AN26024A [PANASONIC]
Ultra small, Single Band LNA-IC for 2.4 GHz Band Applications; 超小型，单波段LNA - IC，适用于2.4 GHz频带应用
| 型号： | AN26024A |
| 厂家： | 
PANASONIC |
| 描述： | Ultra small, Single Band LNA-IC for 2.4 GHz Band Applications |
| 文件： | 总11页 (文件大小：337K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AN26024A
Ultra small, Single Band LNA-IC for 2.4 GHz Band Applications
FEATURES
DESCRIPTION
• Low voltage operation
• Low current consumption
+3.3 V typ.
AN26024A is a single band LNA (Low Noise Amplifier)-
IC for 2.4 GHz Band applications.
Realizing high performance by using 0.18 µm SiGeC
Bi-CMOS process (fT = 90 GHz, fmax = 140 GHz).
8.0 mA typ.
(High-Gain mode)
(Low-Gain mode)
(High-Gain mode)
(High-Gain mode)
30 µA typ.
High/Low Gain-mode is changeable, controlled by
integrated CMOS logic circuit.
• High gain
17.0 dB typ.
• Low noise figure 0.9 dB typ.
• Low distortion
Achieving miniaturization by using small size Wafer
Level Chip Size Package (WLCSP).
+4.0 dBm typ. (High-Gain mode)
• 5 pin Wafer level chip size package (WLCSP)
APPLICATIONS
zWLAN／WiMAX
SIMPLIFIED APPLICATION
RF output
50 Ω
Components
Size
0603
0603
0603
Value
5.1 nH
4.7 nH
Part Number
Vendor
Murata
Murata
L2
L1
L2
C1
C2
LQP03TN5N1H04
LQP03TN4N7H04
VCC
1 000 pF GRM033B11C102KD01 Murata
A3
A2
A1
B3
B1
C2
0603 100 000 pF GRM33B30J104KE18 Murata
TOP VIEW
Notes) This application circuit is an example. The operation of mass
production set is not guaranteed. You should perform enough
evaluation and verification on the design of mass production
set. You are fully responsible for the incorporation of the
above application circuit and information in the design of your
equipment.
CNT
(Gain cnt)
C1
L1
RF input
50 Ω
Ver. CEB
Publication date: February 2013
1
AN26024A
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply voltage
Symbol
Rating
3.7
Unit
V
Note
*1
VCC
Supply current
ICC
18
mA
°C
°C
°C
V
—
*2
Operating ambient temperature
Operating junction temperature
Storage temperature
Topr
–40 to +85
-40 to +125
–55 to +125
—
Tj
Tstg
*2
*2
IN (Pin No.A1)
*3
Input Voltage Range
ESD
CNT (Pin No.B1)
OUT (Pin No.A3)
-0.3 to VCC
-0.3 to VCC
2
V
—
—
—
V
HBM (Human Body Model)
kV
Notes). This product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rating.
This rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated
recommended operating range.
When subjected under the absolute maximum rating for a long time, the reliability of the product may be affected.
*1:The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*2:Except for the operating ambient temperature, operating junction temperature and storage temperature,
all ratings are for Ta = 25°C.
*3:RF signal input pin. Do not apply DC. Do not apply more than 0 dBm to RF input.
POWER DISSIPATION RATING
PACKAGE
θ JA
PD (Ta=25 °C)
PD (Ta=85 °C)
WLCSP
1391℃/W
0.072 W
0.029 W
Note). For the actual usage, please refer to the PD-Ta characteristics diagram in the package specification, supply
voltage, load and ambient temperature conditions to ensure that there is enough margin follow the power and
the thermal design does not exceed the allowable value.
CAUTION
Although this has limited built-in ESD protection circuit, but permanent damage may occur on it.
Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS gates
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply voltage range
Symbol
Min.
Typ.
Max.
Unit
Note
VCC
3.0
3.3
3.6
V
*1
Note) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
Ver. CEB
2
AN26024A
ELECRTRICAL CHARACTERISTICS
Note). Ta = 25°C 2°C,
VCC = 3.3 V
Limits
Parameter
Symbol
Condition
Unit Note
Min
Typ
Max
DC electrical characteristics
VCC current at High-Gain
mode, No input signal
Supply current HG
ICC
H
—
—
8
11
90
mA
—
—
VCC current at Low-Gain
mode, No input signal
Supply current LG
I
CCL
30
μA
Input voltage (High-Gain mode)
Input voltage (Low-Gain mode)
VIH
VIL
—
—
1.48
0
—
—
3.6
0.6
V
V
—
—
Current at CNT pin
VIH = VCC
SW current (High)
IIH
—
30
45
μA
—
ELECRTRICAL CHARACTERISTICS (continued)
Note). Ta = 25°C 2°C,
VCC = 3.3 V,
fRX = 2.442 GHz, PRX = –30 dBm, CW unless otherwise specified.
