2SD2465P [PANASONIC]

Power Bipolar Transistor, 4A I(C), 20V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 3 Pin, TO-220E, FULL PACK-3;
2SD2465P
型号: 2SD2465P
厂家: PANASONIC    PANASONIC
描述:

Power Bipolar Transistor, 4A I(C), 20V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 3 Pin, TO-220E, FULL PACK-3

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Power Transistors  
2SD2465, 2SD2465A  
Silicon NPN epitaxial planar type  
For low-voltage switching  
Complementary to 2SB1603  
Unit: mm  
Features  
4.6±0.2  
Low collector to emitter saturation voltage VCE(sat)  
High-speed switching  
±0.3  
2.9±0.2  
φ3.
Full-pack package superior in insulation, which can be installed  
to the heat sink with one screw  
Absolute Maximum Ratings (T =25˚C)  
C
2.6±0.1  
0.7±0.1  
.2±0
Parameter  
Symbol  
Ratings  
Unit  
45±0.15  
Collector to  
2SD2465  
2SD2465A  
2SD2465  
40  
VCBO  
V
0.7±0.1  
base voltage  
Collector to  
50  
20  
2.54±0.2  
5.08±0.4  
VCEO  
emitter voltage 2SD2465A  
Emitter to base voltage  
Peak collector current  
Collector current  
40  
VEBO  
ICP  
5
V
A
A
1
2 3  
7°  
1:Base  
2:Collector  
3:Emitter  
TO–220E Full Pack Package  
IC  
4
Collector power TC=25°C  
25  
C  
W
dissipation  
Ta=25°C  
2
Junction temperature  
Storage temperature  
Tj  
150  
˚C  
˚C  
Ts
–55 to
Elerical Christics (T =25˚C)  
C
Paamet
llector ctoff  
Symol  
ICBO  
Conditions  
min  
typ  
max  
50  
Unit  
µA  
µA  
V
2SD2465  
VCB = 40V, IE = 0  
cuent  
2SD246A  
VCB = 50V, IE = 0  
VEB = 5V, I= 0  
50  
Emittecutoff c
IEBO  
VCEO  
hFE1  
50  
Collector to em
voltage 5A  
20  
40  
45  
90  
IC = 10mA, IB = 0  
VCE = 2V, IC = 0.1A  
VCE = 2V, IC = 1A  
IC = 2A, IB = 0.1A  
Forward current transfer ratio  
*
hFE2  
260  
0.5  
1.5  
Collector to emitter saturation voltage VCE(sat)  
Base to emitter saturation voltage VBE(sat)  
V
V
I
C = 2A, IB = 0.1A  
Transition frequency  
Turn-on time  
Storage time  
Fall time  
fT  
ton  
tstg  
tf  
VCE = 5V, IC = 0.5A, f = 10MHz  
120  
0.2  
0.5  
0.1  
MHz  
µs  
IC = 2A, IB1 = 0.2A, IB2 = – 0.2A,  
VCC = 20V  
µs  
µs  
*hFE2 Rank classification  
Rank  
hFE2  
Q
P
90 to 180  
130 to 260  
1
Power Transistors  
2SD2465, 2SD2465A  
PC — Ta  
IC — VCE  
VCE(sat) — IC  
40  
6
5
4
3
2
1
0
100  
IC/IB=10  
(1) TC=Ta  
(2) With a 100 × 100 × 2mm  
TC=25˚C  
35  
30  
25  
20  
15  
10  
5
30  
10  
Al heat sink  
(3) With a 50 × 50 × 2mm  
Al heat sink  
(4) Without heat sink  
(PC=2.0W)  
IB=60mA  
50mA  
40mA  
30mA  
(1)  
(2)  
1
TC=100˚C  
25˚C  
20mA  
1  
10mA  
5mA  
–25˚C  
(3)  
(4)  
0.01  
0
0
25  
50  
75  
100 125 150  
0
2
4
6
8
0  
0.01 0.03  
1
3
10  
(
)
( )  
V
( )  
CollectIC A  
Ambient temperature Ta ˚C  
Collector to emitter voltge VC
VBE(sat) — IC  
FE
fT — IC  
100  
10000  
10000  
IC/IB=10  
VCE=2V  
VCE=5V  
f=10MHz  
TC=25˚C  
30  
10  
3000  
300
1000  
0  
TC=100˚C  
25˚C  
3
1
00  
300  
100  
25˚C  
TC=–25˚C  
100˚C  
–25C  
0.3  
0.1  
30  
10  
30  
10  
0.03  
0.01  
3
1
3
1
0.01 3  
0.1  
3
10  
0.1  
0.3  
1
3
10  
30  
00  
0.01 0.03  
0.1  
0.3  
1
3
10  
( )  
A
( )  
( )  
Collector current IC A  
Colctor cIC  
Collector current IC  
n, tstg, tf — IC  
Area of safe operation (ASO)  
10  
100  
Non repetitive pulse  
TC=25˚C  
1ms  
1%  
=–IB2  
30  
10  
)
3
1
ICP  
C  
t=1ms  
tstg  
3
1
10ms  
DC  
ton  
tf  
0.3  
0.1  
0.3  
0.1  
0.03  
0.01  
0.03  
0.01  
0
1
2
3
4
5
6
7
8
1
3
10  
30  
100 300 1000  
( )  
A
( )  
V
Collector current IC  
Collector to emitter voltage VCE  
2
Power Transistors  
2SD2465, 2SD2465A  
Rth(t) — t  
102  
(1) Without heat sink  
(2) With a 100 × 100 × 2mm Al heat sink  
(1)  
(2)  
10  
1
10–1  
10–2  
10–4  
10–3  
10–2  
10–1  
1
10  
102  
103  
4  
( )  
s
Time  
t
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  

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