AMG8833 [PANASONIC]
Infrared Array Sensor Grid-EYE;
| 型号： | AMG8833 |
| 厂家： | 
PANASONIC |
| 描述： | Infrared Array Sensor Grid-EYE |
| 文件： | 总6页 (文件大小：158K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Infrared Array Sensor Grid-EYE (AMG88)
Infrared Array Sensor
Grid-EYE
High Precision Infrared Array Sensor based on Advanced MEMS Technology
Features
●
Temperature detection of two-dimensional area: 8 × 8 (64 pixels)
Digital output (capability of temperature value output)
Compact SMD package (adaptively to reflow mounting)
RoHS compliant
●
●
●
Typical applications
●
High function home appliances (microwaves and air-conditioners)
Energy saving at office (air-conditioning/lighting control)
Digital signage
Automatic doors/elevators
●
●
●
Ordering information
AMG 8 8
Vertical pixel
8: 8 pixels
Horizontal pixel
8: 8 pixels
Applied voltage
Applied voltage
:
:
:
:
3
5
3.3 V.DC
5.0 V.DC
3
4
High performance type High gain
High performance type Low gain
Types
Tape and reel package : 1,000 pcs.
Product name
Number of pixel
Operating voltage
3.3 V.DC
Amplification factor
Part number
High performance type
High gain
AMG8833
High performance type
Low gain
Infrared array sensor
Grid-EYE
High performance
type
AMG8834
AMG8853
AMG8854
64
(Vertical 8 × Horizontal 8 Matrix)
High performance type
High gain
5.0 V.DC
High performance type
Low gain
Rating
Performance
Item
High gain
Low gain
Applied voltage
3.3 V.DC 0.3 V.DC or 5.0 V.DC 0.5 V.DC
Temperature range of measuring object
Operating temperature range
Storage temperature range
0 °C to 80 °C +32 °F to +176 °F
0 °C to 80 °C +32 °F to +176 °F
−20 °C to 80 °C –4 °F to +176 °F
−20 °C to 100 °C –4 °F to +212 °F
−20 °C to 80 °C –4 °F to +176 °F
−20 °C to 80 °C –4 °F to +176 °F
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Apr. 2017
Infrared Array Sensor Grid-EYE (AMG88)
Absolute maximum ratings
Item
Applied voltage
Input voltage
Output sink current
Static electricity (Human body model)
Static electricity (Machine model)
Absolute maximum ratings
−0.3 V.DC to 6.5 V.DC
−0.3 V.DC to VDD +0.3 V.DC
−10 mA to 10 mA
1 kV
Terminal
VDD
SCL, SDA, AD_SELECT
INT, SDA
All terminals
All terminals
200 V
Characteristics
Performance
Item
High performance type
High gain
High performance type
Low gain
Temperature accuracy
Typical 2.5 °C 4.5 °F
Typical 3.0 °C 5.4 °F
✽1
Human detection distance
7 m or less (reference value) 22.966 ft
Typ. 0.05 °C 32.900 °F 1 Hz
Typ. 0.16 °C 32.288 °F 10 Hz
✽2
NETD
Viewing angle
Typical 60 °
Optical axis gap
Within Typical 5.6 °
Typical 4.5 mA (normal mode)
Typical 0.2 mA (sleep mode)
Typical 0.8 mA (stand-by mode)
Current consumption
Typical 50 ms (Time to enable communication after setup)
Typical 15 s (Time to stabilize output after setup)
Setup time
Note: 1 To have more than 4 °C 7.2 °F of temperature difference from background
✽
Detection object size: 700 × 250 mm 27.559 × 9.843 inch (Assumable human body size)
2 It is calculated from 4 pixels of centers.
✽
Performance
Item
Performance
Number of pixel
External interface
Frame rate
64 (Vertical 8 × Horizontal 8 Matrix)
I2C (fast mode)
Typical 10 frames/sec or 1 frame/sec
Normal
Sleep
✽1
Operating mode
Stand-by (10 sec or 60 sec intermittence)
Output mode
Calculate mode
Temperature output resolution
Number of sensor address
Thermistor output temperature range
Thermistor output resolution
Temperature output
No moving average or Twice moving average
0.25 °C 32.45 °F
2 (I2C slave address)
−20 °C to 80 °C –4 °F to +176 °F
0.0625 °C 32.1125 °F
Note: 1 Normal Mode : normal operation mode; Sleep Mode: detection is off (output and data reading not possible); Standby Mode: 1 frame measuring
✽
intermittently every 10 or 60 sec.