Limits
Typ
Parameter
Symbol
Condition
Unit Note
Min
Max
AC electrical characteristics
Power Gain HG
GHS
GLS
High-Gain mode
15.5
–9
17.0
–7
18.5
–5
dB
dB
—
—
Low-Gain mode
PRX = –20 dBm
Power Gain LG
High-Gain mode
IIP3
f1 = fRX – 10 MHz
f2 = fRX – 20 MHz
Input 2 signals (f1, f2)
IIP3H1S
–1
4
—
dBm
—
–10 MHz offset HG
Ver. CEB
3
AN26024A
APPLICATION INFORMATION
REFERENCE VALUES FOR DESIGN
Note). Ta = 25°C 2°C,
VCC = 3.3 V,
fRX = 2.4 GHz, 2.442 GHz, 2.484 GHz, PRX = –30 dBm, CW unless otherwise specified.
Reference values
Parameter
Symbol
Condition
Unit Note
Min
Typ
Max
AC electrical characteristics
Power Gain HG
GH
GL
High-Gain mode
15.5
–9
17
–7
18.5
–5
dB
dB
*1
*1
Low-Gain mode
PRX = –20 dBm
Power Gain LG
Noise Figure HG
Noise Figure LG
NFH
NFL
High-Gain mode
Low-Gain mode
—
—
1.0
7
1.4
9.5
dB *1,*2
dB *1,*2
High-Gain mode
IIP3
f1 = fRX – 10 MHz
f2 = fRX – 20 MHz
Input 2 signals (f1, f2)
IIP3H1
IIP3H2
–1
4
—
dBm
*1
–10 MHz offset HG
High-Gain mode
IIP3
f1 = fRX + 10 MHz
f2 = fRX + 20 MHz
Input 2 signals (f1, f2)
–1
–20
10
4
—
—
—
dBm
dBm
dBm
*1
*1
*1
+10 MHz offset HG
Input P1dB HG
IP1dBH High-Gain mode
Low-Gain mode
–13
24
IIP3
f1 = fRX
IIP3L
+100 kHz offset LG
f2 = fRX + 100 kHz
Input 2 signals (f1, f2)
Input P1dB LG
IP1dBL
ISOH
ISOL
Low-Gain mode
High-Gain mode
Low-Gain mode
High-Gain mode
Low-Gain mode
High-Gain mode
Low-Gain mode
0
30
5
8
36
7
—
—
—
—
—
—
—
dBm
dB
dB
dB
dB
dB
dB
*1
*1
*1
*1
*1
*1
*1
Reverse Isolation HG
Reverse Isolation LG
Input Return Loss HG
Input Return Loss LG
Output Return Loss HG
Output Return Loss LG
S11H
S11L
S22H
S22L
8.5
4
14
5
8.5
6.5
12
10
Note) *1 : Checked by design, not production tested.
*2 : RF input Connector & substrate loss (0.09 dB) included.
Ver. CEB
4
AN26024A
APPLICATION INFORMATION (continued)
REFERENCE VALUES FOR DESIGN (continued)
Note). Ta = -40°C to 85°C,
VCC = 3.0 to 3.6 V ,
Reference values
Parameter
Symbol
Condition
Unit Note
Min
Typ
Max
DC electrical characteristics
VCC current at High-Gain mode
No input signal
Supply current HG
I
CCHT
—
—
—
8
12.7 mA
*1
*1
*1
VCC current at Low-Gain mode
No input signal
Supply current LG
SW current (High)
ICCLT
IIHT
30
30
100
51
μA
μA
Current at CNT pin
VIH = VCC
Note) *1 : Checked by design, not production tested.
