ADP42510 [PANASONIC]
PS压力传感器;型号: | ADP42510 |
厂家: | PANASONIC |
描述: | PS压力传感器 传感器 换能器 压力传感器 |
文件: | 总6页 (文件大小:151K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Pressure Sensor/PS(ADP4), PF(ADP1)
Pressure Sensor
PS/PF
PS Pressure Sensor
PF Pressure Sensor
High precision pressure sensor (without amp.)
Features
●
Compact size (PS type)
High accuracy and liner characteristic
Broad line-up
RoHS compliant
●
●
●
Typical Applications
●
Industrial use: pressure switches and pneumatic components, compressed air pressure measuring devices and airbeds
Medical use: blood pressure meters, oxygen generator and airbeds
Others: pressure sensing devices for air pressure mediums
●
●
Ordering Information
ADP
Product name
Terminal profile and direction
Rated pressure
Type
Bridge resistance
:
:
:
:
:
:
:
:
:
:
:
:
:
:
1
4
PF pressure sensor
PS pressure sensor
1
DIP terminal
(Direction opposite to the
pressure inlet direction)
0
2
3
4
5
6
7
8
9
A
4.9 kPa
34.3 kPa
49.0 kPa
98.1 kPa
196.1 kPa
343.2 kPa
490.3 kPa
833.6 kPa
980.7 kPa
40.0 kPa
1
Standard type
Nil PF 5 kΩ
:
0
3
:
:
(With glass base)
Economy type
PS 5 kΩ
3.3 kΩ
:
2
(Without glass base)
:
2
DIP terminal
(Pressure inlet direction)
Note : Some part numbers may not be available
depending on the combination.
Please refer to the Table of Product Types.
Types
Part No.
3.3 kΩ
Brige resistance
PS pressure sensor
5 kΩ
PF pressure sensor
5 kΩ
3.3 kΩ
Terminal
DIP terminal: DIP terminal: SMD terminal DIP terminal: DIP terminal: DIP terminal: DIP terminal: DIP terminal: DIP terminal:
Direction opposite Pressure inlet
to the pressure direction
inlet direction
Direction opposite Pressure inlet Direction opposite Pressure inlet Direction opposite Pressure inlet
Pressure
to the pressure direction
to the pressure direction
inlet direction
to the pressure direction
inlet direction
inlet direction
4.9kPa ADP41010 ADP42010
34.3kPa ADP41210 ADP42210
49.0kPa ADP41310 ADP42310
–
–
–
–
–
–
–
–
–
ADP1101 ADP1201
ADP1121 ADP1221
ADP1131 ADP1231
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
98.1kPa ADP41410 ADP42410 ADP4932 ADP41413 ADP42413 ADP1141 ADP1241
Standard type
(with glass
base)
196.1kPa ADP41510 ADP42510
343.2kPa ADP41610 ADP42610
490.3kPa ADP41710 ADP42710
833.6kPa ADP41810 ADP42810
–
–
–
–
–
–
–
–
–
–
–
–
ADP1151 ADP1251
ADP1161 ADP1261
ADP1171 ADP1271
ADP1181 ADP1281
980.7kPa ADP41910 ADP42910 ADP4933 ADP41913 ADP42913 ADP1191 ADP1291
Economy type
(without glass 40.0kPa
base)
–
–
–
ADP41A23 ADP42A23
–
–
ADP11A23 ADP12A23
Standard packing : Carton : 100 pcs.; Case : 1,000 pcs.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Jul. 2015
Pressure Sensor/PS(ADP4), PF(ADP1)
Rating
Economy type
Standard type (With glass base)
Type
(Without glass base)
Type of pressure
Pressure medium
Gauge pressure
✽2
Air
✽3
✽3
Rated pressure (Unit: kPa)
4.9
Twice of the rated pressure
5,000 Ω 1,000 Ω
34.3 to 343.2
490.3
833.6
1.5 times of the
rated pressure
980.7
98.1
980.7
40.0
Twice of the
1.5 times of the
Twice of the
rated pressure
3,300 Ω 600 Ω
Max. applied pressure