Internal circuit
3.3 V.DC or 5 V.DC
Infrared array sensor
Sensor chip
SDA
2
VDD
ROM
9
SCL
I2C I/F
3
Selector
Control
AD_SELECT
INT
Capacitor
10 μF
5
4
Gain
amp
ADC
GND
6
Thermistor
GND
INT terminal
normally has same voltage as VDD. When interrupting, same as GND (0V)
✽
4
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Apr. 2017
Infrared Array Sensor Grid-EYE (AMG88)
Pixel array and viewing field
(1) Pixel array
(2) Viewing field
Pixel array from 1 to 64 is shown below.
Sensor viewing field (typical) is shown below.
64 63 62 61 60 59 58 57
56 55 54 53 52 51 50 49
48 47 46 45 44 43 42 41
40 39 38 37 36 35 34 33
32 31 30 29 28 27 26 25
24 23 22 21 20 19 18 17
Horizontal viewing angle 60°
16 15 14 13 12 11 10
9
1
8
7
6
5
4
3
2
Optical properties
(1) Each pixel’s viewing central angle
(2) Each pixel’s viewing angle (half angle)
Central 4 pixels (Pixel No. 28, 29, 36, 37) viewing
angle (half angle): horizontal direction 7.7 ° (Typical)
vertical direction 8 ° (Typical)
Sensor’s optical center (the origin of graph below)
gap: within 5.6 ° (Typical) (Both horizontal and
vertical directions)
40
30
20
15
10
20
15
20
10
10
5
5
0
0
−20
−10
0
10
20
30
40
−40 −30
0
1
5
9
13 17 21 25 29 33 37 41 45 49 53 57 61
Pixel number
1
5
9
13 17 21 25 29 33 37 41 45 49 53 57 61
Pixel number
−10
−20
−30
−40
Horizontal viewing central angle (° )
Dimensions
External dimensions
Recommended
PC board pad
Lens
Number Terminal Name
Number Terminal Name
11.0 0.05
□
8
2.6 0.102
2.0
0.079
0.433 0.002
NC
SDA
SCL
INT
NC
N
1
2
3
4
5
6
7
8
9
J
K
L
M
N
VDD
P
51
AVDD-PC
NC
AD_SELECT
GND
NC
DVDD-PC
VPP
1
7
✽
Four corners
11.6
0.457
Part No.
10-0.7
4-0.8
(AMG88 is omitted)
Lot No.
4-0.031
10-0.028
NC
P1.27 0.05×4=5.08
P0.050 0.002×4=0.200
8.9
Note : Leave terminal “NC (No.1,7,8,K and N)”
unconnected.
0.350
Make electrical potential of terminals 9 and
M the same.
14-0.5
1
N
14-0.0207
8
P1.27×4
P0.050×4
10.9
General tolerance : 0.2 0.08
unit : mm inch
0.429
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Apr. 2017
Infrared Array Sensor Grid-EYE (AMG88)
External circuit
(1) In case of setting I2C slave address of the sensor 1101000
(2) In case of setting I2C slave address of the sensor 1101001
✽ Connect terminal 5 (AD_SELECT) to GND.
✽ Connect terminal 5 (AD_SELECT) to VDD.
VDD
VDD
MVPP
LDVDD-PC
2SDA
3SCL
4INT
AD_SELECT
6GND
MVPP
LDVDD-PC
2SDA
3SCL
4INT
To microcomputer etc.
To microcomputer etc.
To microcomputer etc.
To microcomputer etc.
To microcomputer etc.
To microcomputer etc.
JAVDD-PC
9VDD
JAVDD-PC
9VDD
5
5
AD_SELECT
6GND
1.5 ꢁF 10ꢀ
1.5 ꢁF 10ꢀ
10 ꢁF 20ꢀ
10 ꢁF 20ꢀ
GND
GND
This circuit is an example to drive infrared array sensor “Grid-EYE”, so that we will not take any responsibility of loss
which is due to this circuit.
Packing format (Tape and reel)
Tape dimensions
Dimensions of tape reel
16.0 0.3
21.5 1.0
0.846 0.039
0.630 0.012
7.5 0.1
17.5 1.0
0.689 0.039
1.75 00.0.014
0.295 0.004
0.069
0.35 0.05
0.014 0.020
Top cover tape
Embossed carrier tape
13 0.2 dia.
0.512 0.08 dia.
9.0 0.1
0.354 0.004
4.7 0.1
0.185 0.004
unit : mm inch
Notes
4) Vibrations and shocks may damage the sensor, and
cause malfunction and performance deterioration.
If loads and shocks are applied on the lense,
the damaged sensor may cause malfunction and
performance deterioration.
