PDM88185C-B01 [P-TEC]
Low power consumption;
| 型号： | PDM88185C-B01 |
| 厂家： | 
P-tec Corporation |
| 描述： | Low power consumption |
| 文件： | 总7页 (文件大小：387K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRODUCT SPECIFICATION
Part Number
PDM88185x-B01
Details
Features
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•
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1.85 inch (47.0mm) Dot Matrix Display
8x8 Array
Available in Common Anode or Cathode
Emitting Color: Blue
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•
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Low power consumption
RoHS Compliant
Gray or Black Face, White Segment
Easy mounting on PCB or socket
Mechanical Dimensions
Notes:
1. Dimensions in millimeters [inch], and tolerance is ±0.25 [.010] and angle is ±1° unless otherwise noted.
2. Bending ≤ Length*1%
3. All pins are ⌀0.60[.024]±0.1[.004]
4. Specifications subject to change without notice
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102513 Rev0 JAS
Page 1 of 7
Device Selection Guide
Chip
Description
Model Number
Material
Emitting Color
PDM88185C-B01
PDM88185A-B01
Common Cathode
Common Anode
InGaN
Blue
Absolute Maximum Ratings at Ta=25°C
Parameter
Symbol
PAD
--
Rating
114
0.4
Unit
mW
mA/°C
mA
Power Dissipation per Dice
Derating Liner from 25°C per Dice
Continuous Forward Current Per Dice
Peak Current Per Dice (duty cycle
1/10, 1KHz)
IAF
30
IPF
100
mA
Reverse Voltage Per Dice
Electrostatic Discharge (HBM)
Operating Temperature
VR
ESD
Topr
Tstg
5
1000
V
V
°C
°C
Storage Temperature
Typical Electrical and Optical Characteristics at Ta=25°C
Parameter
Symbol
VF
Min.
--
--
Typ.
3.2
60
Max.
3.8
--
Unit
V
mcd
Condition
IF=20mA
IF=10mA
Forward Voltage Per Segment
Luminous Intensity Per Segment
Peak Emission Wavelength /
Dominant Wavelength
Iv
λP/λd
--
*/465
--
nm
IF=20mA
Reverse Current
Luminous Intensity Matching Ratio
IR
Iv-m
--
--
--
--
50
2:1
μA
--
VR=5V
IF=10mA
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102513 Rev0 JAS
Page 2 of 7
Typical Electrical/Optical Characteristic Curves
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102513 Rev0 JAS
Page 3 of 7
Luminous General lv Bin Grade (IF = 10mA)
Color Rank Limits (IF=20mA)
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102513 Rev0 JAS
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All Light-On Segments Feature & Pad Position
Internal Circuit Diagram
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102513 Rev0 JAS
Page 5 of 7
Precautions for Use
1. Recommended soldering conditions
1.1. Wave soldering
Basic SPEC is ≤ 5sec. When 260°C. If temperature is higher, time should be shorter (+10°C→ -1sec.).
1.2. Soldering Iron:
Power dissipation of iron should be smaller than 15W and temp should be controllable. Soldering
temperature should be under 260°C, time ≤ 3sec.
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102513 Rev0 JAS
Page 6 of 7
Packing Dimensions
Note: 1. Specifications subject to change without notice
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102513 Rev0 JAS
Page 7 of 7
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