Bridge resistance
rated pressure rated pressure
3,300 Ω 700 Ω
−5 °C to +50 °C
23 °F to +122 °F
Ambient temperature
−20 °C to +100 °C −4 °F to +212 °F (no freezing or condensation)
−20 °C to +70 °C
−4 °F to +158 °F
25 °C 77 °F
5 °C to 45 °C
41 °F to +113 °F
Storage temperature
−40 °C to +120 °C −40 °F to +248 °F (no freezing or condensation)
Standard temperature
Temperature compensation range
25 °C 77 °F
30 °C 86 °F
0 °C to 60 °C
0 °C to 50 °C 32 °F to +122 °F
32 °F to +140 °F
Drive current (constant current)
Output span voltage
Offset voltage
1.5 mA.DC
100 40 mV
20 mV
1.0 mA.DC
65 25 mV
1.5 mA.DC
43.5 22.5 mV
15 mV
40 20 mV
Linearity
0.7 %FS 0.3 %FS 0.5 %FS
0.6 %FS 0.2 %FS
0.6 %FS
0.4 %FS
1.0 %FS
1.0 %FS
0.3 %FS
0.7 %FS
Pressure hysteresis
Offset voltage-temperature
15 %FS
5.0 %FS
3.5 %FS
10 %FS
✽4
characteristics
Sensitivity-temperature
10 %FS
2.5 %FS
1.3 %FS
✽4
characteristics
Notes : 1 Unless otherwise specified, measurements were taken with a drive current of 0.01 mA.DC and humidity ranging from 25% to 85%.
✽
2 Please consult us if a pressure medium other than air is to be used.
3 For PS pressure sensor only
✽
✽
✽
✽
4 This is the regulation which applies within the compensation temperature range.
5 Please consult us if the intended use involves a negative pressure.
Reference Data
[PS pressure sensor]
●
Characteristics data
1.-(1) Output characteristics
1.-(2) Offset voltage - temperature
1.-(3) Sensitivity -temperature
characteristics
characteristics
ADP41913
ADP41913
ADP41913
Drive current : 1.0 mA.DC ; temperature : 30 °C 86 °F
Drive current : 1.0 mA.DC; rating 3.5 %FS
Drive current : 1.0 mA.DC; rating 2.5 %FS
4
3
60
50
4
3
40
2
1
2
1
30
20
0
0
−1
−2
−1
−2
10
0
0 32
30 86
Temperature (°C °F)
60 140
0
980.7/2{5}
Pressure(kPa)
980.7{10}
0 32
30 86
Temperature (°C °F)
60 140
●
Pressure cycle range (0 to rated pressure)
Tested sample : ADP41913, temperature : 100 °C 212 °F, No. of cycle: 1×106
Offset voltage range
3
Output span voltage range
3
2
1
2
1
Even after testing for 1 million
times, the variations in the offset
voltage and output span voltage
are minimal.
0
0
−1
−2
−1
−2
−3
−3
0
5×105
Pressure cycle(cycle)
1×106
0
5×105
1×106
Pressure cycle(cycle)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Jul. 2015
Pressure Sensor/PS(ADP4), PF(ADP1)
[PF pressure sensor]
●
Characteristics data
1.-(1) Output characteristics
1.-(2) Offset voltage - temperature
1.-(2) Sensitivity - temperature
characteristics
characteristics
ADP1141
ADP1141
ADP1141
Drive current : 1.5 mA.DC; temperature : 30 °C 86 °F
Drive current : 1.5 mA.DC; rating 5 %FS
Drive current : 1.5 mA.DC; rating 2.5 %FS
4
3
100
80
4
3
60
40
20
0
2
1
2
1
0
0
−1
−2
-1
-2
−20
−40
0 32
30 86
Temperature (°C °F)
60 140
0
49{0.5}
Pressure(kPa)
98.1{1}
0 32
25 77
Temperature (°C °F)
50 122
●
Pressure cycle range (0 to rated pressure)
Tested sample : ADP1131, temperature : 25 °C 77 °F
Offset voltage range
2
Output span voltage range
2
1
Even after testing for 1 million
times, the variations in the offset
voltage and output span voltage
are minimal.