5) The product is not water/splash-proof. Perform
water/dust-proofing and dew condensation/
freezing countermeasures in accordance with use
environment. When dew condensation occurs,
responsiveness of heat source detection may delay
for several seconds.
6) Avoid use and storage in the corrosive gas (organic
solvent, sulfurous acid and hydrogen sulfide gases)
to avoid malfunction and performance deterioration.
7) Use surge absorbers as applying the external surge
voltage may damage the internal circuit.
8) Malfunction may occur near electric noises from
static electricity, lightning, broadcast or amateur radio
stations and mobile phones.
■ Precaution for fundamental structure of sensor
Infrared Array Sensor is a thermopile type infrared
sensor which detects the amount of infrared rays. Below
conditions generally degrade the temperature accuracy.
Carefully check the performance and stability under
actual use conditions, and perform temperature
corrections when necessary.
• When heating elements exist near the mounting
position of the sensor.
• When the sensor is exposed to cold or hot air.
• When the temperature of the sensor body rapidly
changes.
• When substances (e.g., glasses, acrylics or steams),
which hardly transmit a far infrared ray, exist
between the sensor and the detected object.
• When substances (e.g., foreign substances or
water), which hardly transmit a far infrared ray,
adhere to the lense of the sensor.
9) The sensor can continuously operate within the
range of using ambient temperature (using ambient
humidity). However, ensure that humidity is within the
range described in the following page as humidity
varies according to temperature. Avoid the continuous
operation near the operational limit. The temperature
range does not guarantee the durability.
■ Use environment
1) Temperature: See the specifications
2) Humidity: Between 15ꢀ and 85ꢀ R.H. (Avoid
freezing and dew condensation)
3) Atmospheric pressure: Between 86 and 106 kPa
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Apr. 2017
Infrared Array Sensor Grid-EYE (AMG88)
■ Other precautions
■ Mounting
These specifications are for individual components.
Before use, carefully check the performance and quality
under actual use conditions to enhance stability.
1) Once the individual sensor is dropped, do not
use. Drop may cause functional disorders.
2) Writing to the unspecified register/with the
unspecified bit may cause malfunction and
performance deterioration. (please consult us)
3) Misconnection and use beyond the specified
temperature range may damage the product.
4) Once below shocks are applied, do not
use the product as applying highfrequency
oscillation to the sensor body may damage the
product.
Use the land of the printed-circuit boardon which
the sensor is securely fixed. The recommended
printed-circuit board is FR4 (thickness 1.6 mm 0.063
inch). When mounting on the deprecated circuit
board, carefully check the performance and quality
under actual use conditions before use.
• A large noise on the power supply may cause
malfunction. Place the recommended capacitor near
the sensor (within 20 mm 0.787 inch of the wiring
pattern length) between sensor input terminals
(VDD-GND) to secure power superimposed noise
resistance. Test with the actual machine and re-
select the capacitor with optimal capacitance.
• Prevent the metal part of other electronic
components from contacting with the sensor
body as the upper face (where part numbers are
imprinted) of the sensor is GND.
• Contact with metal objects
• Contact with other sensors
5) Follow the instructions below as static
electricity may damage the product.
• For storage and transportation, avoid plastic
containers which are easily electrified.
• When storing and transporting the sensor,
choose the environment where static
electricity is hardly generated (e.g., humidity
between 45 and 60 ꢀ) and protect
the product by using electroconductive
packaging materials.
■ Soldering
When soldering, avoid the external thermal influence.
Heat deformation may damage the sensor or deteriorate
its performance. Use the non-corrosive rosin flux.
1) Manual soldering
• Raise the temperature of the soldering tip
between 350 and 400 °C 662 and 752 °F
(30 and 60 W) and solder within 3 seconds.
• The sensor output may vary if the load is
applied on the terminal during soldering.
• Keep the soldering tip clean.
• Once unpacked, perform antistatic
countermeasures.
(1) Operators handling sensors must wear
antistatic cloths and human body
grounding devices.
(2) Cover the surface of workbench by
electro-conductive plates and ground
measuring instruments and jigs.
(3) Use the soldering iron which has a small
leakage current or ground the soldering
tip.
(4) Ground the assembling equipment.
• Use a stabilized power supply. A power
superimposed noise may cause malfunction.
2) Reflow soldering
Below are recommended temperature profiles/
conditions of reflow.
• When printing cream solder, the screen
printing method is recommended.
• For the foot pattern, see the recommended
diagram of the printed-circuit board.
• Carefully align the terminal with the pattern
as self-alignment may not be reliable.
