PDM88230A-G17 [P-TEC]
Easy mounting on PCB or socket;
| 型号： | PDM88230A-G17 |
| 厂家： | 
P-tec Corporation |
| 描述： | Easy mounting on PCB or socket PC |
| 文件： | 总9页 (文件大小：722K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRODUCT SPECIFICATION
Part Number
PDM88230 Series
Details
Features
•
•
•
•
2.3” (37.02mm) Dot Matrix Display
8x8 Array
Available in Common Anode or Cathode
Emitting Color: Pure Green, Yellow Green,
Yellow, Amber, Orange-Red, Red or Deep
Red
•
•
•
•
Low power consumption
RoHS Compliant
Gray or Black Face, White Segment
Easy mounting on PCB or socket
Mechanical Dimensions
Notes:
1. Dimensions in millimeters [inch], and tolerance is ±0.25 [.010] and angle is ±1° unless otherwise noted.
2. Bending ≤ Length*1%
3. All pins are ⌀0.50.[020]±0.1[.004]
4. Specifications subject to change without notice
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111113 Rev0 JAS
Page 1 of 9
Device Selection Guide
Model Number
Chip
Common Column Anode Common Column Cathode
Material
InGaN
Emitting Color
True Green
Yellow Green
Yellow
Amber
Orange-Red
Red
PDM88230A-G05
PDM88230A-G17
PDM88230A-Y04
PDM88230A-A11
PDM88230A-R02
PDM88230A-R11
PDM88230A-R21
PDM88230C-G05
PDM88230C-G17
PDM88230C-Y04
PDM88230C-A11
PDM88230C-R02
PDM88230C-R11
PDM88230C-R21
AlInGaP
Deep Red
Absolute Maximum Ratings at Ta=25°C
Rating
G17/Y04/A11/R02/R11/R21
Parameter
Symbol
Unit
G05
114
0.4
30
100
5
Power Dissipation per Dice
Derating Liner from 25°C per Dice
Continuous Forward Current Per Dice
Peak Current Per Dice (duty cycle 1/10, 1KHz)
Reverse Voltage Per Dice
PAD
--
IAF
70
mW
mA/°C
mA
mA
V
V
°C
°C
0.33
25
90
5
/
IPF
VR
ESD
Topr
Tstg
Electrostatic Discharge (HBM)
Operating Temperature
1000
-35~+85
-35~+85
Storage Temperature
Solder Conditions: 1/16 inch below seating plane for 3 -5 seconds at 260°C.
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111113 Rev0 JAS
Page 2 of 9
Electrical and Optical Characteristics at Ta=25°C
Parameter
Symbol
Chip
Min.
Typ.
Max.
Unit
Condition
G05
G17/Y04/A11
/R02/R11/R21
--
3.2
3.8
Forward Voltage Per
Segment
VF
V
IF=20mA
--
2
2.8
G05
G17
Y04
A11
R02
R11
R21
G05
G17
Y04
A11
R02
R11
R21
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
489
28
81
106
62
--
--
--
--
--
Luminous Intensity Per
Segment
Iv
mcd
nm
IF=10mA
IF=20mA
58
27
--
--
--
--
--
--
--
--
100
*/525
572/570
592/590
612/605
632/625
644/630
660/645
--
Peak Emission
Wavelength /
Dominant Wavelength
λP/λd
Reverse Current
Luminous Intensity
Matching Ratio
IR
μA
VR=5V
Iv-m
--
--
2:1
--
IF=10mA
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111113 Rev0 JAS
Page 3 of 9
Typical Electrical/Optical Characteristic Curves
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111113 Rev0 JAS
Page 4 of 9
Luminous General lv Bin Grade (IF = 10mA)
Color Rank Limits (IF=20mA)
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111113 Rev0 JAS
Page 5 of 9
All Light-On Segments Feature & Pad Position
Internal Circuit Diagram
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111113 Rev0 JAS
Page 6 of 9
Precautions for Use
1. Recommended soldering conditions
1.1. Wave soldering
Basic SPEC is ≤ 5sec. When 260°C. If temperature is higher, time should be shorter (+10°C→ -1sec.).
1.2. Soldering Iron:
Power dissipation of iron should be smaller than 15W and temp should be controllable. Soldering
temperature should be under 260°C, time ≤ 3sec.
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111113 Rev0 JAS
Page 7 of 9
Packing Dimensions
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111113 Rev0 JAS
Page 8 of 9
Note: 1. Specifications subject to change without notice.
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111113 Rev0 JAS
Page 9 of 9
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