1
0
0
−1
−2
−1
−2
0
1×105
5×105 1×106
0
1×105
5×1051×106
Pressure cycle(cycle)
Pressure cycle(cycle)
Evaluation Test
Classification
Tested item
Tested condition
Result
Temperature : Left in a 120 °C 248 °F constant temperature bath
Storage at high
Passed
Passed
Passed
temperature
Time : 1,000 hrs.
Temperature : Left in a −40 °C –40 °F constant temperature bath
Time : 1,000 hrs.
Temperature/humidity : Left at 40 °C 104 °F, 90 % RH
Time : 1,000 hrs.
Storage at low
temperature
Environmental
characteristics
Humidity
Temperature : –40 °C to 120 °C –40 °F to 248 °F
1 cycle : 30 Min.
Temperature cycle
High temperature/
Passed
Passed
Times of cycle : 100
Temperature/humidity : 40°C 104 °F, 90% RH
Operation times : 106, rated voltage applied.
Double amplitude : 1.5 mm 0.059 inch
Vibration : 10 to 55 Hz
Applied vibration direction : X, Y, Z 3 directions
Times : 2 hrs each
Endurance
characteristics
high humidity operation
Vibration resistance
Passed
Mechanical
characteristics
Dropping height : 75 cm 29.528 inch
Times : 2 times
Pulling strength : 9.8 N {1 kgf}, 10 sec.
Bending strength : 4.9 N {0.5 kgf}, left and right 90 ° 1 time
Temperature : 230 °C 446 °F
Time : 5 sec.
Temperature : 260°C 500 °F
Time : 10 sec.
Dropping resistance
Terminal strength
Passed
Passed
Passed
Passed
Soldered
in DIP soldering bath
Soldering
resistance
Temperature
Note: For details other than listed above, please consult us.
Items
Criteria
Offset valtage
Variation amount
Output span voltage
within 5.0%FS of value
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Jul. 2015
Pressure Sensor/PS(ADP4), PF(ADP1)
Dimensions
The CAD data of the products with a
mark can be downloaded from: http://industrial.panasonic.com/
[PS pressure sensor]
●
Terminal direction : DIP terminal Direction opposite to the pressure inlet direction ADP41□□□
Recommended PC board pattern
(BOTTOM VIEW)
Terminal connection
diagram
7.2
0.283
Pressure
inlet hole
6-f0.9
2
+Output
6-f0.035
f1.1
R2
R1
f0.043
3
+Input
1
−Input
4
f4
f0.157
8.2Max.
0.323Max.
R3
R4
f2.5
f0.098
6
is no connection
5
−Output
2.5
2.5
0.098
0.098
Name
Terminal No.
Power supply (+)
Output (+)
Power supply (–)
Power supply (–)
Output (–)
1
2
3
4
5
6
0.5
0.020
2.5
0.020
2.5
0.020
1
6
2
5
3
4
9.5
0.374
Atmospheric
pressure inlet hole
unit : mm inch
General tolerance : 0.3 0.012
No connection
Note: Leave terminal 6 unconnected.
●
Terminal direction : DIP terminal Pressure inlet direction ADP42□□□
7.2
Recommended PC board pattern
Terminal connection
diagram
0.283
(BOTTOM VIEW)
Pressure
inlet hole
2
5
+Output
9.5
0.374
f4
6-f0.9
6-f0.035
R2
R3
R1
f1.1
f0.043
3
+Input
1
−Input
f0.157
2.5
0.098
2.5
4
f2.5
f0.098
0.098
0.5
R4
6
0.020
is no connection
−Output
Name
Terminal No.
Power supply (+)
Output (+)
Power supply (–)
Power supply (–)
Output (–)
1
2
3
4
5
6
2.5
2.5
0.098
0.098
1
6
2
5
3
4
Atmospheric
pressure inlet hole
8.2Max.
0.323Max.
unit : mm inch
General tolerance : 0.3 0.012
No connection
Note: Leave terminal 6 unconnected.
