PDC230-CxDR21 [P-TEC]
Low power consumption;型号: | PDC230-CxDR21 |
厂家: | P-tec Corporation |
描述: | Low power consumption |
文件: | 总9页 (文件大小:1123K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PRODUCT SPECIFICATION
Part Number
PDC230-CxDxxx
Details
Features
•
•
•
•
2.3” (56.80mm) Display
1 Digit, 7 Segment
Common Anode or Cathode
AlInGaP or InGaN dice used
•
•
•
Low power consumption
RoHS Compliant
Gray Face, White Segments or Black Face,
White Segments
•
Easy mounting on PCB or socket
Mechanical Dimensions
Notes:
1. Dimensions in millimeters [inch], and tolerance is ±0.25 [.010] and angle is ±1° unless otherwise noted.
2. Bending ≤ Length*1%
3. All pins are Ø0.510.[020]±0.1[.004]
4. Specifications subject to change without notice
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040715 Rev1 JAS
Page 1 of 9
Device Selection Guide
Chip
Emitting Color
Description
Note
Model Number
Material
PDC230-CxDG05
PDC230-CxDG17
PDC230-CxDY04
PDC230-CxDA11
PDC230-CxDR02
PDC230-CxDR11
PDC230-CxDR21
InGaN
True Green
Yellow Green
Yellow
Amber
Orange-Red
Red
Common
Cathode x=C
/
Common
Anode x=A
Add “BFWS” to end
of part number for
Black Face, White
Segment version
AlInGaP
Deep Red
Absolute Maximum Ratings at Ta=25°C
Parameter
Symbol
Rating
Unit
G17/Y04/A11/R02/R11/R21
G05
Power Dissipation per Dice
Derating Liner from 25°C per Dice
Continuous Forward Current Per Dice
Peak Current Per Dice (duty cycle
1/10, 1KHz)
PAD
--
IAF
70
0.33
25
114
0.4
30
mW
mA/°C
mA
IPF
90
100
mA
Reverse Voltage Per Dice
Electrostatic Discharge (HBM)
Operating Temperature
VR
ESD
Topr
Tstg
5
/
5
V
V
°C
°C
1000
-35~+85
-35~+85
Storage Temperature
Solder Conditions: 1/16 inch below seating plane for 3 -5 seconds at 260°C.
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040715 Rev1 JAS
Page 2 of 9
Electrical and Optical Characteristics at Ta=25°C
Parameter
Symbol
Chip
Min.
Typ.
Max.
Unit
Condition
G05
G17/Y04/A11
/R02/R11/R21
--
12.8(6.4)
15.2(5.6)
Forward Voltage Per
Segment
VF
V
IF=20mA
--
8(4)
11.2(5.6)
G05
G17
Y04
A11
R02
R11
R21
G05
G17
Y04
A11
R02
R11
R21
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
1413
110
283
314
226
--
--
--
--
--
Luminous Intensity Per
Segment
Iv
mcd
nm
IF=10mA
IF=20mA
141
114
--
--
--
--
--
--
--
--
100
*/525
572/570
592/590
612/605
632/625
644/630
660/645
--
Peak Emission
Wavelength /
Dominant Wavelength
λP/λd
Reverse Current
Luminous Intensity
Matching Ratio
IR
μA
--
VR=20(10)V
IF=10mA
Iv-m
--
--
2:1
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040715 Rev1 JAS
Page 3 of 9
Typical Electrical/Optical Characteristic Curves
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040715 Rev1 JAS
Page 4 of 9
Luminous General lv Bin Grade (IF = 10mA)
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040715 Rev1 JAS
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All Light-On Segments Feature & Pad Position
Internal Circuit Diagram
Common Anode
Common Cathode
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040715 Rev1 JAS
Page 6 of 9
Precautions for Use
1. Recommended soldering conditions
1.1. Wave soldering
Basic SPEC is ≤ 5sec. When 260°C. If temperature is higher, time should be shorter (+10°C→ -1sec.).
1.2. Soldering Iron:
Power dissipation of iron should be smaller than 15W and temp should be controllable. Soldering
temperature should be under 260°C, time ≤ 3sec.
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040715 Rev1 JAS
Page 7 of 9
Packing Dimensions
Note: 1. Specifications subject to change without notice.
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040715 Rev1 JAS
Page 8 of 9
Approved By
Checked By
Prepared By
Customer Approval
Signatures
Record Of Revisions
Rev.
0
1
Comments
Released Spec
Logo Update
Page
--
All
Date
11/12/13
04/07/15
www.p-tec.net
040715 Rev1 JAS
Page 9 of 9
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