• The temperature of the profile is the value
measured near the terminal on the printed-
circuit board.
■ Range of using ambient temperature (using
• After reflowing, when performing reflow
soldering on the back surface of the circuit
board, use an adhesive to fix the board.
ambient humidity)
The sensor can continuously operate within the range
of using ambient temperature (using ambient humidity).
However, ensure that humidity is within the range below
as humidity varies according to temperature. Avoid the
continuous operation near the operational limit. Before
use, check the stability under the usage environment
as high humidity or high temperatures generally
accelerates deterioration of the electronic component.
• The temperature range does not guarantee the
durability
T3
T1 = 150 to 180 °C
T2
302 °F to 356 °F
T1
T2 = 230 °C 446 °F
T3 = Below 250 °C 482 °F
t1 = 60 to 120 sec.
t2 = Less than 30sec.
t1
t2
3) After soldering, do not apply stress on the
soldered part when cutting or bending the
circuit board.
High gain type
Low gain type
Humidity (ꢀRH)
Humidity (ꢀRH)
4) Rework soldering
• Complete rework at a time.
85
85
•
Use a flattened soldering tip when performing
rework on the solder bridge. Do not add the flux.
Tolerance range
Tolerance range
(Avoid freezing
at 0 °C 32 °F
or below)
(Avoid freezing
at 0 °C 32 °F
or below)
(Avoid dew
condensation at
0 °C 32 °F or below)
• Keep the soldering tip below the temperature
described in the specifications.
(Avoid dew
condensation)
15
15
5) Prevent human hands or metal pieces from
contacting with the sensor terminal. Such
contact may cause anomalous outlets as the
terminal is exposed to the atmosphere.
−20
0
80
−20
−4 +32
Temperature (°C, °F)
0
80
−4 +32
+176
+176
Temperature (°C, °F)
6) After soldering, prevent chemical agents from
adhering to the sensor when applying coating to
avoid insulation deterioration of the circuit board.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Apr. 2017
Infrared Array Sensor Grid-EYE (AMG88)
3) A warranty period is one year after the delivery
to your company. Quality assurance is limited
■ Wire connection
1) Correctly wire as in the connection diagram.
Reverse connection may damage the product
and degrade the performance.
2) Do not use idle terminals. Such use may damage
the sensor.
3) For cable wiring, use shield wires with possibly short
wiring lengths to prevent the influence of the noise.
to the items and the scopes described in the
specifications.
If a defect is found after the delivery, we will
promptly provide a replacement or change/
repair the defect part at the place of delivery
in good faith. Exceptions are below.
• Damages by a failure or a defect which
arose after the delivery.
• After the delivery, when storing and
transporting, if conditions other than
conditions in the specifications are applied to
the product.
• Damages by unforeseen phenomenon which
cannot be predicted with the technologies
available at the time of delivery.
• Damages by natural and anthropogenic
disasters, such as earthquake, flood, fire
and war, which are beyond our reasonable
control.
■ Cleaning
Avoid ultrasonic cleaning as this may cause
disconnection of the wire.
■ Storage and transportation
1) Excessive vibrations and shocks during transport
may damage the product. Carefully handle the
exterior box and the reel.
2) Extremely bad storage conditions may deteriorate
solderability or characteristics, and defect the
appearance. Recommended conditions of the
storage place are below.
• Temperature: 0 to 45 °C 32 to 113 °F
• Humidity: Below 70 ꢀ R.H.
• Atmosphere: Low-dust and free from noxious
chemicals such as sulfurous acid gas
3) The package is moisture-proof due to its
sensitivity to humidity. When storing the sensor,
follow the instructions below.
• Promptly use after opening. (within a week,
below 30 °C 86 °F/60 ꢀ R.H.)
• Once unpacked, preserving in a moisture-
proof manner, such as keeping in a
moisture-proof bag with silica gels, is
recommended for long-term storage. (use
within 3 months)
✽ During soldering, when adding thermal stress
in a moisture absorbing state, moisture
evaporates, swells and generates stress to
the internal package. To avoid swellings and
cracks in the surface of the package, follow
the soldering conditions.
■ Special notes
We exert maximum efforts for quality control of the
product, however :
1) To prevent occurrence of unexpected
circumstances, please inform us of the
specifications of your product, customers, use
conditions and details of the attachment position.
2) Have sufficient margin values of driving/
performance guarantee described in the
specifications and apply safety measures with
double circuits, if serious effects on human
lives or property are predicted due to a quality
failure of the product. Those countermeasures
are also for the product liability.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Apr. 2017
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