●
Terminal direction : SMD terminal ADP4932, ADP4933
7.2
0.283
Recommended PC board pattern Terminal connection
(BOTTOM VIEW)
diagram
Pressure
inlet hole
f1.1
1.1
2
+Output
0.043
R2
R3
R1
f0.043
3
f4.0 f0.157
f2.5 f0.098
+Input
1
−Input
4
R4
6
is no connection
5
−Output
Name
Power supply (+)
Output (+)
Power supply (–)
Power supply (–)
Output (–)
Terminal No.
2.5
2.5
1
2
3
4
5
6
0.5 0.020
2.5
0.098
0.5
0.020
0.098
0.098
2.5
10.0
0.394
0.098
1
6
2
5
3
4
Atmospheric
pressure inlet hole
unit : mm inch
General tolerance : 0.3 0.012
No connection
Note: Leave terminal 6 unconnected.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Jul. 2015
Pressure Sensor/PS(ADP4), PF(ADP1)
Dimensions
The CAD data of the products with a
mark can be downloaded from: http://industrial.panasonic.com/
[PF pressure sensor]
●
Terminal direction : DIP terminal Direction opposite to the pressure inlet direction ADP11□□(□)
Recommended PC board pattern
(BOTTOM VIEW)
Terminal connection
diagram
10
0.394
Pressure inlet hole
f0.8 f0.031
Atmospheric
pressure inlet hole
+Input
2
6-f0.9
6-f0.035
R
R
2
R
R
1
1
6
−Output
3
+Output
10.16
0.400
3
4
f3
f0.118
5
2.54
−Input
0.100
5.08
0.200
Tolerance : 0.1
Terminal No.
Name
1
2
3
4
5
6
Output (–)
Power supply (+)
Output (+)
No connection
Power supply (–)
Output (–)
0.5
0.020
1.2
0.047
2.54
0.100
2.54
0.100
6
5
4
unit : mm inch
General tolerance : 0.3 0.012
JAPAN
2
Note: Leave terminal 4 unconnected.
1
3
●
Terminal direction : DIP terminal Pressure inlet direction ADP12□□(□)
Recommended PC board pattern
Terminal connection
diagram
(BOTTOM VIEW)
10
0.394
Pressure inlet hole
f0.8 f0.031
Atmospheric
pressure inlet hole
+Input
2
6-f0.9
6-f0.035
R
R
2
R
R
1
1
6
3
−Output
+Output
3
4
5
f3
f0.118
2.54
2.54
0.100
1.2
0.047
0.5
2.54
0.100
−Input
0.100
5.08
0.200
0.020
Tolerance : 0.1
Terminal No.
Name
1
2
3
4
5
6
Power supply (+)
Output (+)
Power supply (–)
Power supply (–)
Output (–)
10.16
0.400
6
1
5
4
3
No connection
JAPAN
2
unit : mm inch
General tolerance : 0.3 0.012
Note: Leave terminal 4 unconnected.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Jul. 2015
Pressure Sensor/PS(ADP4), PF(ADP1)
NOTES
9) After soldering, prevent chemical agents from adhering to the
sensor when applying coating to avoid insulation deterioration of
■ Mounting
Use the land of the printed-circuit board on which the sensor is
securely fixed.
the circuit board.
10) Please consult us concerning leadfree soldering.
■ Soldering
■ Cleaning
Avoid the external thermal influence as the product has a limited
thermal capacity due to its compact structure. Heat deformation
may damage the sensor or deteriorate its performance. Use the
non-corrosive rosin flux. Prevent the flux from entering into the
inside of the product as the sensor is exposed to the atmosphere.
• Prevent cleaning liquid from enteringthe inside of the product as
the sensor isexposed to the atmosphere.
• Do not perform ultrasonic cleaning in order to prevent
damages to the product.
1) Manual soldering
• Raise the temperature of the soldering tip between 260 and
300 °C 500 and 572 °F (30 W) and solder within 5 seconds.
• The sensor output may vary if the load is applied on the
terminal during soldering.
■ Environment
1) Avoid use and storage in the corrosive gas (organic solvent,
sulfurous acid and hydrogen sulfide gases) which negatively
affects the product.
• Keep the soldering tip clean.
2) Avoid use in a place where these products come in contact
2) DIP soldering (DIP Terminal)
with water as the sensor does not have
construction.
a splash-proof
• Keep the temperature of the DIP solder tank below 260 °C
500 °F and solder within 5 seconds.
