PDM57200X-W01 [P-TEC]
Gray or Black Face, White Segment;
| 型号： | PDM57200X-W01 |
| 厂家： | 
P-tec Corporation |
| 描述： | Gray or Black Face, White Segment |
| 文件： | 总7页 (文件大小：420K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRODUCT SPECIFICATION
Part Number
PDM57200x-W01
Details
Features
2.0” (50.72mm) Dot Matrix Display
5x7 Array
Available in Common Anode or Cathode
Emitting Color: White
Low power consumption
RoHS Compliant
Gray or Black Face, White Segment
Easy mounting on PCB or socket
Mechanical Dimensions
Notes:
1. Dimensions in millimeters [inch], and tolerance is ±0.25 [.010] and angle is ±1° unless otherwise noted.
2. Bending ≤ Length*1%
3. All pins are ⌀0.50[.020]±0.1[.004]
4. Specifications subject to change without notice.
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102513 Rev0 JAS
Page 1 of 7
Device Selection Guide
Chip
Description
Model Number
Material
Emitting Color
PDM57200C-W01
PDM57200A-W01
Common Cathode
Common Anode
InGaN
White
Absolute Maximum Ratings at Ta=25°C
Parameter
Symbol
PAD
--
Rating
114
0.4
Unit
mW
mA/°C
mA
Power Dissipation per Dice
Derating Liner from 25°C per Dice
Continuous Forward Current Per Dice
Peak Current Per Dice (duty cycle
1/10, 1KHz)
IAF
30
IPF
100
mA
Reverse Voltage Per Dice
Electrostatic Discharge (HBM)
Operating Temperature
VR
ESD
Topr
Tstg
5
V
V
1500
°C
°C
Storage Temperature
Typical Electrical and Optical Characteristics at Ta=25°C
Parameter
Forward Voltage Per
Segment
Luminous Intensity Per
Segment
Chromaticity Coordinates
(Tolerance: ±0.01)
Reverse Current
Luminous Intensity
Matching Ratio
Symbol
Chip
Min.
Typ.
Max.
Unit
Condition
VF
W01
--
3.2
3.8
V
IF=20mA
IF=10mA
Iv
W01
W01
--
230
--
mcd
X/Y
IR
--
--
--
0.27/.025
--
nm
μA
--
IF=10mA
VR=5V
--
--
50
2:1
Iv-m
IF=10mA
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102513 Rev0 JAS
Page 2 of 7
Typical Electrical/Optical Characteristic Curves
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102513 Rev0 JAS
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Luminous General lv Bin Grade (IF = 10mA)
Color Rank Limits (IF=10mA)
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102513 Rev0 JAS
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All Light-On Segments Feature & Pad Position
Internal Circuit Diagram
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102513 Rev0 JAS
Page 5 of 7
Precautions for Use
1. Recommended soldering conditions
1.1. Wave soldering
Basic SPEC is ≤ 5sec. When 260°C. If temperature is higher, time should be shorter (+10°C→ -1sec.).
1.2. Soldering Iron:
Power dissipation of iron should be smaller than 15W and temp should be controllable. Soldering
temperature should be under 260°C, time ≤ 3sec.
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102513 Rev0 JAS
Page 6 of 7
Packing Dimensions
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102513 Rev0 JAS
Page 7 of 7
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