Ver. CEB
5
AN26024A
APPLICATION INFORMATION (continued)
REFERENCE VALUES FOR DESIGN (continued)
Note). Ta = -40°C to 85°C,
VCC = 3.0 to 3.6 V ,
fRX = 2.4 GHz, 2.442 GHz, 2.484 GHz, PRX = –30 dBm, CW unless otherwise specified
Reference values
Parameter
Symbol
Condition
Unit Note
Min
Typ Max
AC electrical characteristics
Power Gain HG
GHTa
GLTa
High-Gain mode
14.3
–9.8
17
19.8 dB
–4.5 dB
*1
*1
Low-Gain mode
PRX = –20 dBm
Power Gain LG
–7
Noise Figure HG
Noise Figure LG
NFHTa High-Gain mode
—
—
1.0
7
2.0
dB *1,*2
NFLTa
Low-Gain mode
10.2 dB *1,*2
High-Gain mode
IIP3
f1 = fRX – 10 MHz
f2 = fRX – 20 MHz
Input 2 signals (f1, f2)
IIP3H1Ta
–2.3
–2.3
4
4
—
dBm *1
–10 MHz offset HG
High-Gain mode
IIP3
f1 = fRX + 10 MHz
f2 = fRX + 20 MHz
Input 2 signals (f1, f2)
IIP3H2Ta
—
—
dBm *1
dBm *1
+10 MHz offset HG
Input P1dB HG
P1dBHTa High-Gain mode
–23.6 –13
Note) *1 : Checked by design, not production tested.
*2 : RF input Connector & substrate loss (0.09 dB) included.
Ver. CEB
6
AN26024A
PIN CONFIGURATION
Top View
OUT
GND
IN
VCC
A3
A2
A1
B3
B1
CNT
PIN FUNCTIONS
Pin No. Pin name
Type
Input
Description
A1
A2
A3
IN
RF Input
GND
GND
OUT
Ground
Output
RF Output
High-Gain/Low-Gain switch
L: Low-Gain Mode
B1
B3
CNT
VCC
Input
H: High-Gain Mode
Power Supply VCC
FUNCTIONAL BLOCK DIAGRAM
Top View
A3
A2
A1
B3
B1
Notes) ・This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified.
Ver. CEB
7
AN26024A
PACKAGE INFORMATION ( Reference Data )
Package Code:ALGA005-W-0609ANA
Unit:mm
Body Material : Br/Sb Free Epoxy Resin
Reroute Material : Cu
Bump : SnAgCu
Ver. CEB
8
AN26024A
IMPORTANT NOTICE
1.The products and product specifications described in this book are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore,
ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your
requirements.
2.When using the LSI for new models, verify the safety including the long-term reliability for each product.
3.When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book
4.The technical information described in this book is intended only to show the main characteristics and application
circuit examples of the products. No license is granted in and to any intellectual property right or other right
owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company
as to the infringement upon any such right owned by any other company which may arise as a result of the use of
technical information de-scribed in this book.
5.This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of
our company.
6.This LSI is intended to be used for general electronic equipment [2.4 GHz Band Applications].
Consult our sales staff in advance for information on the following applications: Special applications in which
exceptional quality and reliability are required, or if the failure or malfunction of this LSI may directly jeopardize
life or harm the human body.
Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in
connection with your using the LSI described in this book for any special application, unless our company agrees
to your using the LSI in this book for any special application.
7.This LSI is neither designed nor intended for use in automotive applications or environments unless the specific
product is designated by our company as compliant with the ISO/TS 16949 requirements.
Our company shall not be held responsible for any damage incurred by you or any third party as a result of or in
connection with your using the LSI in automotive application, unless our company agrees to your using the LSI in
this book for such application.
8.If any of the products or technical information described in this book is to be exported or provided to non-residents,
the laws and regulations of the exporting country, especially, those with regard to security export control, must be
observed.
9. Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances, including without limitation, the EU RoHS Directive. Our company shall not be held
responsible for any damage incurred as a result of your using the LSI not complying with the applicable laws and
regulations.
Ver. CEB
9
AN26024A
USAGE NOTES
1. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed
operating conditions (operating power supply voltage and operating environment etc.). Especially, please be
careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off
and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as
redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical
injury, fire, social damages, for example, by using the products.
2. Comply with the instructions for use in order to prevent breakdown and characteristics change due to external
factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's
process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf
life and the elapsed time since first opening the packages.
3. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board),
it might smoke or ignite.
4. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit
between pins. In addition, refer to the Pin Description for the pin configuration.
5. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems
such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical verification
on the assembly quality, because the same damage possibly can happen due to conductive substances, such
as solder ball, that adhere to the LSI during transportation.
6. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs
such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin
short (load short) .
And, safety measures such as an installation of fuses are recommended because the extent of the above-
mentioned damage and smoke emission will depend on the current capability of the power supply.
7. Due to unshielded structure of this LSI, under exposure of light, function and characteristic of the product cannot
be guaranteed. During normal operation or even under testing condition, please ensure that LSI is not exposed
to light.
8. Basically, chip surface is ground potential. Please design to ensure no contact between chip surface and metal
shielding.
Ver. CEB
10
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
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