3) Avoid use in an environment where these products cause dew
condensation.
When water attached to the sensor chip freezes, the sensor
output may be fluctuated or damaged.
4) Due to the structure of the pressure sensor chip, the output
varies under light.
Do not expose the sensor chip to light when applying a voltage
by using a transparent tube.
5) Do not apply high-frequency oscillation, such as ultrasonic
waves, to the product.
• To avoid heat deformation, do not perform DIP soldering
when mounting on the circuit board which has a small
thermal capacity.
3) Reflow soldering (SMD Terminal)
• The recommended reflow temperature profile conditions are
given below.
Main heating
230 °C
446 °F
Preheating
150 °C
302 °F
With in
10 sec.
■ Quality check under actual use conditions
With in 60 sec.
Time
These specifications are for individual components.
Before use, carefully check the performance and quality
under actual use conditions to enhance stability.
• We recommend the screen solder printing method as the
method of cream.
• Please refer to the recommended PC board specification
diagram for the PC board foot pattern.
• Self alignment may not always work as expected, therefore,
please carefully the position of the terminals and pattern.
• The temperature of the profile is assumed to be a value
measured with the printed wiring board of the terminal
neighborhood.
• Please evaluate solderbility under the actual mounting
conditions since welding and deformation of the pressure
inlet port may occur due to heat stress depending on
equipments or conditions.
■ Other precautions
1) The wrong mounting method and the pressure range may invite
the risk of accidents.
2) Only applicable pressure medium is dry air. Avoid use in the
corrosive gas (organic solvent, sulfurous acid and hydrogen
sulfide gases) or other mediums containing moisture or foreign
substances. Such mediums may damage or break the product.
3) The pressure sensor chip is located inside the pressure
introduction port. Do not insert foreign substances, such as
wires, into the port as those substances may damage the chip
and close the port. Do not block the atmosphere introduction
port.
4) Use electric power within the rated power range. Use beyond
the range may damage the product.
5) Follow below instructions as static electricity may damage the
product:
4) Rework soldering
• Complete rework at a time.
• Use a flattened soldering tip when performing rework on the
solder bridge. Do not add the flux.
• Keep the soldering tip below the temperature described in
the specifications.
5) Avoid drop and rough handling as excessive force may deform
the terminal and damage soldering characteristics.
6) Keep the circuit board warpage within 0.05 mm of the full width
of the sensor.
7) After soldering, do not apply stress on the soldered part when
cutting or bending the circuit board.
8) Prevent human hands or metal pieces from contacting with the
sensor terminal.
(1) For Storage, short the circuit between terminals by using
conductive substances or wrap the whole chip with aluminum
foil. For storage and transportation, avoid plastic containers
which are easily electrified.
(2) Before use, connect electrified materials on desk and
operators to the ground in order to safely discharge static
electricity.
6) Carefully select and fix tubes, introduction pipes and products based
on the working voltage. Please contact us for any inquires.
Such contact may cause anomalous outlets as the terminal is
exposed to the atmosphere.
APPLICATION CIRCUIT DIAGRAM (EXAMPLE)
Constant current
circuit unit
Amplifier circuit unit
The pressure sensor converts a voltage by constant
current drive and if necessary, amplifies the voltage.
Pressure
sensor
OP
AMP
The circuit on the right is a typical use example.
OP
AMP
OP
AMP
MOUNTING METHOD
The general method of air pressure transmission varies depending
on the low/high pressure condition.
When the pressure is low
(4.9k Pa to 98.1 kPa)
When the pressure is high
Methods
of transmitting
air pressures
(196.1 kPa to 980.7 kPa)
PC board
PC board
• Usage note
O-ring
Pressure
inlet pipe
(1) Select a study pressure introduction pipe to avoid pressure leak.
(2) Securely fix the pressure introduction pipe to avoid pressure leak.
(3) Do not block the pressure introduction pipe.
Tube
If a tube is used as the pressure inlet pipe,
it may become disengaged. Use a sturdy
tube and secure it using O-rings.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Jul. 2015
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