifreier Aufbau / Pb-Free Assembly (SnAgCu)
Profileigenschaften
Profile Feature
Empfehlung / Recommendation
Grenzwerte / Max. Ratings
Aufheizrate zum Vorwärmen*) /
2 K / s
3 K / s
Ramp-up rate to preheat*)
25 °C to 150 °C
150 °C to 200 °C
180 °C to TP
Zeit ts von TSmin bis TSmax
/
100 s
min. 60 s max. 120 s
3 K / s
Time ts from TSmin to TSmax
Aufheizrate zur Spitzentemperatur*) /
Ramp-up rate to peak*)
2 K / s
Liquidustemperatur TL /
Liquidus temperature TL
217 °C
Zeit tL über TL / Time tL above TL
80 s
max. 100 s
Spitzentemperatur TP / Peak temperature TP
245 °C
20 s
max. 250 °C
Verweilzeit tP innerhalb des spezifizierten
min. 10 s max. 30 s
Spitzentemperaturbereichs TP - 5 K / Time tP within the
specified peak temperature range TP - 5 K
Abkühlrate*) / Ramp-down rate*)
TP to 100 °C
3 K / s
4 K / s maximum
max. 8 min.
Zeitspanne von 25 °C bis zur Spitzentemperatur /
Time from 25 °C to peak temperature
Alle Temperaturen beziehen sich auf die Bauteilmitte, jeweils auf der Bauteiloberseite gemessen / All temperatures refer to the center of
the package, measured on the top of the package
* Steigungsberechnung ΔT/Δt: Δt max. 5 s; erfüllt über den gesamten Temperaturbereich / slope calculation ΔT/Δt: Δt max. 5 s; fulfillment
for the whole T-range
2011-10-20
9
SFH 4258S, SFH 4259S
Wellenlöten (TTW)
TTW Soldering
(nach CECC 00802)
(acc. to CECC 00802)
OHLY0598
300
C
10 s
Normalkurve
standard curve
250
200
150
100
50
T
235 C ... 260 C
Grenzkurven
limit curves
2. Welle
2. wave
1. Welle
1. wave
ca 200 K/s
2 K/s
5 K/s
100 C ... 130 C
Zwangskühlung
forced cooling
2 K/s
0
0
50
100
150
200
s
250
t
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2011-10-20
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